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DM355SZCEA216

Texas Instruments

DM355SZCEA216 by Texas Instruments

The Texas Instruments DM355SZCEA216 is a 32-bit microprocessor with 337 terminals, operating at temperatures from -40 to 100°C. It has a max supply voltage of 1.365V and RAM capacity of 32768 words. Ideal for industrial applications requiring high processing power in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,024 parts In-Stock

1+ parts

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5,024

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Digiode

USA . 4,041 parts In-Stock

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4,041

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 207 parts In-Stock

1+ parts

$10.000

100+ parts

-

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207

$10.000

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AZTECH Wire

Italy . 537 parts In-Stock

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$10.368

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537

$10.368

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Native Components

USA . 117 parts In-Stock

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$15.351

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117

$15.351

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Northwest PG Solutions

USA . 1,049 parts In-Stock

1+ parts

$16.886

100+ parts

$15.197

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1,049

$16.886

$15.197

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Corohmni

South Africa . 2,374 parts In-Stock

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$62.780

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2,374

$62.780

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Parana Technologies

USA . 2,219 parts In-Stock

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$65.349

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2,219

$65.349

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DigiPath Technology Company

USA . 2,159 parts In-Stock

1+ parts

$71.957

100+ parts

$66.201

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2,159

$71.957

$66.201

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ChromeModa Solutions

Germany . 1,327 parts In-Stock

1+ parts

$73.426

100+ parts

$60.209

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1,327

$73.426

$60.209

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IDEA Electronic Components Group

UK . 483 parts In-Stock

1+ parts

$73.426

100+ parts

$69.755

1k+ parts

$66.083

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483

$73.426

$69.755

$66.083

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Corphita

USA . 858 parts In-Stock

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858

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Microchip USA

USA . 468 parts In-Stock

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468

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Overview

Experience unmatched performance and reliability with the DM355SZCEA216 by Texas Instruments, a leading manufacturer in the industry. This cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering versatile applications for various electronic devices. With a focus on quality and innovation, Texas Instruments delivers a product that exceeds expectations. Customers can expect value, efficiency, and seamless integration with this 32-bit microprocessor circuit. Elevate your projects with the DM355SZCEA216 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand extreme conditions and ensures reliable performance.

RAM Words: 32768

The ample RAM capacity of 32768 words allows for efficient storage and processing of data, making the product suitable for complex tasks.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high efficiency, making the product energy-efficient and cost-effective.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for compact designs and efficient use of space, making the product suitable for applications with limited space.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM355SZCEA216 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

DM355SZCEA216 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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