Loading...

DM355SDZCE135

Texas Instruments

DM355SDZCE135 by Texas Instruments

The Texas Instruments DM355SDZCE135 is a 32-bit microprocessor with 8192 RAM words. It operates at temperatures from 0 to 85°C and has a max supply voltage of 1.365V. Ideal for applications requiring a low-profile, fine-pitch package style in CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,031 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,031

-

-

-

-

Digiode

USA . 657 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

657

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 724 parts In-Stock

1+ parts

$1.770

100+ parts

-

1k+ parts

-

10k+ parts

-

724

$1.770

-

-

-

Northwest PG Solutions

USA . 1,470 parts In-Stock

1+ parts

$1.947

100+ parts

-

1k+ parts

-

10k+ parts

-

1,470

$1.947

-

-

-

AZTECH Wire

Italy . 803 parts In-Stock

1+ parts

$17.756

100+ parts

-

1k+ parts

-

10k+ parts

-

803

$17.756

-

-

-

One Stop Electronics

USA . 1,327 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,327

$19.000

-

-

-

Parana Technologies

USA . 510 parts In-Stock

1+ parts

$36.025

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$36.025

-

-

-

ChromeModa Solutions

Germany . 5,410 parts In-Stock

1+ parts

$40.477

100+ parts

$33.191

1k+ parts

-

10k+ parts

-

5,410

$40.477

$33.191

-

-

IDEA Electronic Components Group

UK . 1,800 parts In-Stock

1+ parts

$40.477

100+ parts

$38.453

1k+ parts

$36.429

10k+ parts

-

1,800

$40.477

$38.453

$36.429

-

Corohmni

South Africa . 5,174 parts In-Stock

1+ parts

$42.902

100+ parts

-

1k+ parts

-

10k+ parts

-

5,174

$42.902

-

-

-

Corphita

USA . 1,085 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,085

-

-

-

-

Microchip USA

USA . 478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

478

-

-

-

-

DigiPath Technology Company

USA . 8 parts In-Stock

1+ parts

-

100+ parts

$36.494

1k+ parts

-

10k+ parts

-

8

-

$36.494

-

-

Overview

Experience innovation at its finest with the DM355SDZCE135 by Texas Instruments. This cutting-edge microprocessor circuit offers unparalleled performance and reliability in a compact package. Whether you're designing consumer electronics, industrial applications, or automotive systems, this 32-bit powerhouse is sure to exceed your expectations. With a wide range of power supplies, low profile design, and high RAM capacity, the DM355SDZCE135 delivers exceptional value and efficiency for all your project needs. Trust Texas Instruments for superior quality and unmatched expertise in semiconductor technology. Elevate your designs with the DM355SDZCE135 and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability to the package, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mountable makes installation easier and allows for more efficient use of PCB space.

Maximum Supply Voltage: 1.365 V

The maximum supply voltage of 1.365 V ensures safe operation and protection of the integrated circuits.

Package Shape: SQUARE

The square package shape enables easy integration into PCB layouts and ensures uniformity in design.

Bit Size: 32

A 32-bit architecture provides high computational power and performance for various tasks and applications.

Power Supplies (V): 1.3, 1.8, 3.3

Support for multiple power supply voltages offers flexibility in design and compatibility with different systems.

No. of Terminals: 337

Having a high number of terminals allows for connectivity to a wide range of external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style of grid array, low profile, and fine pitch enables high-density mounting and efficient heat dissipation.

Minimum Supply Voltage: 1.235 V

The minimum supply voltage of 1.235 V ensures that the integrated circuits operate within safe limits even under low voltage conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable operation in harsh environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures proper functioning even in cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides good conductivity and ensures reliable connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and routing of connections.

Maximum Seated Height: 1.3 mm

The low maximum seated height of 1.3 mm allows for slim and compact designs.

RAM Words: 8192

With 8192 RAM words, the product offers ample memory for data storage and processing.

Width: 13 mm

A width of 13 mm enables easy integration into standard PCB designs and layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering without damaging the components.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can withstand soldering processes effectively.

Length: 13 mm

A length of 13 mm allows for compact and space-saving PCB designs.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the product's processing capabilities for a wide range of applications.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Having terminals in ball form facilitates easy soldering and connection to the PCB.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V ensures consistent and reliable performance of the product.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm allows for high-density mounting and compact PCB designs.

Format: FIXED POINT

The fixed-point format allows for efficient arithmetic operations and precise calculations.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM355SDZCE135 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

DM355SDZCE135 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 9