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DM355SZCE135

Texas Instruments

DM355SZCE135 by Texas Instruments

The Texas Instruments DM355SZCE135 is a 32-bit microprocessor with 337 terminals and 32768 RAM words. Operating b/w 0-85°C, it has a supply voltage range of 1.235-3.3V and peak reflow temperature of 260°C. Ideal for applications requiring a low-profile, fine-pitch grid array package in CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,248 parts In-Stock

1+ parts

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3,248

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Vyrian

USA . 2,732 parts In-Stock

1+ parts

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2,732

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 496 parts In-Stock

1+ parts

$16.013

100+ parts

-

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496

$16.013

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Corohmni

South Africa . 622 parts In-Stock

1+ parts

$19.818

100+ parts

-

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622

$19.818

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One Stop Electronics

USA . 1,562 parts In-Stock

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$28.000

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1,562

$28.000

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Parana Technologies

USA . 2,363 parts In-Stock

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$42.640

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2,363

$42.640

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ChromeModa Solutions

Germany . 5,623 parts In-Stock

1+ parts

$47.910

100+ parts

$39.286

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5,623

$47.910

$39.286

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IDEA Electronic Components Group

UK . 2,122 parts In-Stock

1+ parts

$47.910

100+ parts

$45.514

1k+ parts

$43.119

10k+ parts

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2,122

$47.910

$45.514

$43.119

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Native Components

USA . 549 parts In-Stock

1+ parts

$173.080

100+ parts

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$166.157

549

$173.080

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$166.157

Northwest PG Solutions

USA . 1,372 parts In-Stock

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$190.388

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1,372

$190.388

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Corphita

USA . 2,221 parts In-Stock

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2,221

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DigiPath Technology Company

USA . 1,666 parts In-Stock

1+ parts

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100+ parts

$43.196

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1,666

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$43.196

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Microchip USA

USA . 324 parts In-Stock

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324

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Overview

Unleash the power of innovation with the DM355SZCE135 by Texas Instruments. Crafted with precision and expertise, this cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering unparalleled performance and reliability. With a sleek package body material made of PLASTIC/EPOXY and a square shape design, this product is designed to exceed expectations. Whether you're looking to enhance your electronics project or streamline your operations, the DM355SZCE135 delivers exceptional value, benefits, and advantages that are unmatched in the market. Elevate your experience with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and ruggedness, making the product suitable for a variety of environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.365 V

With a maximum supply voltage of 1.365V, the product is designed to operate efficiently within this range, ensuring stable performance.

Package Shape: SQUARE

Square package shape helps in optimizing the use of space on the circuit board, enabling compact and efficient designs.

Bit Size: 32

32-bit architecture provides enhanced processing capabilities and efficiency, suitable for complex applications and multitasking.

Power Supplies (V): 1.3, 1.8, 3.3

Support for multiple power supply voltages makes the product versatile and compatible with various system requirements and configurations.

No. of Terminals: 337

Having a high number of terminals allows for greater connectivity and functionality, enabling integration with a wide range of external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package styles offers flexibility in layout and design, facilitating efficient PCB assembly.

Minimum Supply Voltage: 1.235 V

With a minimum supply voltage of 1.235V, the product can operate reliably even under low power conditions, ensuring consistent performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures the product can withstand elevated temperatures without compromising functionality, suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C allows the product to operate in cold environments, making it versatile for a wide range of operating conditions.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for long-term performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and efficient soldering during assembly, simplifying the manufacturing process.

Maximum Seated Height: 1.3 mm

Low maximum seated height of 1.3mm offers a compact form factor, allowing for space-saving integration in constrained environments.

RAM Words: 32768

High RAM word capacity of 32768 enhances data processing and storage capabilities, enabling efficient operation of complex algorithms and applications.

Width: 13 mm

Compact width of 13mm enables efficient layout and placement of the product on the circuit board, ideal for space-constrained designs.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30s, the product can endure thermal stress during assembly processes, ensuring robust reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C enables reliable soldering and bonding of components, ensuring secure connections for long-term performance.

Length: 13 mm

Compact length of 13mm contributes to the overall small form factor of the product, suitable for applications with limited space constraints.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as a peripheral IC offers advanced processing capabilities and enhanced functionality, making the product ideal for demanding applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring energy-efficient operation and reliable performance.

Terminal Form: BALL

Ball terminal form enables efficient soldering and connection reliability, enhancing the durability and longevity of the product.

Nominal Supply Voltage: 1.3 V

Having a nominal supply voltage of 1.3V ensures stable and consistent operation, suitable for applications requiring precise voltage levels.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for high-density mounting and compact PCB design, enabling space-efficient integration in small electronic devices.

Format: FIXED POINT

Fixed-point format simplifies arithmetic calculations and processing tasks, suitable for applications where precise numerical accuracy is critical.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the product can withstand moderate exposure to moisture during handling and storage, ensuring reliability in varying environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM355SZCE135 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

DM355SZCE135 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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