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DM355SDZCEA216

Texas Instruments

DM355SDZCEA216 by Texas Instruments

DM355SDZCEA216 by Texas Instruments is a 32-bit microprocessor circuit with a max supply voltage of 1.365V. It is used in industrial applications and supports I2C, SPI, UART, and USB bus compatibility.

Median Price

$38.580

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 12 parts In-Stock

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$38.580

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12

$38.580

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Distributors (In-Stock)

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Nova Conductors

Japan . 750 parts In-Stock

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$30.799

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750

$30.799

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Digiode

USA . 1,220 parts In-Stock

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$35.758

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1,220

$35.758

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Vyrian

USA . 8,338 parts In-Stock

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Rebound Electronics

UK . 3 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 304 parts In-Stock

1+ parts

$17.390

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304

$17.390

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Continental Prestige Electronics

USA . 304 parts In-Stock

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$30.799

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$30.183

304

$30.799

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$30.183

Ampacity Inc.

Singapore . 12 parts In-Stock

1+ parts

$31.990

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12

$31.990

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Corphita

USA . 2,755 parts In-Stock

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$33.876

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2,755

$33.876

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$58.373

100+ parts

$53.119

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$47.866

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$58.373

$53.119

$47.866

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Microchip USA

USA . 1,246 parts In-Stock

1+ parts

$59.300

100+ parts

$58.270

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$57.750

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$57.230

1,246

$59.300

$58.270

$57.750

$57.230

Parana Technologies

USA . 975 parts In-Stock

1+ parts

$68.496

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975

$68.496

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Corohmni

South Africa . 183 parts In-Stock

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$73.174

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183

$73.174

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ChromeModa Solutions

Germany . 3,991 parts In-Stock

1+ parts

$76.962

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$63.109

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3,991

$76.962

$63.109

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IDEA Electronic Components Group

UK . 1,524 parts In-Stock

1+ parts

$76.962

100+ parts

$73.114

1k+ parts

$69.266

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1,524

$76.962

$73.114

$69.266

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DigiPath Technology Company

USA . 1,289 parts In-Stock

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$69.389

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Argo Parts USA

USA . 332 parts In-Stock

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Overview

Looking for a high-quality microprocessor circuit for your industrial applications? Look no further than the DM355SDZCEA216 by Texas Instruments. With its advanced CMOS technology and reliable manufacturing, this product offers exceptional performance and durability. Whether you need to interface with I2C, SPI, UART, or USB, this versatile device has got you covered. Its compact square package shape and low profile make it easy to integrate into your designs. Experience the benefits of powerful processing, wide operating temperature range, and multiple power supply options. Trust Texas Instruments for all your microprocessor needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the product, making it suitable for various environments.

Surface Mount: YES

Being surface mountable, this product offers easy installation and reduces the complexity of the design.

Maximum Supply Voltage: 1.365 V

With a high maximum supply voltage, this product can handle demanding applications that require higher voltage levels, providing flexibility and reliability.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, maximizing the layout options and enabling compact designs.

Bit Size: 32

With a bit size of 32, this product offers enhanced computational capabilities and can handle complex tasks efficiently.

Power Supplies (V): 1.3, 1.8, 3.3

The multiple power supply options provide compatibility with various systems and allow for flexible integration into different applications.

No. of Terminals: 337

With a large number of terminals, this product offers extensive connectivity options, enabling the interface with multiple devices or peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style combined with a low profile and fine pitch design offers improved signal integrity, reduced noise, and allows for high-density packaging.

Minimum Supply Voltage: 1.235 V

The low minimum supply voltage allows for efficient power usage, reducing energy consumption and prolonging battery life in portable devices.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance even in harsh operating conditions, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments or applications that require extended temperature ranges.

Terminal Finish: TIN SILVER COPPER

The terminal finish with tin, silver, and copper provides excellent electrical conductivity, corrosion resistance, and solderability, ensuring reliable connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and makes it easier to connect the product to other components or peripherals.

Maximum Seated Height: 1.3 mm

The low maximum seated height allows for compact designs and facilitates integration into space-constrained applications.

RAM Words: 8192

With a large number of RAM words, this product can store and process significant amounts of data, enhancing its computational capabilities.

Width: 13 mm

The compact width of 13 mm enables the product to fit into small spaces, facilitating design flexibility and compact form factor devices.

External Data Bus Width: 32

The wide external data bus width of 32 ensures efficient data transfer and enables fast communication between the product and external components.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper solder reflow during assembly, leading to reliable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper solder melting and offers secure solder joints for long-term reliability.

Length: 13 mm

The compact length of 13 mm allows for space-saving installation and enables the product to fit into smaller devices or tight spaces.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product is capable of operating reliably in challenging temperature conditions, making it suitable for industrial automation or control systems.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities, making it suitable for applications that require high-performance computing.

Technology: CMOS

The use of CMOS technology ensures low power consumption, allowing for longer battery life and reducing heat generation.

Terminal Form: BALL

The terminal form with a ball design facilitates soldering and provides a strong electrical connection, ensuring reliable performance.

Nominal Supply Voltage: 1.3 V

The nominal supply voltage of 1.3 V specifies the typical voltage level required for normal operation, ensuring compatibility with various systems and power sources.

Bus Compatibility: I2C; SPI; UART; USB

The bus compatibility with I2C, SPI, UART, and USB interfaces allows for versatile connectivity options and enables seamless integration into different systems.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density integration and enables miniaturization of electronic devices.

Format: FIXED POINT

The fixed-point format enhances precision and accuracy in numerical computations, making this product suitable for applications that require precise calculations.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product has a moderate sensitivity to moisture, ensuring proper handling and storage procedures to avoid detrimental effects.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM355SDZCEA216 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

Bit Size:

32

Bus Compatibility:

I2C; SPI; UART; USB

External Data Bus Width:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

DM355SDZCEA216 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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