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DM355SZCE270

Texas Instruments

DM355SZCE270 by Texas Instruments

Texas Instruments DM355SZCE270 is a 32-bit microprocessor with 337 terminals. Operating b/w 0-85°C, it has a max supply voltage of 1.365V and RAM words of 32768. Ideal for applications requiring a low-profile, fine-pitch package style in CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,063 parts In-Stock

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4,063

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Vyrian

USA . 2,536 parts In-Stock

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2,536

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Distributors (Availability)

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AZTECH Wire

Italy . 589 parts In-Stock

1+ parts

$15.696

100+ parts

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589

$15.696

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One Stop Electronics

USA . 730 parts In-Stock

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$27.000

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730

$27.000

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Parana Technologies

USA . 715 parts In-Stock

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$27.334

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$34.677

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715

$27.334

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$34.677

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ChromeModa Solutions

Germany . 6,307 parts In-Stock

1+ parts

$30.712

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$25.184

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6,307

$30.712

$25.184

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IDEA Electronic Components Group

UK . 794 parts In-Stock

1+ parts

$30.712

100+ parts

$29.176

1k+ parts

$27.641

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794

$30.712

$29.176

$27.641

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Native Components

USA . 120 parts In-Stock

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$51.510

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$49.450

120

$51.510

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$49.450

Northwest PG Solutions

USA . 762 parts In-Stock

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$56.661

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762

$56.661

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Corohmni

South Africa . 1,975 parts In-Stock

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$78.266

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$78.266

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QUARKTWIN TECHNOLOGY LTD

USA . 21,626 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Microchip USA

USA . 2,376 parts In-Stock

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Corphita

USA . 1,601 parts In-Stock

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1,601

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DigiPath Technology Company

USA . 1,538 parts In-Stock

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$27.690

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1,538

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$27.690

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Overview

Experience the cutting-edge technology of the DM355SZCE270 by Texas Instruments, a top-tier manufacturer known for its quality and innovation. This versatile microprocessor circuit offers a wide range of applications in the category of Other Function uPs,uCs & Peripheral ICs, providing customers with unmatched performance and reliability. With a 32-bit architecture and a variety of power supply options, this product delivers exceptional value and benefits to meet your unique needs. Trust Texas Instruments to deliver superior solutions for all your electronic requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that protects the IC components inside.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and improving reliability.

Maximum Supply Voltage: 1.365 V

Allows for efficient power consumption and operation within safe voltage limits.

Package Shape: SQUARE

Optimal shape for efficient use of board space and component layout.

Bit Size: 32

Provides high processing capability and performance for various applications.

Power Supplies (V): 1.3,1.8,3.3

Offers flexibility in power input options for different system requirements.

No. of Terminals: 337

Sufficient terminals for connecting to various external devices and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables precise placement and compact design for efficient PCB layout.

Minimum Supply Voltage: 1.235 V

Allows for stable operation with minimal power consumption.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: 0 °C

Wide operating temperature range for versatility in various applications.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Facilitates easy and secure soldering on PCBs for stable connections.

Maximum Seated Height: 1.3 mm

Low profile design for compact and space-saving integration in devices.

RAM Words: 32768

Sufficient memory capacity for storing and processing data efficiently.

Width: 13 mm

Compact size for easy integration and compatibility with standard PCB designs.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering processes during assembly.

Peak Reflow Temperature °C: 260

High-temperature tolerance for robust soldering and manufacturing processes.

Length: 13 mm

Compact size for space-saving integration in various devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integrated microprocessor circuit for versatile and high-performance computing capabilities.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminals for reliable and secure soldering connections on PCBs.

Nominal Supply Voltage: 1.3 V

Stable and efficient voltage supply for optimal performance.

Terminal Pitch: 0.65 mm

Fine terminal pitch for precise and compact connections on PCBs.

Format: FIXED POINT

Fixed-point format for efficient and precise numerical calculations.

Moisture Sensitivity Level (MSL): 3

Suitable for application environments with moderate moisture exposure levels.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DM355SZCE270 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

337

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.365 V

Minimum Supply Voltage:

1.235 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

DM355SZCE270 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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