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LH7A400N0E000B3A

NXP Semiconductors

LH7A400N0E000B3A by NXP Semiconductors

NXP Semiconductors' LH7A400N0E000B3A is a ceramic package IC with 256 terminals, operating at temperatures from 0 to 70°C. It has power supplies of 1.8V and 3.3V, suitable for various applications requiring fine pitch grid array style packaging in commercial-grade environments.

Median Price

$15.620

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 31 parts In-Stock

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$15.620

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$12.196

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31

$15.620

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Digiode

USA . 4,888 parts In-Stock

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$14.839

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4,888

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Vyrian

USA . 3,937 parts In-Stock

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Anansix

USA . 2,556 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Ampacity Inc.

Singapore . 31 parts In-Stock

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$13.280

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31

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Corphita

USA . 4,576 parts In-Stock

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$14.058

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Corohmni

South Africa . 953 parts In-Stock

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$37.486

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953

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UNI Independent Distributors

Spain . 4,436 parts In-Stock

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Continental Prestige Electronics

USA . 3,933 parts In-Stock

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Argo Parts USA

USA . 2,488 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Perfect Parts

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Overview

Unlock the potential of your electronic devices with the LH7A400N0E000B3A by NXP Semiconductors. Manufactured with top-notch quality and reliability, this product belongs to the category of Other Function uPs, uCs & Peripheral ICs, delivering exceptional performance and versatility. Whether you're designing consumer electronics, industrial applications, or automotive systems, this device offers unmatched value, benefits, and advantages to meet your specific needs. Trust NXP Semiconductors to provide cutting-edge solutions that drive innovation and excellence in every project.

Feature Benefit Bullets

Package Body Material: Ceramic

Ceramic material provides high durability and reliability, making it suitable for various applications that require robust components.

Surface Mount: Yes

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and reducing overall assembly cost.

Package Shape: Square

Square shape packaging is commonly used for integrated circuits, offering uniformity in design and ease of handling during manufacturing and installation.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply voltages allows for versatile usage in different electrical systems, providing compatibility with various devices.

No. of Terminals: 256

Having a large number of terminals facilitates more connections and functionalities, making this product suitable for complex electronic applications.

Package Style (Meter): Grid Array, Fine Pitch

Grid array and fine pitch packaging offer high-density integration of components on a small footprint, enabling high-performance and compact circuit designs.

Maximum Operating Temperature: 70°C

With a high maximum operating temperature, this product can withstand demanding environmental conditions and operate reliably in a wide range of applications.

Minimum Operating Temperature: 0°C

The low minimum operating temperature ensures functionality even in colder environments, providing versatility and reliability in diverse operating conditions.

Terminal Position: Bottom

Bottom terminal position simplifies the layout and assembly process, enhancing ease of use and efficiency during the installation of the component.

Temperature Grade: Commercial

Commercial temperature grade indicates that this product is designed for standard operating environments, making it suitable for most commercial applications.

Terminal Form: Ball

The ball terminal form offers reliable electrical connections and soldering points, ensuring stable performance and durability in various electronic systems.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density placement of terminals, enabling compact and efficient circuit designs with improved signal integrity and performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LH7A400N0E000B3A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-XBGA-B256

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

BGA256,16X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Other uPs/uCs/Peripheral ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

LH7A400N0E000B3A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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