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LH7A404N0F000B3

NXP Semiconductors

LH7A404N0F000B3 by NXP Semiconductors

The NXP Semiconductors LH7A404N0F000B3 is a ceramic package microcontroller with 324 terminals, operating at temperatures from -40 to 85°C. It has power supplies of 1.8V and 3.3V, suitable for industrial applications requiring fine pitch grid array style packaging and surface mount capabilities.

Median Price

$4.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 574 parts In-Stock

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Digiode

USA . 409 parts In-Stock

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Anansix

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Flip Electronics

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Chip Stock

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Nova Conductors

Japan . 80 parts In-Stock

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Connector Distribution Corp

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Distributors (Availability)

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Semicontronic

India . 453 parts In-Stock

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$5.000

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$4.875

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$4.850

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Corohmni

South Africa . 2,979 parts In-Stock

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Ampacity Inc.

Singapore . 672 parts In-Stock

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$27.000

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One Stop Electronics

USA . 144 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,697 parts In-Stock

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UNI Independent Distributors

Spain . 8,223 parts In-Stock

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Alle Elektronik GmbH

Germany . 7,131 parts In-Stock

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Argo Parts USA

USA . 3,795 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Microchip USA

USA . 2,916 parts In-Stock

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Corphita

USA . 2,538 parts In-Stock

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Continental Prestige Electronics

USA . 1,557 parts In-Stock

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Perfect Parts

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Netroflash

USA . 500 parts In-Stock

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Futuretech Components

Singapore . 300 parts In-Stock

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Kepictronics

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Overview

Experience unparalleled performance with the LH7A404N0F000B3 by NXP Semiconductors. This cutting-edge device, part of the Other Function uPs,uCs & Peripheral ICs category, offers exceptional quality and reliability that only a top manufacturer like NXP can provide. From industrial applications to consumer electronics, this product is versatile and adaptable, ensuring seamless integration and optimal functionality. Unlock limitless possibilities and elevate your projects with the LH7A404N0F000B3 - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and durability, making it ideal for industrial applications where reliability is crucial.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and cost in production.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, maximizing component density.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with various systems.

No. of Terminals: 324

High number of terminals allows for versatile connections and functionality in complex circuit designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environments without risk of overheating.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures enables use in both extreme cold and hot conditions, suitable for diverse applications.

Terminal Finish: TIN SILVER COPPER

Quality terminal finish with Tin Silver Copper provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position eases soldering and assembly processes, ensuring proper connections and reducing the risk of errors.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature minimizes thermal stress on components during soldering process, preserving their integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables efficient and thorough soldering of the component onto the PCB for reliable connections.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable operation in demanding environments where temperature fluctuations are common.

Terminal Form: BALL

Ball terminal form facilitates reliable and secure connections with the PCB, reducing the risk of intermittent connections or signal loss.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm allows for high-density mounting on the PCB, enabling compact and space-efficient circuit designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the component has a moderate level of sensitivity to moisture, suitable for standard reflow soldering processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs LH7A404N0F000B3 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-XBGA-B324

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

324

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

BGA324,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Sub-Category:

Other uPs/uCs/Peripheral ICs

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LH7A404N0F000B3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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