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TMS320DM6467CZUT

Texas Instruments

TMS320DM6467CZUT by Texas Instruments

TMS320DM6467CZUT by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at 1.14-1.26V, it has a max temp of 85°C and package style of grid array, fine pitch. Ideal for applications requiring high processing power in compact designs.

Median Price

$83.560

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 35 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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35

-

-

-

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Rochester

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$83.560

1k+ parts

$74.770

10k+ parts

$70.370

20

-

$83.560

$74.770

$70.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,029 parts In-Stock

1+ parts

$92.616

100+ parts

-

1k+ parts

-

10k+ parts

-

2,029

$92.616

-

-

-

DigiKey Marketplace

USA . 35 parts In-Stock

1+ parts

$96.560

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$96.560

-

-

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Vyrian

USA . 2,245 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,245

-

-

-

-

Cyclops Electronics Ltd

UK . 842 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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842

-

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Elcom Components

USA . 174 parts In-Stock

1+ parts

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174

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,986 parts In-Stock

1+ parts

$61.452

100+ parts

-

1k+ parts

-

10k+ parts

-

2,986

$61.452

-

-

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Parana Technologies

USA . 1,922 parts In-Stock

1+ parts

$77.130

100+ parts

$7,162.697

1k+ parts

$69.417

10k+ parts

-

1,922

$77.130

$7,162.697

$69.417

-

DigiPath Technology Company

USA . 1,885 parts In-Stock

1+ parts

$84.930

100+ parts

$78.135

1k+ parts

-

10k+ parts

-

1,885

$84.930

$78.135

-

-

ChromeModa Solutions

Germany . 3,975 parts In-Stock

1+ parts

$86.663

100+ parts

$71.064

1k+ parts

-

10k+ parts

-

3,975

$86.663

$71.064

-

-

IDEA Electronic Components Group

UK . 1,779 parts In-Stock

1+ parts

$86.663

100+ parts

$82.330

1k+ parts

$77.997

10k+ parts

-

1,779

$86.663

$82.330

$77.997

-

Corphita

USA . 421 parts In-Stock

1+ parts

$87.741

100+ parts

-

1k+ parts

-

10k+ parts

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421

$87.741

-

-

-

Microchip USA

USA . 1,184 parts In-Stock

1+ parts

$143.500

100+ parts

$141.000

1k+ parts

$139.760

10k+ parts

$138.510

1,184

$143.500

$141.000

$139.760

$138.510

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,000

-

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Emar International I/E

Canada . 83 parts In-Stock

1+ parts

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100+ parts

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83

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Overview

Experience the ultimate in performance with the TMS320DM6467CZUT by Texas Instruments. Known for their cutting-edge technology and reliability, Texas Instruments delivers a high-quality product that exceeds expectations. This versatile microprocessor circuit offers endless applications in various industries, providing unmatched value and benefits to customers. Unlock new possibilities and elevate your projects with the TMS320DM6467CZUT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Facilitates easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.26 V

Allows for stable operation within a specific voltage range, preventing damage to the device.

Package Shape: SQUARE

Enables efficient use of space on the PCB, optimizing overall system design.

Bit Size: 32

Offers high processing capability and data handling capacity for advanced applications.

Power Supplies (V): 1.2,1.8,3.3

Supports various voltage requirements, making it versatile for different system configurations.

No. of Terminals: 529

Provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enhances thermal performance and signal integrity, crucial for optimal functionality.

Minimum Supply Voltage: 1.14 V

Ensures reliable operation even under lower voltage conditions, improving system resilience.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for demanding operating environments.

Minimum Operating Temperature: 0 °C

Capable of functioning in low temperature conditions without compromising performance.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for long-term usage.

Terminal Position: BOTTOM

Facilitates easy connection to the PCB and minimizes signal interference.

Maximum Seated Height: 3.3 mm

Compact design allows for efficient use of space in compact electronic devices.

RAM Words: 8192

Sufficient memory capacity for storing and processing data efficiently in real-time applications.

Width: 19 mm

Compact form factor for easy integration into various electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering of the component during assembly, preventing potential soldering defects.

Peak Reflow Temperature °C: 245

Ability to withstand high reflow temperatures during the soldering process, ensuring secure attachment to the PCB.

Length: 19 mm

Compact size allows for flexibility in designing space-constrained electronic devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates advanced processing capabilities for handling complex tasks and managing peripherals efficiently.

Technology: CMOS

Utilizes low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: BALL

Enhances solder joint reliability and signal transmission, crucial for electronic performance.

Nominal Supply Voltage: 1.2 V

Stable voltage supply for consistent device operation, ensuring reliable performance.

Terminal Pitch: 0.8 mm

Close terminal spacing for efficient routing of signals and compact PCB design.

Format: FIXED POINT

Specific data format for accurate calculations and precise data processing in mathematical operations.

Moisture Sensitivity Level (MSL): 4

Designed to handle moderate exposure to moisture, suitable for a range of environmental conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TMS320DM6467CZUT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6467CZUT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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