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BALL Other Function uPs,uCs & Peripheral ICs 1,582

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MIMX8MN3DVTJZAA by NXP Semiconductors

MIMX8MN3DVTJZAA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN4DVTJZAA by NXP Semiconductors

MIMX8MN4DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN4DVTJZAA is a SoC with 486 terminals in a low profile, fine pitch grid array package. It operates b/w 0-95°C with supply voltage range of 0.95-1.05 V. Ideal for applications requiring high performance and compact design in various electronic devices.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN5DVTJZAA by NXP Semiconductors

MIMX8MN5DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN5DVTJZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MN6DVTJZCA by NXP Semiconductors

MIMX8MN6DVTJZCA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

14 mm

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

14 mm

SoC

MIMX8MN6DVTJZDA by NXP Semiconductors

MIMX8MN6DVTJZDA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

14 mm

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

14 mm

SoC

MCIMX6Z0DVM09ABR by NXP Semiconductors

MCIMX6Z0DVM09ABR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.375 V;

S-PBGA-B289

14 mm

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.32 mm

1.5 V

1.375 V

YES

CMOS

BALL

.8 mm

BOTTOM

14 mm

SoC

CEC1712H-S2-I/SX by Microchip Technology

CEC1712H-S2-I/SX

Microchip Technology

CEC1712H-S2-I/SX by Microchip Technology is a MICROPROCESSOR CIRCUIT with 84 terminals in a GRID ARRAY package. It operates b/w -40 to 85 °C, compatible with I2C, QSPI, UART buses. With a low supply voltage range of 1.71-1.89 V, it's ideal for INDUSTRIAL applications requiring high performance in compact spaces.

3.3V NOM SUPPLY ALSO AVAILABLE

I2C, QSPI, UART

S-PBGA-B84

7 mm

84

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA84,10X10,25

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.89 V

1.71 V

1.8 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

7 mm

MICROPROCESSOR CIRCUIT

MCIMX6DP4AVT8AAR by NXP Semiconductors

MCIMX6DP4AVT8AAR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP4AVT8ABR by NXP Semiconductors

MCIMX6DP4AVT8ABR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA624,25X25,32;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8AAR by NXP Semiconductors

MCIMX6DP6AVT8AAR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.4 V;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8ABR by NXP Semiconductors

MCIMX6DP6AVT8ABR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.4 V;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6X4AVM08ABR by NXP Semiconductors

MCIMX6X4AVM08ABR

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

S-PBGA-B529

e1

19 mm

3

529

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.5 V

1.275 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

SoC

MPFS250TL-FCG1152I by Microchip Technology

MPFS250TL-FCG1152I

Microchip Technology

MPFS250TL-FCG1152I by Microchip Technology is a SoC FPGA with 1152 terminals, CMOS technology, and operating temperature range of -40 to 100°C. It is used for various applications requiring high-performance computing in a compact rectangular package suitable for surface mounting.

R-PBGA-B1152

1152

100 Cel

-40 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

CMOS

BALL

BOTTOM

SoC FPGA

DLPC2607ZVB by Texas Instruments

DLPC2607ZVB

Texas Instruments

DLPC2607ZVB by Texas Instruments is a MICROPROCESSOR CIRCUIT with 176 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C, with supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high performance and low power consumption.

S-PBGA-B176

e1

3

176

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

MICROPROCESSOR CIRCUIT

DLPC6401ZFF by Texas Instruments

DLPC6401ZFF

Texas Instruments

DLPC6401ZFF by Texas Instruments is a CMOS microprocessor circuit with 419 terminals in a square grid array package. It operates b/w 0-55°C, with supply voltage range of 1.116-1.26V. Ideal for applications requiring high-performance processing in commercial-grade environments.

S-PBGA-B419

23 mm

419

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

2.36 mm

1.26 V

1.116 V

1.2 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

23 mm

MICROPROCESSOR CIRCUIT

DLPC900ZPC by Texas Instruments

DLPC900ZPC

Texas Instruments

DLPC900ZPC by Texas Instruments is a 516-terminal microprocessor circuit with CMOS technology. It operates b/w 0-55°C, supports I2C, SPI, UART, and USB buses, and has a clock frequency of up to 20 MHz. Ideal for applications requiring a low-voltage supply and high data bus width in a compact grid array package.

I2C; SPI; UART; USB

20 MHz

16

S-PBGA-B516

27 mm

9

516

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

2.42 mm

1.2 V

1.1 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

27 mm

MICROPROCESSOR CIRCUIT

XC7Z010-L1CLG225I by Xilinx

XC7Z010-L1CLG225I

Xilinx

XC7Z010-L1CLG225I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package features a grid array style with 225 terminals and is ideal for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B225

13 mm

225

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA225,15X15,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.5 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

13 mm

SYSTEM ON CHIP

XC7Z010-L1CLG400I by Xilinx

XC7Z010-L1CLG400I

Xilinx

XC7Z010-L1CLG400I by Xilinx is a 400-terminal System on Chip with CMOS technology. It operates b/w -40°C to 100°C, with supply voltage ranging from 0.95V to 1.05V. This low-profile, fine-pitch IC is ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z015-1CLG485C by Xilinx

XC7Z015-1CLG485C

Xilinx

XC7Z015-1CLG485C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B485

19 mm

485

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z015-1CLG485I by Xilinx

XC7Z015-1CLG485I

Xilinx

The Xilinx XC7Z015-1CLG485I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With a grid array package style and 485 terminals, it's ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z015-2CLG485E by Xilinx

XC7Z015-2CLG485E

Xilinx

The Xilinx XC7Z015-2CLG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 485 terminals in a low profile grid array package, it's ideal for various applications requiring high-performance processing capabilities in compact designs.

S-PBGA-B485

19 mm

485

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z015-2CLG485I by Xilinx

XC7Z015-2CLG485I

Xilinx

Xilinx XC7Z015-2CLG485I is a CMOS System on Chip with 485 terminals in a low profile grid array package. Operating b/w -40 to 100 °C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z015-3CLG485E by Xilinx

XC7Z015-3CLG485E

Xilinx

The Xilinx XC7Z015-3CLG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring a grid array package style, it's ideal for applications requiring low profile and fine pitch components in Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B485

19 mm

485

100 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z015-L1CLG485I by Xilinx

XC7Z015-L1CLG485I

Xilinx

XC7Z015-L1CLG485I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package style features a grid array, low profile design ideal for various applications in the electronics industry.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA485,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z020-L1CLG400I by Xilinx

XC7Z020-L1CLG400I

Xilinx

The Xilinx XC7Z020-L1CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B400

17 mm

400

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

17 mm

SYSTEM ON CHIP

XC7Z020-L1CLG484I by Xilinx

XC7Z020-L1CLG484I

Xilinx

XC7Z020-L1CLG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals. It operates at a voltage range of 0.95V to 1.05V and has a max seated height of 1.6mm. This versatile IC is commonly used in various applications requiring low profile, fine pitch grid array packages.

S-PBGA-B484

19 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.6 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-1SBG485C by Xilinx

XC7Z030-1SBG485C

Xilinx

XC7Z030-1SBG485C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 485 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.

S-PBGA-B485

19 mm

485

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-1SBG485I by Xilinx

XC7Z030-1SBG485I

Xilinx

XC7Z030-1SBG485I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. With 485 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-2SBG485E by Xilinx

XC7Z030-2SBG485E

Xilinx

The Xilinx XC7Z030-2SBG485E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. Featuring 485 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B485

19 mm

485

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-2SBG485I by Xilinx

XC7Z030-2SBG485I

Xilinx

XC7Z030-2SBG485I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.95V to 1.05V. This GRID ARRAY package has 485 terminals and is ideal for various applications requiring high-performance uPs/uCs & Peripheral ICs.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-3SBG485E by Xilinx

XC7Z030-3SBG485E

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 485; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

S-PBGA-B485

19 mm

485

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z030-L2FBG484I by Xilinx

XC7Z030-L2FBG484I

Xilinx

XC7Z030-L2FBG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals and a package size of 23mm x 23mm. It operates at a supply voltage range of 0.95V to 1.05V and can withstand temperatures from -40°C to 100°C. This versatile IC is commonly used in various applications requiring high-performance microcontrollers and peripheral integration.

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

SYSTEM ON CHIP

XC7Z030-L2FBG676I by Xilinx

XC7Z030-L2FBG676I

Xilinx

The Xilinx XC7Z030-L2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-L2FFG676I by Xilinx

XC7Z030-L2FFG676I

Xilinx

XC7Z030-L2FFG676I by Xilinx is a 676-terminal System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z030-L2SBG485I by Xilinx

XC7Z030-L2SBG485I

Xilinx

The Xilinx XC7Z030-L2SBG485I is a System on Chip with 485 terminals, operating b/w -40 to 100°C. It utilizes CMOS technology, has a terminal pitch of 0.8mm, and a package style of Grid Array. Ideal for applications requiring low power consumption and high performance in compact spaces.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

SYSTEM ON CHIP

XC7Z035-1FBG676C by Xilinx

XC7Z035-1FBG676C

Xilinx

The Xilinx XC7Z035-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. This package has 676 terminals in a square grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-1FBG676I by Xilinx

XC7Z035-1FBG676I

Xilinx

XC7Z035-1FBG676I by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a GRID ARRAY package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-1FFG676C by Xilinx

XC7Z035-1FFG676C

Xilinx

The Xilinx XC7Z035-1FFG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-1FFG676I by Xilinx

XC7Z035-1FFG676I

Xilinx

The Xilinx XC7Z035-1FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-1FFG900C by Xilinx

XC7Z035-1FFG900C

Xilinx

XC7Z035-1FFG900C by Xilinx is a programmable system on chip with CMOS technology. It operates b/w 0 to 85 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-1FFG900I by Xilinx

XC7Z035-1FFG900I

Xilinx

XC7Z035-1FFG900I by Xilinx is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-2FBG676E by Xilinx

XC7Z035-2FBG676E

Xilinx

The Xilinx XC7Z035-2FBG676E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a square grid array package, it's ideal for various applications requiring high-performance microprocessing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FBG676I by Xilinx

XC7Z035-2FBG676I

Xilinx

The Xilinx XC7Z035-2FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FFG676E by Xilinx

XC7Z035-2FFG676E

Xilinx

XC7Z035-2FFG676E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FFG676I by Xilinx

XC7Z035-2FFG676I

Xilinx

The Xilinx XC7Z035-2FFG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

3.24 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP

XC7Z035-2FFG900E by Xilinx

XC7Z035-2FFG900E

Xilinx

XC7Z035-2FFG900E by Xilinx is a programmable system on chip with CMOS technology. It operates b/w 0 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With a grid array package style, it's ideal for various applications in the Other Function uPs,uCs & Peripheral ICs category.

S-PBGA-B900

31 mm

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-2FFG900I by Xilinx

XC7Z035-2FFG900I

Xilinx

The Xilinx XC7Z035-2FFG900I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z035-3FBG676E by Xilinx

XC7Z035-3FBG676E

Xilinx

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;

S-PBGA-B676

27 mm

676

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

SYSTEM ON CHIP