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DLPC6401ZFF

Texas Instruments

DLPC6401ZFF by Texas Instruments

DLPC6401ZFF by Texas Instruments is a CMOS microprocessor circuit with 419 terminals in a square grid array package. It operates b/w 0-55°C, with supply voltage range of 1.116-1.26V. Ideal for applications requiring high-performance processing in commercial-grade environments.

Median Price

$28.320

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,935 parts In-Stock

1+ parts

$18.360

100+ parts

$16.320

1k+ parts

$12.000

10k+ parts

-

8,935

$18.360

$16.320

$12.000

-

DigiKey

USA . 31 parts In-Stock

1+ parts

$28.320

100+ parts

$20.473

1k+ parts

$19.149

10k+ parts

-

31

$28.320

$20.473

$19.149

-

Mouser Electronics

USA . 16 parts In-Stock

1+ parts

$28.320

100+ parts

$20.480

1k+ parts

$19.140

10k+ parts

-

16

$28.320

$20.480

$19.140

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 537 parts In-Stock

1+ parts

$17.442

100+ parts

-

1k+ parts

-

10k+ parts

-

537

$17.442

-

-

-

Vyrian

USA . 6,730 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,730

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 540 parts In-Stock

1+ parts

$0.121

100+ parts

-

1k+ parts

-

10k+ parts

$0.116

540

$0.121

-

-

$0.116

Northwest PG Solutions

USA . 871 parts In-Stock

1+ parts

$0.133

100+ parts

-

1k+ parts

-

10k+ parts

$0.117

871

$0.133

-

-

$0.117

Corphita

USA . 3,879 parts In-Stock

1+ parts

$16.524

100+ parts

-

1k+ parts

-

10k+ parts

-

3,879

$16.524

-

-

-

Parana Technologies

USA . 1,609 parts In-Stock

1+ parts

$25.564

100+ parts

-

1k+ parts

$26.182

10k+ parts

-

1,609

$25.564

-

$26.182

-

DigiPath Technology Company

USA . 1,587 parts In-Stock

1+ parts

$28.150

100+ parts

$25.898

1k+ parts

-

10k+ parts

-

1,587

$28.150

$25.898

-

-

IDEA Electronic Components Group

UK . 2,007 parts In-Stock

1+ parts

$28.724

100+ parts

$27.288

1k+ parts

$25.852

10k+ parts

-

2,007

$28.724

$27.288

$25.852

-

ChromeModa Solutions

Germany . 1,980 parts In-Stock

1+ parts

$28.724

100+ parts

$23.554

1k+ parts

-

10k+ parts

-

1,980

$28.724

$23.554

-

-

Corohmni

South Africa . 657 parts In-Stock

1+ parts

$83.933

100+ parts

-

1k+ parts

-

10k+ parts

-

657

$83.933

-

-

-

Lixinc

USA . 10,698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,698

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,143

-

-

-

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Alle Elektronik GmbH

Germany . 4,042 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,042

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Overview

Enhance your electronic designs with the DLPC6401ZFF by Texas Instruments, a top-tier manufacturer known for delivering high-quality products in the category of Other Function uPs,uCs & Peripheral ICs. This cutting-edge technology offers unparalleled value and benefits to customers, making it an essential component for a wide range of applications. Experience exceptional performance and reliability with this innovative product, setting new standards in the industry. Choose Texas Instruments for superior quality and unmatched advantages in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

The surface mount capability of the product allows for easy assembly onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage of 1.26 V ensures stable and consistent performance in a wide range of operating conditions.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it suitable for compact electronic designs.

No. of Terminals: 419

The high number of terminals (419) provides ample connectivity options for interfacing with other components, enhancing the versatility of the product.

Package Style (Meter): GRID ARRAY

The grid array package style enables efficient heat dissipation and conductivity, maintaining optimal performance levels under various operating conditions.

Minimum Supply Voltage: 1.116 V

The low minimum supply voltage of 1.116 V ensures energy efficiency and helps in optimizing power consumption, making the product cost-effective in the long run.

Maximum Operating Temperature: 55 °C

The high maximum operating temperature of 55°C ensures the product can withstand harsh environmental conditions, increasing its overall reliability.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the product to function effectively even in cold environments, making it suitable for a wide range of applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and maintenance of the product, enhancing user convenience and reducing assembly time.

Maximum Seated Height: 2.36 mm

The maximum seated height of 2.36 mm allows for a low-profile design, making it suitable for compact electronic devices where space is limited.

Width: 23 mm

The width of 23 mm ensures compatibility with standard board sizes, simplifying integration into existing electronic systems.

Length: 23 mm

The length of 23 mm provides a compact form factor, making the product ideal for applications where space is a constraint.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for use in standard commercial applications, ensuring compatibility with a wide range of systems.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC type enhances the processing capabilities of the product, making it suitable for complex computational tasks.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, resulting in efficient operation and improved reliability of the product.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and simplifies the assembly process, enhancing the overall performance and durability of the product.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures compatibility with standard power sources, making the product easy to integrate into existing electronic systems.

Terminal Pitch: 1 mm

The terminal pitch of 1 mm allows for high-density mounting, enabling increased connectivity options and compact design solutions in electronic applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DLPC6401ZFF attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B419

Length:

23 mm

No. of Terminals:

419

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.36 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.116 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

DLPC6401ZFF Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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