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DLPC3434CZVB

Texas Instruments

DLPC3434CZVB by Texas Instruments

DLPC3434CZVB by Texas Instruments is a MICROPROCESSOR CIRCUIT with 176 terminals in a GRID ARRAY package. It features a very thin profile, fine pitch, and CMOS technology. Ideal for applications requiring high processing power in compact spaces.

Median Price

$21.770

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 200 parts In-Stock

1+ parts

$3.460

100+ parts

-

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-

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200

$3.460

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Texas Instruments

USA . 126,100 parts In-Stock

1+ parts

$18.260

100+ parts

$15.950

1k+ parts

$11.000

10k+ parts

-

126,100

$18.260

$15.950

$11.000

-

Mouser Electronics

USA . 173 parts In-Stock

1+ parts

$25.280

100+ parts

$16.890

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-

10k+ parts

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173

$25.280

$16.890

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DigiKey

USA . 258 parts In-Stock

1+ parts

$27.760

100+ parts

$19.566

1k+ parts

-

10k+ parts

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258

$27.760

$19.566

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,431 parts In-Stock

1+ parts

$3.287

100+ parts

-

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3,431

$3.287

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Vyrian

USA . 4,237 parts In-Stock

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-

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4,237

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,569 parts In-Stock

1+ parts

$3.114

100+ parts

-

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4,569

$3.114

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Native Components

USA . 976 parts In-Stock

1+ parts

$12.221

100+ parts

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976

$12.221

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Northwest PG Solutions

USA . 326 parts In-Stock

1+ parts

$13.443

100+ parts

$12.099

1k+ parts

-

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326

$13.443

$12.099

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Corohmni

South Africa . 585 parts In-Stock

1+ parts

$24.592

100+ parts

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585

$24.592

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Microchip USA

USA . 1,855 parts In-Stock

1+ parts

$60.540

100+ parts

$59.480

1k+ parts

$58.960

10k+ parts

$58.430

1,855

$60.540

$59.480

$58.960

$58.430

Parana Technologies

USA . 476 parts In-Stock

1+ parts

$69.061

100+ parts

-

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476

$69.061

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ChromeModa Solutions

Germany . 6,699 parts In-Stock

1+ parts

$77.597

100+ parts

$63.630

1k+ parts

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10k+ parts

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6,699

$77.597

$63.630

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IDEA Electronic Components Group

UK . 363 parts In-Stock

1+ parts

$77.597

100+ parts

$73.717

1k+ parts

$69.837

10k+ parts

-

363

$77.597

$73.717

$69.837

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QUARKTWIN TECHNOLOGY LTD

USA . 26,215 parts In-Stock

1+ parts

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26,215

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Lixinc

USA . 10,687 parts In-Stock

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10,687

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DigiPath Technology Company

USA . 1,689 parts In-Stock

1+ parts

-

100+ parts

$69.961

1k+ parts

-

10k+ parts

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1,689

-

$69.961

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Overview

Unlock the power of innovation with the DLPC3434CZVB by Texas Instruments. This cutting-edge microprocessor circuit offers unparalleled quality and reliability, thanks to the renowned manufacturer's expertise in semiconductor technology. Ideal for a wide range of applications in the electronics industry, this versatile IC delivers exceptional value and performance. With its compact design and advanced features, the DLPC3434CZVB is the perfect choice for customers seeking top-notch functionality and seamless integration. Elevate your projects to new heights with this state-of-the-art solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to heat and moisture, making the product reliable in various environments.

Surface Mount: YES

Surface mount technology allows for more efficient and compact PCB design, saving space and reducing assembly time.

Package Shape: SQUARE

Square shape makes it easier to handle and align during assembly, reducing the chance of errors.

No. of Terminals: 176

High number of terminals allow for complex circuit connections and functionalities to be integrated into the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DLPC3434CZVB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B176

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

176

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

DLPC3434CZVB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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