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DLPC2607ZVB

Texas Instruments

DLPC2607ZVB by Texas Instruments

DLPC2607ZVB by Texas Instruments is a MICROPROCESSOR CIRCUIT with 176 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C, with supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high performance and low power consumption.

Median Price

$12.540

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 59,931 parts In-Stock

1+ parts

$11.205

100+ parts

$9.788

1k+ parts

$6.750

10k+ parts

-

59,931

$11.205

$9.788

$6.750

-

Rochester

USA . 96 parts In-Stock

1+ parts

$12.540

100+ parts

$12.290

1k+ parts

$12.040

10k+ parts

-

96

$12.540

$12.290

$12.040

-

DigiKey

USA . 234 parts In-Stock

1+ parts

$21.600

100+ parts

$15.013

1k+ parts

-

10k+ parts

-

234

$21.600

$15.013

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 8 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

10k+ parts

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8

$8.000

-

-

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DF Sales Co.

USA . 8 parts In-Stock

1+ parts

$8.000

100+ parts

-

1k+ parts

-

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8

$8.000

-

-

-

Bristol Electronics

USA . 235 parts In-Stock

1+ parts

$10.116

100+ parts

$6.070

1k+ parts

$5.817

10k+ parts

-

235

$10.116

$6.070

$5.817

-

Digiode

USA . 4,497 parts In-Stock

1+ parts

$10.645

100+ parts

-

1k+ parts

-

10k+ parts

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4,497

$10.645

-

-

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Vyrian

USA . 8,649 parts In-Stock

1+ parts

-

100+ parts

-

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8,649

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-

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Dan-Mar Components

USA . 235 parts In-Stock

1+ parts

-

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-

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235

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,391 parts In-Stock

1+ parts

$10.084

100+ parts

-

1k+ parts

-

10k+ parts

-

2,391

$10.084

-

-

-

Microchip USA

USA . 2,678 parts In-Stock

1+ parts

$40.100

100+ parts

$39.520

1k+ parts

$39.240

10k+ parts

$38.950

2,678

$40.100

$39.520

$39.240

$38.950

Parana Technologies

USA . 647 parts In-Stock

1+ parts

$46.688

100+ parts

-

1k+ parts

-

10k+ parts

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647

$46.688

-

-

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Corohmni

South Africa . 261 parts In-Stock

1+ parts

$48.501

100+ parts

-

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-

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261

$48.501

-

-

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DigiPath Technology Company

USA . 1,320 parts In-Stock

1+ parts

$51.409

100+ parts

-

1k+ parts

-

10k+ parts

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1,320

$51.409

-

-

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ChromeModa Solutions

Germany . 5,672 parts In-Stock

1+ parts

$52.458

100+ parts

$43.016

1k+ parts

-

10k+ parts

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5,672

$52.458

$43.016

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IDEA Electronic Components Group

UK . 759 parts In-Stock

1+ parts

$52.458

100+ parts

$49.835

1k+ parts

$47.212

10k+ parts

-

759

$52.458

$49.835

$47.212

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A-Z Elektronik GmbH

Germany . 6,155 parts In-Stock

1+ parts

-

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6,155

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

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6,000

-

-

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Alle Elektronik GmbH

Germany . 4,103 parts In-Stock

1+ parts

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4,103

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Northwest PG Solutions

USA . 1,981 parts In-Stock

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1,981

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Lixinc

USA . 1,272 parts In-Stock

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1,272

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Native Components

USA . 512 parts In-Stock

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512

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Futuretech Components

Singapore . 171 parts In-Stock

1+ parts

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171

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Overview

Discover the cutting-edge technology of the DLPC2607ZVB by Texas Instruments, a top-of-the-line microprocessor circuit designed for various applications. With a sleek square package body and 176 terminals, this device offers unmatched quality and reliability. Perfect for a range of functions, this innovative product is sure to elevate your projects to the next level. Trust in Texas Instruments' reputation for excellence and experience the value and benefits that the DLPC2607ZVB brings to your work. Elevate your performance and efficiency with this state-of-the-art peripheral IC - your ultimate solution for all your microprocessing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and space.

Maximum Supply Voltage: 1.05 V

With a maximum supply voltage of 1.05 V, this IC is energy efficient and can operate within a low power range.

Package Shape: SQUARE

The square package shape allows for easier handling and placement on the PCB, optimizing space utilization.

No. of Terminals: 176

The high number of terminals allows for connectivity to various external peripherals, enhancing the IC's functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch design enables high-density mounting and improved signal integrity.

Minimum Supply Voltage: 0.95 V

With a minimum supply voltage of 0.95 V, this IC can operate efficiently even at low power levels.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the IC can function reliably even in elevated temperature environments.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows the IC to operate in colder environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making the assembly process more efficient.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this IC can withstand the reflow soldering process without damage.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this IC offers advanced processing capabilities and can handle complex algorithms efficiently.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology provides low power consumption and high noise immunity for energy-efficient operation.

Terminal Form: BALL

The ball terminal form allows for easy and reliable solder connections during PCB assembly.

Nominal Supply Voltage: 1 V

The nominal supply voltage of 1 V ensures compatibility with standard power sources, making integration easier.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the IC is sensitive to moisture but can be safely handled with appropriate precautions during storage and assembly.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DLPC2607ZVB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B176

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

176

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

DLPC2607ZVB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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