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DLPC3438CZEZ

Texas Instruments

DLPC3438CZEZ by Texas Instruments

DLPC3438CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with 201 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C, with supply voltage ranging from 1.045V to 1.155V. Ideal for applications requiring high performance and low power consumption.

Median Price

$27.760

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 228 parts In-Stock

1+ parts

$18.260

100+ parts

$15.950

1k+ parts

$11.000

10k+ parts

-

228

$18.260

$15.950

$11.000

-

DigiKey

USA . 238 parts In-Stock

1+ parts

$27.760

100+ parts

$21.041

1k+ parts

$19.418

10k+ parts

-

238

$27.760

$21.041

$19.418

-

Mouser Electronics

USA . 76 parts In-Stock

1+ parts

$27.760

100+ parts

$21.050

1k+ parts

$18.520

10k+ parts

-

76

$27.760

$21.050

$18.520

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,501 parts In-Stock

1+ parts

$17.347

100+ parts

-

1k+ parts

-

10k+ parts

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1,501

$17.347

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-

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Vyrian

USA . 240 parts In-Stock

1+ parts

$18.260

100+ parts

-

1k+ parts

-

10k+ parts

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240

$18.260

-

-

-

Cyclops Electronics Ltd

UK . 2,443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,443

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 981 parts In-Stock

1+ parts

$1.176

100+ parts

-

1k+ parts

-

10k+ parts

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981

$1.176

-

-

-

Northwest PG Solutions

USA . 314 parts In-Stock

1+ parts

$1.294

100+ parts

-

1k+ parts

-

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314

$1.294

-

-

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Parana Technologies

USA . 818 parts In-Stock

1+ parts

$14.096

100+ parts

-

1k+ parts

$14.561

10k+ parts

-

818

$14.096

-

$14.561

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ChromeModa Solutions

Germany . 2,617 parts In-Stock

1+ parts

$15.838

100+ parts

$12.987

1k+ parts

-

10k+ parts

-

2,617

$15.838

$12.987

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-

IDEA Electronic Components Group

UK . 175 parts In-Stock

1+ parts

$15.838

100+ parts

$15.046

1k+ parts

$14.254

10k+ parts

-

175

$15.838

$15.046

$14.254

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Corphita

USA . 576 parts In-Stock

1+ parts

$16.434

100+ parts

-

1k+ parts

-

10k+ parts

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576

$16.434

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-

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Corohmni

South Africa . 680 parts In-Stock

1+ parts

$42.009

100+ parts

-

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10k+ parts

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680

$42.009

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Microchip USA

USA . 1,150 parts In-Stock

1+ parts

$60.540

100+ parts

$59.480

1k+ parts

$58.960

10k+ parts

$58.430

1,150

$60.540

$59.480

$58.960

$58.430

Lixinc

USA . 19,834 parts In-Stock

1+ parts

-

100+ parts

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19,834

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-

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A-Z Elektronik GmbH

Germany . 7,536 parts In-Stock

1+ parts

-

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7,536

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-

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Alle Elektronik GmbH

Germany . 4,383 parts In-Stock

1+ parts

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4,383

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-

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DigiPath Technology Company

USA . 1,155 parts In-Stock

1+ parts

-

100+ parts

$14.280

1k+ parts

-

10k+ parts

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1,155

-

$14.280

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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500

-

-

-

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Futuretech Components

Singapore . 280 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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280

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-

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Overview

Experience the cutting-edge technology of the DLPC3438CZEZ by Texas Instruments, a high-quality microprocessor circuit designed to meet all your electronic needs. With a very thin profile and fine pitch package style, this versatile IC is perfect for a wide range of applications. From smart home devices to industrial automation, this product offers unmatched value and benefits to customers. Trust in Texas Instruments' reputation for excellence and innovation, and elevate your projects to the next level with the DLPC3438CZEZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and ensures the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving time and effort in assembly.

Maximum Supply Voltage: 1.155 V

Higher maximum supply voltage allows for flexibility in power input options.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the PCB, optimizing layout design.

No. of Terminals: 201

Higher number of terminals allows for more connectivity options and functionality in the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the product can perform reliably even in demanding conditions.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows for use in a wide range of environments, including cold temperatures.

Terminal Finish: TIN SILVER COPPER

Tin silver copper finish provides excellent conductivity and corrosion resistance for enhanced performance.

Width: 13 mm

Compact width dimensions make the product suitable for applications where space is limited.

Peak Reflow Temperature °C: 260

Ability to withstand peak reflow temperatures of 260°C ensures reliability during soldering processes.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DLPC3438CZEZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

201

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

DLPC3438CZEZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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