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DLPC900AZPC

Texas Instruments

DLPC900AZPC by Texas Instruments

DLPC900AZPC by Texas Instruments is a MICROPROCESSOR CIRCUIT with 516 terminals, operating at a max clock frequency of 20 MHz. It is used in applications requiring I2C, SPI, UART, and USB bus compatibility.

Median Price

$341.076

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17 parts In-Stock

1+ parts

$268.682

100+ parts

$213.240

1k+ parts

-

10k+ parts

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17

$268.682

$213.240

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-

DigiKey

USA . 2 parts In-Stock

1+ parts

$413.470

100+ parts

$345.423

1k+ parts

-

10k+ parts

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2

$413.470

$345.423

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,234 parts In-Stock

1+ parts

$255.248

100+ parts

-

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2,234

$255.248

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$292.118

100+ parts

-

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150

$292.118

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-

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Vyrian

USA . 2,749 parts In-Stock

1+ parts

-

100+ parts

-

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2,749

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Chip Stock

USA . 208 parts In-Stock

1+ parts

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208

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 822 parts In-Stock

1+ parts

$8.021

100+ parts

-

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822

$8.021

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Parana Technologies

USA . 1 parts In-Stock

1+ parts

$54.382

100+ parts

-

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1

$54.382

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DigiPath Technology Company

USA . 1,082 parts In-Stock

1+ parts

$59.881

100+ parts

$55.090

1k+ parts

-

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1,082

$59.881

$55.090

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ChromeModa Solutions

Germany . 4,539 parts In-Stock

1+ parts

$61.103

100+ parts

$50.104

1k+ parts

-

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4,539

$61.103

$50.104

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IDEA Electronic Components Group

UK . 92 parts In-Stock

1+ parts

$61.103

100+ parts

$58.048

1k+ parts

$54.993

10k+ parts

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92

$61.103

$58.048

$54.993

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Corohmni

South Africa . 41 parts In-Stock

1+ parts

$69.015

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41

$69.015

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Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$228.380

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10

$228.380

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Corphita

USA . 3,364 parts In-Stock

1+ parts

$241.814

100+ parts

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3,364

$241.814

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$292.118

100+ parts

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2,000

$292.118

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Lixinc

USA . 11,697 parts In-Stock

1+ parts

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100+ parts

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11,697

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

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Overview

Experience the next level of performance and innovation with the DLPC900AZPC by Texas Instruments. As a leader in the industry, Texas Instruments brings unrivaled quality and expertise to every product they create. The DLPC900AZPC is a cutting-edge Other Function uPs,uCs & Peripheral IC that offers endless possibilities for applications. With its sleek design and advanced features, this product delivers unmatched value and benefits to customers. Whether you're looking to enhance your device's functionality or streamline your processes, the DLPC900AZPC is the perfect choice. Don't miss out on the advantages this exceptional product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures the product's durability and resistance to environmental conditions, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount feature enables easy and efficient installation, making the product suitable for high-volume production.

Maximum Supply Voltage: 1.2 V

With a higher supply voltage, this product can handle more demanding tasks and provide reliable performance.

Package Shape: SQUARE

The square shape offers better space utilization and allows for efficient integration into various systems.

No. of Terminals: 516

This extensive number of terminals enhances connectivity options and enables versatility in application designs.

Package Style (Meter): GRID ARRAY

The grid array package style provides improved electrical performance, thermal management, and mechanical stability.

Minimum Supply Voltage: 1.1 V

The low supply voltage requirement of this product ensures energy efficiency and extends battery life.

Maximum Operating Temperature: 55 °C

With a high maximum operating temperature, this product can withstand demanding operating environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures allows for reliable performance in various climates and conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and improves signal integrity, making it easier to design and manufacture.

Maximum Seated Height: 2.42 mm

The compact and low profile design of this product allows for flexibility in space-constrained applications.

Width: 27 mm

The 27 mm width ensures compatibility with standard board sizes and allows for easy integration into existing systems.

External Data Bus Width: 16

With a large external data bus width, this product can handle and process significant amounts of data efficiently.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency enables fast and responsive operation, improving overall system performance.

Length: 27 mm

The 27 mm length ensures compatibility with standard board sizes and allows for easy integration into existing systems.

Temperature Grade: COMMERCIAL

This product is designed and rated for commercial-grade temperature ranges, making it suitable for most common applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

With its microprocessor circuit architecture, this product offers advanced processing capabilities, enabling complex functions and tasks.

Technology: CMOS

The CMOS technology used in this product provides low power consumption, high immunity to noise, and compatibility with different digital systems.

Terminal Form: BALL

The ball terminal form simplifies soldering and assembly processes, facilitating efficient production and maintenance.

Nominal Supply Voltage: 1.15 V

The precise nominal supply voltage ensures consistent and reliable performance, reducing the risk of errors or malfunctions.

Bus Compatibility: I2C; SPI; UART; USB

The support for multiple bus protocols allows for seamless integration with different devices and systems, expanding its usability.

Terminal Pitch: 1 mm

With a compact 1 mm terminal pitch, this product can accommodate a large number of terminals in a limited space, optimizing design flexibility.

No. of I/O Lines: 9

The 9 I/O lines provide ample connectivity options for interfacing with external devices, maximizing the product's versatility.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DLPC900AZPC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B516

Length:

27 mm

No. of I/O Lines:

9

No. of Terminals:

516

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.42 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

DLPC900AZPC Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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