Loading...

DLPC230TZDQRQ1

Texas Instruments

DLPC230TZDQRQ1 by Texas Instruments

DLPC230TZDQRQ1 by Texas Instruments is a CMOS microprocessor circuit with 324 terminals in a grid array package. It operates b/w -40 to 105 °C, suitable for industrial applications. With a supply voltage range of 1.045V to 1.155V, it is ideal for various functions in automotive electronics and other peripheral ICs.

Median Price

$36.096

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 250 parts In-Stock

1+ parts

$29.082

100+ parts

$25.851

1k+ parts

$19.008

10k+ parts

-

250

$29.082

$25.851

$19.008

-

Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$43.110

100+ parts

$32.010

1k+ parts

$30.180

10k+ parts

-

2

$43.110

$32.010

$30.180

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,606 parts In-Stock

1+ parts

$27.628

100+ parts

-

1k+ parts

-

10k+ parts

-

2,606

$27.628

-

-

-

Vyrian

USA . 7,464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,464

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 773 parts In-Stock

1+ parts

$0.105

100+ parts

-

1k+ parts

-

10k+ parts

$0.101

773

$0.105

-

-

$0.101

Northwest PG Solutions

USA . 457 parts In-Stock

1+ parts

$0.116

100+ parts

-

1k+ parts

-

10k+ parts

$0.102

457

$0.116

-

-

$0.102

Corohmni

South Africa . 1,130 parts In-Stock

1+ parts

$23.207

100+ parts

-

1k+ parts

-

10k+ parts

-

1,130

$23.207

-

-

-

Corphita

USA . 1,220 parts In-Stock

1+ parts

$26.174

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

$26.174

-

-

-

Parana Technologies

USA . 1,075 parts In-Stock

1+ parts

$70.322

100+ parts

-

1k+ parts

-

10k+ parts

-

1,075

$70.322

-

-

-

DigiPath Technology Company

USA . 143 parts In-Stock

1+ parts

$77.433

100+ parts

$71.238

1k+ parts

-

10k+ parts

-

143

$77.433

$71.238

-

-

ChromeModa Solutions

Germany . 4,912 parts In-Stock

1+ parts

$79.013

100+ parts

$64.791

1k+ parts

-

10k+ parts

-

4,912

$79.013

$64.791

-

-

IDEA Electronic Components Group

UK . 1,036 parts In-Stock

1+ parts

$79.013

100+ parts

$75.062

1k+ parts

$71.112

10k+ parts

-

1,036

$79.013

$75.062

$71.112

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Overview

Experience unparalleled quality and innovation with the Texas Instruments DLPC230TZDQRQ1. As a leading manufacturer in the industry, Texas Instruments delivers reliable products that exceed expectations. This versatile microprocessor circuit is perfect for a wide range of applications, offering customers exceptional value and performance. Trust Texas Instruments to provide cutting-edge technology that meets your needs with precision and efficiency. Choose the DLPC230TZDQRQ1 for superior results in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material offers good durability and protection for the integrated circuits inside, making the product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.155 V

A high maximum supply voltage allows for flexibility in power input, catering to different voltage requirements in diverse systems.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality standards, making the product suitable for automotive and other demanding environments.

Package Shape: SQUARE

Square package shape enables efficient use of space on circuit boards and easy placement within electronic devices.

No. of Terminals: 324

Having 324 terminals provides a high level of connectivity options, allowing for complex circuit designs and functionality.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the circuit board, enhancing assembly efficiency.

Maximum Seated Height: 2.352 mm

A relatively low maximum seated height contributes to a compact overall design, especially important in space-constrained applications.

Width: 23 mm

A width of 23 mm ensures compatibility with standard board dimensions and allows for seamless integration into various electronic systems.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature range operations, this product is suitable for use in harsh environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as a peripheral IC enhances the processing capabilities of the product, enabling advanced functionalities and performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high-speed operation, making the product efficient and suitable for various power-sensitive applications.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V indicates compatibility with standard voltage levels, ensuring easy integration into existing systems.

Terminal Pitch: 1 mm

With a terminal pitch of 1 mm, the product supports high-density packaging and allows for closer positioning of terminals, facilitating intricate circuit designs.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DLPC230TZDQRQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B324

Length:

23 mm

No. of Terminals:

324

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Screening Level:

AEC-Q100

Maximum Seated Height:

2.352 mm

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

DLPC230TZDQRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 16