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DLPC3433CZVB

Texas Instruments

DLPC3433CZVB by Texas Instruments

DLPC3433CZVB by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -30 to 85 °C, with supply voltage range of 1.045V to 1.155V. This IC is ideal for applications requiring high performance in a compact form factor.

Median Price

$23.010

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 499 parts In-Stock

1+ parts

$18.260

100+ parts

$15.950

1k+ parts

$11.000

10k+ parts

-

499

$18.260

$15.950

$11.000

-

DigiKey

USA . 2,616 parts In-Stock

1+ parts

$27.760

100+ parts

$19.566

1k+ parts

$18.418

10k+ parts

-

2,616

$27.760

$19.566

$18.418

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,056 parts In-Stock

1+ parts

$17.347

100+ parts

-

1k+ parts

-

10k+ parts

-

4,056

$17.347

-

-

-

Vyrian

USA . 891 parts In-Stock

1+ parts

$18.260

100+ parts

-

1k+ parts

-

10k+ parts

-

891

$18.260

-

-

-

Bristol Electronics

USA . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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22

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 307 parts In-Stock

1+ parts

$0.160

100+ parts

-

1k+ parts

-

10k+ parts

$0.154

307

$0.160

-

-

$0.154

Northwest PG Solutions

USA . 905 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

$0.156

905

$0.176

-

-

$0.156

Corphita

USA . 1,461 parts In-Stock

1+ parts

$16.434

100+ parts

-

1k+ parts

-

10k+ parts

-

1,461

$16.434

-

-

-

Corohmni

South Africa . 2,204 parts In-Stock

1+ parts

$53.099

100+ parts

-

1k+ parts

-

10k+ parts

-

2,204

$53.099

-

-

-

Parana Technologies

USA . 257 parts In-Stock

1+ parts

$59.089

100+ parts

-

1k+ parts

-

10k+ parts

-

257

$59.089

-

-

-

Microchip USA

USA . 2,057 parts In-Stock

1+ parts

$60.540

100+ parts

$59.480

1k+ parts

$58.960

10k+ parts

$58.430

2,057

$60.540

$59.480

$58.960

$58.430

DigiPath Technology Company

USA . 1,231 parts In-Stock

1+ parts

$65.064

100+ parts

-

1k+ parts

-

10k+ parts

-

1,231

$65.064

-

-

-

ChromeModa Solutions

Germany . 6,780 parts In-Stock

1+ parts

$66.392

100+ parts

$54.441

1k+ parts

-

10k+ parts

-

6,780

$66.392

$54.441

-

-

IDEA Electronic Components Group

UK . 2,079 parts In-Stock

1+ parts

$66.392

100+ parts

$63.072

1k+ parts

$59.753

10k+ parts

-

2,079

$66.392

$63.072

$59.753

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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29,299

-

-

-

-

Lixinc

USA . 18,832 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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18,832

-

-

-

-

Overview

Experience the cutting-edge technology of Texas Instruments with the DLPC3433CZVB. This highly advanced microprocessor circuit offers unparalleled performance and precision, making it ideal for a wide range of applications. From consumer electronics to industrial automation, this versatile IC delivers superior functionality and reliability. Trust in the quality and expertise of Texas Instruments to bring you the best in semiconductor innovation. Upgrade your products today with the DLPC3433CZVB and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards, saving time and cost.

Maximum Supply Voltage: 1.155 V

The high maximum supply voltage ensures stable and reliable operation under varying input voltage conditions.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the circuit board, especially in compact designs.

No. of Terminals: 176

Having a high number of terminals allows for versatile connectivity options and functionality in the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a thin profile and fine pitch enhances the overall performance and reliability of the product.

Minimum Supply Voltage: 1.045 V

The low minimum supply voltage ensures energy efficiency and extends the product's battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures the product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows the product to function effectively even in cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the assembly process and reduces the overall height profile of the product.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a compact and slim design of the product, suitable for space-constrained applications.

Width: 7 mm

The width of 7mm provides a balance between space-saving and sufficient surface area for connectivity and functionality.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature prevents overheating and ensures the integrity of the product during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering and assembly of the product on circuit boards.

Length: 7 mm

The length of 7mm complements the width and overall dimensions of the product, contributing to an optimized form factor.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC enhances the processing capabilities and functionality of the product.

Technology: CMOS

The CMOS technology ensures low power consumption and high-speed operation, making the product energy-efficient and performance-oriented.

Terminal Form: BALL

The terminal form of balls provides reliable connections, excellent conductivity, and ease of mounting on circuit boards.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V is ideal for stable and optimal performance of the product in various operating conditions.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm allows for high-density mounting and efficient use of PCB space, essential for compact designs.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the product has a moderate level of sensitivity to moisture, requiring proper handling and storage to maintain reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DLPC3433CZVB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B176

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

176

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

DLPC3433CZVB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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