Loading...

DLPC900ZPC

Texas Instruments

DLPC900ZPC by Texas Instruments

DLPC900ZPC by Texas Instruments is a 516-terminal microprocessor circuit with CMOS technology. It operates b/w 0-55°C, supports I2C, SPI, UART, and USB buses, and has a clock frequency of up to 20 MHz. Ideal for applications requiring a low-voltage supply and high data bus width in a compact grid array package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,881

-

-

-

-

Digiode

USA . 1,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,872

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 384 parts In-Stock

1+ parts

$5.383

100+ parts

-

1k+ parts

-

10k+ parts

-

384

$5.383

-

-

-

One Stop Electronics

USA . 502 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

-

10k+ parts

-

502

$9.000

-

-

-

Parana Technologies

USA . 601 parts In-Stock

1+ parts

$14.940

100+ parts

-

1k+ parts

$15.363

10k+ parts

-

601

$14.940

-

$15.363

-

DigiPath Technology Company

USA . 1,898 parts In-Stock

1+ parts

$16.451

100+ parts

-

1k+ parts

-

10k+ parts

-

1,898

$16.451

-

-

-

ChromeModa Solutions

Germany . 3,614 parts In-Stock

1+ parts

$16.787

100+ parts

$13.765

1k+ parts

-

10k+ parts

-

3,614

$16.787

$13.765

-

-

IDEA Electronic Components Group

UK . 1,343 parts In-Stock

1+ parts

$16.787

100+ parts

$15.948

1k+ parts

$15.108

10k+ parts

-

1,343

$16.787

$15.948

$15.108

-

Ampacity Inc.

Singapore . 599 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

-

599

$27.000

-

-

-

Corohmni

South Africa . 3,250 parts In-Stock

1+ parts

$78.030

100+ parts

-

1k+ parts

-

10k+ parts

-

3,250

$78.030

-

-

-

Corphita

USA . 2,958 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,958

-

-

-

-

Microchip USA

USA . 475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

475

-

-

-

-

Bastille Electronics

Australia . 92 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

92

-

-

-

-

Overview

Experience cutting-edge technology with the Texas Instruments DLPC900ZPC, a high-quality microprocessor circuit designed for a wide range of applications. Texas Instruments is renowned for its reliable and innovative products, and the DLPC900ZPC is no exception. From IoT devices to consumer electronics, this versatile IC offers unmatched value, performance, and efficiency. Trust Texas Instruments to deliver superior solutions for your next project. Unlock endless possibilities with the DLPC900ZPC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 1.2 V

Operates within a safe voltage range to prevent damage to the product.

Package Shape: SQUARE

Square shape allows for efficient placement on the PCB.

No. of Terminals: 516

Having a high number of terminals provides ample connectivity options.

Package Style (Meter): GRID ARRAY

Grid array packaging offers high density and reliability.

Minimum Supply Voltage: 1.1 V

Allows for operation at lower voltages for energy efficiency.

Maximum Operating Temperature: 55 °C

Can withstand high operating temperatures for extended use.

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments without performance issues.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and routing.

Maximum Seated Height: 2.42 mm

Low seated height allows for compact design and integration into tight spaces.

Width: 27 mm

Compact width for space-constrained applications.

External Data Bus Width: 16

Wide external data bus width for fast data transfer and processing.

Maximum Clock Frequency: 20 MHz

High clock frequency for rapid operation and data processing.

Length: 27 mm

Compact length for space-saving PCB design.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Features advanced microprocessor circuitry for efficient and powerful performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form facilitates easy and reliable soldering onto the PCB.

Nominal Supply Voltage: 1.15 V

Stable nominal supply voltage for consistent operation.

Bus Compatibility: I2C; SPI; UART; USB

Supports multiple bus protocols for versatile connectivity options.

Terminal Pitch: 1 mm

Fine terminal pitch for high-density integration and connectivity.

No. of I/O Lines: 9

Sufficient I/O lines for interfacing with external components and peripherals.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DLPC900ZPC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; SPI; UART; USB

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B516

Length:

27 mm

No. of I/O Lines:

9

No. of Terminals:

516

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.42 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

DLPC900ZPC Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 16