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DLPC910ZYR

Texas Instruments

DLPC910ZYR by Texas Instruments

DLPC910ZYR by Texas Instruments is a 676-terminal microprocessor circuit with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring I2C and USB bus compatibility in a compact 27x27mm grid array package.

Median Price

$538.996

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 35 parts In-Stock

1+ parts

$356.682

100+ parts

$320.099

1k+ parts

$310.526

10k+ parts

-

35

$356.682

$320.099

$310.526

-

Texas Instruments

USA . 1,182 parts In-Stock

1+ parts

$431.172

100+ parts

$342.200

1k+ parts

-

10k+ parts

-

1,182

$431.172

$342.200

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-

Mouser Electronics

USA . 11 parts In-Stock

1+ parts

$646.820

100+ parts

-

1k+ parts

-

10k+ parts

-

11

$646.820

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-

-

DigiKey

USA . 1 parts In-Stock

1+ parts

$646.830

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$646.830

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,667 parts In-Stock

1+ parts

$409.613

100+ parts

-

1k+ parts

-

10k+ parts

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2,667

$409.613

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-

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Vyrian

USA . 6,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,792

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 237 parts In-Stock

1+ parts

$0.132

100+ parts

-

1k+ parts

-

10k+ parts

$0.127

237

$0.132

-

-

$0.127

Northwest PG Solutions

USA . 1,881 parts In-Stock

1+ parts

$0.145

100+ parts

-

1k+ parts

-

10k+ parts

$0.128

1,881

$0.145

-

-

$0.128

Parana Technologies

USA . 2,121 parts In-Stock

1+ parts

$55.322

100+ parts

-

1k+ parts

-

10k+ parts

-

2,121

$55.322

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-

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DigiPath Technology Company

USA . 2,101 parts In-Stock

1+ parts

$60.916

100+ parts

$56.043

1k+ parts

-

10k+ parts

-

2,101

$60.916

$56.043

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ChromeModa Solutions

Germany . 2,605 parts In-Stock

1+ parts

$62.159

100+ parts

$50.970

1k+ parts

-

10k+ parts

-

2,605

$62.159

$50.970

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IDEA Electronic Components Group

UK . 1,067 parts In-Stock

1+ parts

$62.159

100+ parts

$59.051

1k+ parts

$55.943

10k+ parts

-

1,067

$62.159

$59.051

$55.943

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Corohmni

South Africa . 112 parts In-Stock

1+ parts

$84.611

100+ parts

-

1k+ parts

-

10k+ parts

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112

$84.611

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Corphita

USA . 3,699 parts In-Stock

1+ parts

$388.055

100+ parts

-

1k+ parts

-

10k+ parts

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3,699

$388.055

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Microchip USA

USA . 1,484 parts In-Stock

1+ parts

$464.090

100+ parts

$451.720

1k+ parts

$445.530

10k+ parts

$439.340

1,484

$464.090

$451.720

$445.530

$439.340

Overview

Experience superior performance and reliability with the DLPC910ZYR from Texas Instruments. This cutting-edge microprocessor circuit offers unmatched quality and precision, making it ideal for a wide range of applications. With its advanced technology and innovative design, this product delivers exceptional value and benefits to customers, ensuring seamless operation and optimal efficiency. Trust Texas Instruments for excellence in every detail, and elevate your projects to new heights with the DLPC910ZYR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package durable and resistant to external factors, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount design allows for easy installation and assembly, making the product suitable for mass production.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05V ensures efficient power consumption and prevents overheating.

Package Shape: SQUARE

Square package shape is compact and space-efficient, making it suitable for applications where size is a constraint.

No. of Terminals: 676

Large number of terminals allow for connectivity to multiple external devices, enhancing the versatility of the product.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Grid array package style with heat sink/slud design enables efficient heat dissipation, maintaining optimal operating temperatures.

Minimum Supply Voltage: 0.95 V

Operating at a minimum supply voltage of 0.95V ensures reliable performance even under low power conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C enables the product to function effectively in various working environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures the product can be used in cold temperature settings without compromising performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation process and allows for easy access during maintenance procedures.

Maximum Seated Height: 3 mm

Low maximum seated height of 3mm ensures the product can be accommodated in slim devices or tight spaces.

Width: 27 mm

Compact width of 27mm makes the product suitable for applications with limited space availability.

Length: 27 mm

Compact length of 27mm ensures the product can be integrated into smaller devices or circuit boards.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type enables the product to perform complex computations and handle advanced functionalities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: BALL

Ball terminal form provides reliable connectivity and enables the product to withstand mechanical stress during operation.

Nominal Supply Voltage: 1 V

Having a nominal supply voltage of 1V ensures stability in power delivery and consistent performance.

Bus Compatibility: I2C; USB

Compatibility with I2C and USB buses allows for seamless integration with a variety of communication protocols and devices.

Terminal Pitch: 1 mm

Terminal pitch of 1mm facilitates easy soldering and connection, simplifying the assembly process.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DLPC910ZYR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

I2C; USB

JESD-30 Code:

S-PBGA-B676

Length:

27 mm

No. of Terminals:

676

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

3 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

DLPC910ZYR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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