Loading...

BALL Other Function uPs,uCs & Peripheral ICs 1,582

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCZU2CG-L2SFVA625E by Xilinx

XCZU2CG-L2SFVA625E

Xilinx

XCZU2CG-L2SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with 625 terminals in a GRID ARRAY package. It operates b/w 0-110 °C with supply voltage range of 0.698-0.742 V. Ideal for applications requiring high-performance processing capabilities in various electronic systems.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B625

e1

4

625

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-1SBVA484E by Xilinx

XCZU2EG-1SBVA484E

Xilinx

XCZU2EG-1SBVA484E by Xilinx is a CMOS PROGRAMMABLE SoC with 484 BALL terminals. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing in compact form factors.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU2EG-1SBVA484I by Xilinx

XCZU2EG-1SBVA484I

Xilinx

The Xilinx XCZU2EG-1SBVA484I is a programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. With 484 terminals in a grid array package, it's ideal for industrial applications requiring high-performance processing capabilities.

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU2EG-1SFVA625E by Xilinx

XCZU2EG-1SFVA625E

Xilinx

XCZU2EG-1SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 625 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for applications requiring low power consumption and high performance in various electronic devices.

R-PBGA-B625

e1

4

625

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-1SFVA625I by Xilinx

XCZU2EG-1SFVA625I

Xilinx

XCZU2EG-1SFVA625I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 625 terminals in a GRID ARRAY package style. Suitable for industrial applications, it has a supply voltage range of 0.825V to 0.876V.

R-PBGA-B625

e1

4

625

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-1SFVC784E by Xilinx

XCZU2EG-1SFVC784E

Xilinx

XCZU2EG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. Ideal for applications requiring high-performance computing in compact form factors.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-1SFVC784I by Xilinx

XCZU2EG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-2SFVC784I by Xilinx

XCZU2EG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-3SBVA484E by Xilinx

XCZU2EG-3SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-L1SBVA484I by Xilinx

XCZU2EG-L1SBVA484I

Xilinx

The Xilinx XCZU2EG-L1SBVA484I is a programmable SoC with CMOS technology. It operates in industrial temperature range (-40 to 100 °C) and has 484 terminals in a grid array package. With a supply voltage range of 0.698V to 0.742V, it's suitable for various applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU2EG-L1SFVA625I by Xilinx

XCZU2EG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B625

e1

4

625

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-L1SFVC784I by Xilinx

XCZU2EG-L1SFVC784I

Xilinx

The Xilinx XCZU2EG-L1SFVC784I is a CMOS microprocessor circuit with 784 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU2EG-L2SFVC784E by Xilinx

XCZU2EG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SBVA484E by Xilinx

XCZU3CG-1SBVA484E

Xilinx

XCZU3CG-1SBVA484E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has 0.825-0.876 V supply voltage range. Suitable for applications requiring high-performance processing in a compact form factor.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SBVA484I by Xilinx

XCZU3CG-1SBVA484I

Xilinx

XCZU3CG-1SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SFVA625E by Xilinx

XCZU3CG-1SFVA625E

Xilinx

XCZU3CG-1SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. With 625 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.

R-PBGA-B625

e1

4

625

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SFVA625I by Xilinx

XCZU3CG-1SFVA625I

Xilinx

XCZU3CG-1SFVA625I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B625

e1

4

625

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SFVC784E by Xilinx

XCZU3CG-1SFVC784E

Xilinx

XCZU3CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various uPs and uCs applications.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-1SFVC784I by Xilinx

XCZU3CG-1SFVC784I

Xilinx

XCZU3CG-1SFVC784I by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 784 BALL terminals. It operates in industrial temperature range (-40 to 100 °C) and has a supply voltage of 0.85 V. Ideal for applications requiring high-performance computing in harsh environments.

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-2SBVA484I by Xilinx

XCZU3CG-2SBVA484I

Xilinx

XCZU3CG-2SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This industrial-grade IC in grid array package is ideal for various applications requiring high-performance processing capabilities.

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-2SFVC784I by Xilinx

XCZU3CG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-L1SBVA484I by Xilinx

XCZU3CG-L1SBVA484I

Xilinx

XCZU3CG-L1SBVA484I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range of -40 to 100 °C and has a max supply voltage of 0.742 V. This GRID ARRAY package with 484 terminals is ideal for applications requiring high-performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-L1SFVA625I by Xilinx

XCZU3CG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B625

e1

4

625

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-L1SFVC784I by Xilinx

XCZU3CG-L1SFVC784I

Xilinx

XCZU3CG-L1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an INDUSTRIAL temperature range from -40 to 100 °C and has a supply voltage of 0.72 V. This device comes in a GRID ARRAY package with 784 terminals, suitable for various applications requiring high-performance processing capabilities.

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-L2SBVA484E by Xilinx

XCZU3CG-L2SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B484

e1

4

484

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3CG-L2SFVA625E by Xilinx

XCZU3CG-L2SFVA625E

Xilinx

XCZU3CG-L2SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-110 °C and has 625 terminals in a GRID ARRAY package style. Suitable for applications requiring high performance uPs/uCs & Peripheral ICs in various industries.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B625

e1

4

625

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-1SBVA484E by Xilinx

XCZU3EG-1SBVA484E

Xilinx

The Xilinx XCZU3EG-1SBVA484E is a programmable SoC with CMOS technology. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. With 484 terminals in a grid array package, it's ideal for various applications requiring high-performance microprocessors and peripheral ICs.

R-PBGA-B484

e1

4

484

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU3EG-1SBVA484I by Xilinx

XCZU3EG-1SBVA484I

Xilinx

XCZU3EG-1SBVA484I by Xilinx is a programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. With 484 terminals in a grid array package, it's ideal for industrial applications requiring high-performance processing capabilities.

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU3EG-1SFVA625E by Xilinx

XCZU3EG-1SFVA625E

Xilinx

XCZU3EG-1SFVA625E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has 625 terminals in a GRID ARRAY package style. With supply voltage range of 0.825-0.876 V, it's ideal for applications requiring high-performance computing in various industries.

R-PBGA-B625

e1

4

625

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-1SFVA625I by Xilinx

XCZU3EG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B625

e1

4

625

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-1SFVC784E by Xilinx

XCZU3EG-1SFVC784E

Xilinx

XCZU3EG-1SFVC784E by Xilinx is a CMOS microprocessor circuit with 784 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing and processing capabilities.

R-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-1SFVC784I by Xilinx

XCZU3EG-1SFVC784I

Xilinx

XCZU3EG-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-2SBVA484I by Xilinx

XCZU3EG-2SBVA484I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU3EG-2SFVA625I by Xilinx

XCZU3EG-2SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B625

e1

4

625

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-2SFVC784I by Xilinx

XCZU3EG-2SFVC784I

Xilinx

XCZU3EG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 784 terminals in a GRID ARRAY package style. Suitable for industrial applications, it has a supply voltage range of 0.825V to 0.876V.

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-3SFVC784E by Xilinx

XCZU3EG-3SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.9 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-L1SBVA484I by Xilinx

XCZU3EG-L1SBVA484I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B484

e1

4

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU3EG-L1SFVA625I by Xilinx

XCZU3EG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B625

e1

4

625

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-L1SFVC784I by Xilinx

XCZU3EG-L1SFVC784I

Xilinx

The Xilinx XCZU3EG-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. This GRID ARRAY package with 784 terminals is ideal for industrial applications requiring high performance processing capabilities.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU3EG-L2SFVC784E by Xilinx

XCZU3EG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B784

e1

4

784

110 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

250

.742 V

.698 V

.72 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-1FBVB900E by Xilinx

XCZU4CG-1FBVB900E

Xilinx

XCZU4CG-1FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 900 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. With a supply voltage range of 0.825-0.876 V, it's ideal for applications requiring high-performance processing capabilities in various electronic devices.

R-PBGA-B900

e1

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-1FBVB900I by Xilinx

XCZU4CG-1FBVB900I

Xilinx

XCZU4CG-1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-1SFVC784E by Xilinx

XCZU4CG-1SFVC784E

Xilinx

XCZU4CG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. With 784 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B784

e1

4

784

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-1SFVC784I by Xilinx

XCZU4CG-1SFVC784I

Xilinx

XCZU4CG-1SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with a supply voltage of 0.85 V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-2FBVB900I by Xilinx

XCZU4CG-2FBVB900I

Xilinx

XCZU4CG-2FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-2SFVC784I by Xilinx

XCZU4CG-2SFVC784I

Xilinx

XCZU4CG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100°C, featuring 784 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring a 0.85V supply voltage and capable of peak reflow at 250°C within 30s.

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.85 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-L1FBVB900I by Xilinx

XCZU4CG-L1FBVB900I

Xilinx

XCZU4CG-L1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance at supply voltages ranging from 0.698V to 0.742V.

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

R-PBGA-B900

e1

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU4CG-L1SFVC784I by Xilinx

XCZU4CG-L1SFVC784I

Xilinx

Xilinx XCZU4CG-L1SFVC784I is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with 0.72 V supply voltage. With 784 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high-performance processing capabilities.

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

S-PBGA-B784

e1

4

784

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

250

.72 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT