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XCZU3CG-1SFVA625I

Xilinx

XCZU3CG-1SFVA625I by Xilinx

XCZU3CG-1SFVA625I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

Median Price

$560.338

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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AZTECH Wire

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Ampacity Inc.

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Modulus Dynamics

Lithuania . 1,266 parts In-Stock

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Semicontronic

India . 385 parts In-Stock

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One Stop Electronics

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Texas Native Microelectronics

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Kenton Components

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Vigor

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Argo Parts USA

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Microchip USA

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Netroflash

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Overview

Revolutionize your electronic designs with the XCZU3CG-1SFVA625I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-notch quality and reliability in their products. This versatile microprocessor circuit is perfect for a wide range of applications, offering advanced technology, industrial-grade temperature tolerance, and a grid array package style for easy integration. Experience unmatched performance and efficiency with the XCZU3CG-1SFVA625I, a game-changer for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the product, ensuring its longevity and reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage tolerance of 0.876 V enables the product to withstand voltage fluctuations and variations without compromising its performance or stability.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard PCB designs and facilitates efficient placement and mounting within electronic devices.

No. of Terminals: 625

The high number of terminals (625) allows for versatile connectivity options and integration with a variety of external components, enhancing the product's functionality and flexibility.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved signal integrity and thermal performance, making it suitable for applications requiring high-speed data transmission and reliable operation.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage requirement of 0.825 V ensures efficient power consumption and compatibility with a range of power sources, optimizing energy efficiency.

Maximum Operating Temperature: 100 °C

The wide maximum operating temperature range of 100°C enables the product to perform reliably in various environmental conditions, ensuring continuous operation without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function in cold environments without performance degradation, ensuring consistent operation in diverse settings.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and long-term durability.

Terminal Position: BOTTOM

The bottom terminal position enables easy mounting and secure attachment to the PCB, facilitating a stable connection and simplifying the assembly process for manufacturers.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds minimizes the risk of thermal damage during the soldering process, ensuring the product's integrity and reliability.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250°C allows for effective soldering of the product onto the PCB, ensuring strong and durable connections for optimal performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates the product's suitability for harsh operating environments, making it ideal for industrial applications requiring rugged and reliable performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The integration of a microprocessor circuit provides advanced processing capabilities and intelligent functionality, enhancing the product's performance and enabling complex operations.

Technology: CMOS

The CMOS technology utilized in the product offers low power consumption, high speed, and compatibility with a wide range of digital systems, ensuring efficient and reliable operation.

Terminal Form: BALL

The ball terminal form provides robust connections and facilitates precise alignment during the installation process, enhancing the product's reliability and connectivity.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage of 0.85 V ensures stable and consistent power delivery to the product, optimizing performance and preventing voltage fluctuations that may affect functionality.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates the product's resilience to moisture exposure during storage or operation, reducing the risk of damage or malfunctions in humid environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU3CG-1SFVA625I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B625

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

625

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU3CG-1SFVA625I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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