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XCZU2EG-1SFVC784E

Xilinx

XCZU2EG-1SFVC784E by Xilinx

XCZU2EG-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100°C, with a supply voltage of 0.85V. Ideal for applications requiring high-performance computing in compact form factors.

Median Price

$398.970

Lifecycle Status

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DigiKey

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Digiode

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Bristol Electronics

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Microchip USA

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Corohmni

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MARBEL Systems

Belgium . 68 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

Lithuania . 59 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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Semicontronic

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Corphita

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Qasali Group International

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Overview

Experience the cutting-edge technology of Xilinx with the XCZU2EG-1SFVC784E, a high-quality microprocessor circuit designed to meet your specific needs. Xilinx, a renowned manufacturer in the industry, delivers exceptional performance and reliability, making it the ideal choice for a wide range of applications. With its advanced features and innovative design, this product offers unparalleled value and benefits to customers looking for top-of-the-line solutions. Upgrade your projects and elevate your results with the XCZU2EG-1SFVC784E from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or handheld devices.

Surface Mount: YES

The surface mount capability simplifies the assembly process and saves space on the PCB, making it easier to integrate into compact designs.

Package Shape: SQUARE

The square shape of the package provides uniformity and ease of handling during assembly, ensuring stable mounting on the PCB.

No. of Terminals: 784

The high number of terminals allows for a greater degree of connectivity and functionality, making the product versatile and suitable for complex applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient signal distribution and thermal performance, ensuring reliable operation at high frequencies.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range ensures the product can withstand harsh environmental conditions and perform reliably under stress.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function effectively in colder environments, enhancing its overall versatility.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The use of tin/silver/copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enables complex data processing and control functions, making the product suitable for advanced applications that require high computational power.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability in various electronic systems.

Nominal Supply Voltage: 0.85 V

The low nominal supply voltage requirement allows for energy-efficient operation, making the product suitable for battery-powered devices or applications where power consumption is a concern.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that the product has moderate sensitivity to moisture, requiring standard handling and storage practices to maintain its reliability and performance over time.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU2EG-1SFVC784E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU2EG-1SFVC784E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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