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XCZU3EG-2SFVC784I

Xilinx

XCZU3EG-2SFVC784I by Xilinx

XCZU3EG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 784 terminals in a GRID ARRAY package style. Suitable for industrial applications, it has a supply voltage range of 0.825V to 0.876V.

Median Price

$926.450

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Newark

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Digiode

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MARBEL Systems

Belgium . 747 parts In-Stock

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$48.354

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Vigor

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Semicontronic

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Overview

Unlock the potential of your next project with the XCZU3EG-2SFVC784I by Xilinx. As a leader in the industry, Xilinx delivers top-quality products that are reliable and innovative. This versatile microprocessor circuit is perfect for a wide range of applications, offering unparalleled performance and efficiency. Say goodbye to limitations and hello to endless possibilities with the XCZU3EG-2SFVC784I. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a lightweight and durable packaging for the product, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving space and enabling high-density designs.

Maximum Supply Voltage: 0.876 V

The maximum supply voltage of 0.876 V ensures safe operation and reliable performance within specified voltage limits.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact form factor for easy integration into electronic systems.

No. of Terminals: 784

With a high number of terminals, the product can support complex functionalities and connectivity options.

Package Style (Meter): GRID ARRAY

The grid array package style provides a high terminal density and efficient heat dissipation, enhancing overall performance.

Minimum Supply Voltage: 0.825 V

The minimum supply voltage of 0.825 V ensures flexibility in power supply options and compatibility with various systems.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, the product can withstand high temperature environments and extended operation.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish with a mix of tin, silver, and copper provides good solderability and reliability in electrical connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB mounting and secure electrical connections.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper solder reflow and component reliability during assembly.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250°C allows for efficient and reliable soldering of the component onto the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enables complex processing tasks and advanced functionalities in the product.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Terminal Form: BALL

The ball terminal form enables reliable and secure connections, especially in applications where vibration and mechanical stress are present.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage of 0.85 V provides a stable operating voltage for consistent performance and reliability.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates a moderate level of sensitivity to moisture, necessitating proper handling and storage to maintain product integrity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU3EG-2SFVC784I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU3EG-2SFVC784I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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