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XCZU4CG-2SFVC784I

Xilinx

XCZU4CG-2SFVC784I by Xilinx

XCZU4CG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100°C, featuring 784 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring a 0.85V supply voltage and capable of peak reflow at 250°C within 30s.

Median Price

$1,492.835

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Digiode

USA . 461 parts In-Stock

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$1,477.164

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Nova Conductors

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Vyrian

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AZTECH Wire

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Corohmni

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Aztec Data Supply Inc.

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Texas Native Microelectronics

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Kenton Components

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Modulus Dynamics

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Microchip USA

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Ampacity Inc.

Singapore . 63 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 4,899 parts In-Stock

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Qasali Group International

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Overview

Discover the cutting-edge technology of the XCZU4CG-2SFVC784I by Xilinx, a powerful microprocessor circuit that offers unmatched quality and performance. With Xilinx's reputation for excellence in the industry, this product is sure to exceed your expectations in a variety of applications. Whether you're looking to enhance your system's capabilities or streamline your operations, this industrial-grade peripheral IC provides the reliability and efficiency you need. Upgrade your projects with the XCZU4CG-2SFVC784I and experience the value it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the components inside the package, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making the product suitable for compact electronic devices.

Package Shape: SQUARE

Square shape helps in efficient placement on circuit boards and allows for better heat dissipation.

No. of Terminals: 784

High number of terminals enables connectivity to multiple components, enhancing the functionality of the product.

Package Style (Meter): GRID ARRAY

Grid array package style allows for high-density mounting, saving space and enabling complex circuit designs.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures the product can withstand harsh environmental conditions and extended use.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to operate in a wide range of environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure soldering onto the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature ensures component reliability during assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature ensures proper soldering and component bonding during assembly.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can operate in demanding industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporation of a microprocessor circuit allows for advanced processing capabilities and functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides reliable and secure connections, suitable for high-speed data transmission and processing.

Nominal Supply Voltage: 0.85 V

Low nominal supply voltage reduces power consumption and heat generation, enhancing energy efficiency.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level 4 indicates that the product is less sensitive to moisture, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU4CG-2SFVC784I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

784

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU4CG-2SFVC784I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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