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BALL Other Function uPs,uCs & Peripheral ICs 1,582

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX6Y2DVM05AA by NXP Semiconductors

MCIMX6Y2DVM05AA

NXP Semiconductors

MCIMX6Y2DVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. Operating b/w 0-95°C, it supports a supply voltage range of 1.275-1.5V. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B289

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y7DVK05AA by NXP Semiconductors

MCIMX6Y7DVK05AA

NXP Semiconductors

MCIMX6Y7DVK05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.

S-PBGA-B272

9 mm

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.275 V

YES

CMOS

OTHER

BALL

.5 mm

BOTTOM

40

9 mm

SYSTEM ON CHIP

MEC1418-I/SZ by Microchip Technology

MEC1418-I/SZ

Microchip Technology

MEC1418-I/SZ by Microchip: 144-terminal IC with CMOS tech, 2-3.6V supply, -40 to 85°C temp range. Ideal for industrial microprocessor circuits due to its very thin profile and fine pitch grid array package style.

S-PBGA-B144

e1

9 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

3.6 V

2 V

3 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

9 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584BBCZ-4A by Analog Devices

ADSP-SC584BBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

AM5716AABCDA by Texas Instruments

AM5716AABCDA

Texas Instruments

The Texas Instruments AM5716AABCDA is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V. With 760 terminals in a GRID ARRAY package, it's ideal for industrial applications requiring high performance and reliability.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCDEA by Texas Instruments

AM5716AABCDEA

Texas Instruments

AM5716AABCDEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCD by Texas Instruments

AM5716AABCD

Texas Instruments

AM5716AABCD by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, has a supply voltage range of 1.11-1.2V, and features a fine pitch grid array package style. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXA by Texas Instruments

AM5716AABCXA

Texas Instruments

AM5716AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXEA by Texas Instruments

AM5716AABCXEA

Texas Instruments

AM5716AABCXEA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for industrial applications requiring high performance in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCX by Texas Instruments

AM5716AABCX

Texas Instruments

AM5716AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 90°C, with supply voltage ranging from 1.11V to 1.2V. Ideal for industrial applications requiring fine pitch grid array package style.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCXA by Texas Instruments

AM5718AABCXA

Texas Instruments

AM5718AABCXA by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 1.11V to 1.2V. Ideal for industrial applications requiring high-speed processing in compact form factor.

S-PBGA-B760

e1

23 mm

3

760

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCX by Texas Instruments

AM5718AABCX

Texas Instruments

AM5718AABCX by Texas Instruments is a 760-terminal System on Chip with CMOS technology. It operates b/w 0-90°C, with supply voltage ranging from 1.11-1.2V. Ideal for applications requiring high-speed processing in compact spaces.

S-PBGA-B760

e1

23 mm

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

ADSP-21583BBCZ-4A by Analog Devices

ADSP-21583BBCZ-4A

Analog Devices

ADSP-21583BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. The IC has 349 terminals on a 19x19 mm square body, making it ideal for high-performance applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21583CBCZ-4A by Analog Devices

ADSP-21583CBCZ-4A

Analog Devices

ADSP-21583CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21583KBCZ-4A by Analog Devices

ADSP-21583KBCZ-4A

Analog Devices

ADSP-21583KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals in a GRID ARRAY package. It operates at up to 500 MHz, with supply voltage range of 1.05V to 1.15V. Ideal for SPI and UART bus applications in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584BBCZ-4A by Analog Devices

ADSP-21584BBCZ-4A

Analog Devices

ADSP-21584BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. The IC has 349 terminals, 0.8 mm pitch, and measures 19x19 mm for various applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584CBCZ-4A by Analog Devices

ADSP-21584CBCZ-4A

Analog Devices

ADSP-21584CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile grid array package style.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584KBCZ-4A by Analog Devices

ADSP-21584KBCZ-4A

Analog Devices

ADSP-21584KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for SPI and UART bus compatibility applications in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582BBCZ-4A by Analog Devices

ADSP-SC582BBCZ-4A

Analog Devices

ADSP-SC582BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device comes in a low profile GRID ARRAY package with 349 terminals on a 19mm square body.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582CBCZ-4A by Analog Devices

ADSP-SC582CBCZ-4A

Analog Devices

ADSP-SC582CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC582KBCZ-4A by Analog Devices

ADSP-SC582KBCZ-4A

Analog Devices

ADSP-SC582KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C with a supply voltage range of 1.05V to 1.15V, making it ideal for commercial applications requiring high-speed processing in a compact GRID ARRAY package.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583BBCZ-3A by Analog Devices

ADSP-SC583BBCZ-3A

Analog Devices

ADSP-SC583BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC features SPI and UART bus compatibility in a square package with 349 terminals.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583BBCZ-4A by Analog Devices

ADSP-SC583BBCZ-4A

Analog Devices

ADSP-SC583BBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583CBCZ-3A by Analog Devices

ADSP-SC583CBCZ-3A

Analog Devices

ADSP-SC583CBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency. It operates in industrial temperature range (-40 to 95 °C) and supports SPI and UART bus compatibility. The package has 349 terminals in a GRID ARRAY style, making it suitable for various applications requiring high performance and low profile design.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583CBCZ-4A by Analog Devices

ADSP-SC583CBCZ-4A

Analog Devices

ADSP-SC583CBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 95 °C and has a supply voltage range of 1.05V to 1.15V. This SQUARE package IC features 349 terminals in a GRID ARRAY style, making it ideal for SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583KBCZ-3A by Analog Devices

ADSP-SC583KBCZ-3A

Analog Devices

ADSP-SC583KBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. The package style is GRID ARRAY, LOW PROFILE, FINE PITCH, making it ideal for compact electronic applications.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC583KBCZ-4A by Analog Devices

ADSP-SC583KBCZ-4A

Analog Devices

ADSP-SC583KBCZ-4A by Analog Devices is a 500 MHz microprocessor circuit with SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. Ideal for applications requiring low profile, fine pitch grid array packages in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

e1

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584BBCZ-3A by Analog Devices

ADSP-SC584BBCZ-3A

Analog Devices

ADSP-SC584BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has SPI and UART bus compatibility. This CMOS technology device features a low profile grid array package with 349 terminals in a square shape.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584CBCZ-3A by Analog Devices

ADSP-SC584CBCZ-3A

Analog Devices

ADSP-SC584CBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility. With a temperature range of -40 to 95 °C, it offers high performance in various environments.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584CBCZ-4A by Analog Devices

ADSP-SC584CBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584KBCZ-3A by Analog Devices

ADSP-SC584KBCZ-3A

Analog Devices

ADSP-SC584KBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, has a low profile GRID ARRAY package style, and features 349 terminals in a SQUARE shape.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584KBCZ-4A by Analog Devices

ADSP-SC584KBCZ-4A

Analog Devices

ADSP-SC584KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC is ideal for commercial applications requiring high-speed processing in a compact form factor.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587BBCZ-4B by Analog Devices

ADSP-SC587BBCZ-4B

Analog Devices

ADSP-SC587BBCZ-4B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications requiring SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587KBCZ-4B by Analog Devices

ADSP-SC587KBCZ-4B

Analog Devices

ADSP-SC587KBCZ-4B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency. It operates b/w 0 to 70 °C and has SPI and UART bus compatibility. This low profile, fine pitch IC with 349 terminals is ideal for commercial applications requiring high-speed processing.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589BBCZ-4B by Analog Devices

ADSP-SC589BBCZ-4B

Analog Devices

ADSP-SC589BBCZ-4B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications requiring SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589KBCZ-4B by Analog Devices

ADSP-SC589KBCZ-4B

Analog Devices

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE;

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

19 mm

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVB1517E by Xilinx

XCZU11EG-2FFVB1517E

Xilinx

XCZU11EG-2FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance uPs/uCs & Peripheral ICs in compact designs.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVC1156E by Xilinx

XCZU11EG-2FFVC1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVC1760E by Xilinx

XCZU11EG-2FFVC1760E

Xilinx

XCZU11EG-2FFVC1760E by Xilinx is a CMOS microprocessor circuit with 1760 terminals in a grid array package. Operating b/w 0-100°C, it has a supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing and advanced processing capabilities.

R-PBGA-B1760

e1

42.5 mm

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

42.5 mm

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVF1517E by Xilinx

XCZU11EG-2FFVF1517E

Xilinx

XCZU11EG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, measuring 40x40 mm. Operating b/w 0-100°C, it requires a supply voltage of 0.825-0.876 V and can withstand peak reflow at 245°C for up to 30s.

R-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.51 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

XCZU15EG-2FFVB1156E by Xilinx

XCZU15EG-2FFVB1156E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

35 mm

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

35 mm

MICROPROCESSOR CIRCUIT

XCZU15EG-2FFVC900E by Xilinx

XCZU15EG-2FFVC900E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B900

e1

31 mm

4

900

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.42 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVC1760E by Xilinx

XCZU17EG-2FFVC1760E

Xilinx

XCZU17EG-2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance processing in compact form factors.

R-PBGA-B1760

e1

42.5 mm

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

42.5 mm

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVD1760E by Xilinx

XCZU17EG-2FFVD1760E

Xilinx

XCZU17EG-2FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for applications requiring high processing power and advanced functionalities in compact designs.

R-PBGA-B1760

e1

42.5 mm

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

42.5 mm

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVE1924E by Xilinx

XCZU17EG-2FFVE1924E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1924

e1

45 mm

4

1924

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVC1760E by Xilinx

XCZU19EG-2FFVC1760E

Xilinx

XCZU19EG-2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance processing in compact designs.

R-PBGA-B1760

e1

42.5 mm

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

42.5 mm

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVD1760E by Xilinx

XCZU19EG-2FFVD1760E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

42.5 mm

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

42.5 mm

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVE1924E by Xilinx

XCZU19EG-2FFVE1924E

Xilinx

XCZU19EG-2FFVE1924E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1924 terminals in a GRID ARRAY package style, with a max supply voltage of 0.876 V. Ideal for applications requiring high processing power and efficiency in environments up to 100°C.

R-PBGA-B1924

e1

45 mm

4

1924

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.71 mm

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR CIRCUIT