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XCZU17EG-2FFVC1760E

Xilinx

XCZU17EG-2FFVC1760E by Xilinx

XCZU17EG-2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance processing in compact form factors.

Median Price

$8,678.100

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Mouser Electronics

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DigiKey

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Digiode

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Microchip USA

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MARBEL Systems

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Modulus Dynamics

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Texas Native Microelectronics

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Kenton Components

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iBuyXS LLC

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One Stop Electronics

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Corphita

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Component Stockers USA

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Overview

Discover the cutting-edge technology of the XCZU17EG-2FFVC1760E by Xilinx, a top-tier manufacturer known for its superior quality and innovation. This versatile microprocessor circuit offers endless possibilities in various applications, from robotics to telecommunications. With a compact design and impressive performance, this product provides exceptional value and benefits to customers seeking reliable solutions for their projects. Upgrade your system with the XCZU17EG-2FFVC1760E and experience the advantages of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology is more efficient and cost-effective for manufacturing, making the product easier to produce in bulk.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for flexibility in power requirements, accommodating different types of power sources.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to design and layout the circuit board, optimizing space efficiency.

No. of Terminals: 1760

Having a high number of terminals allows for more connectivity options and functionality in the circuit design.

Package Style (Meter): GRID ARRAY

Grid array packaging offers improved electrical performance and thermal characteristics for the IC.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can function reliably in a wide range of environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminals are more durable and provide better electrical performance compared to other terminal forms.

Nominal Supply Voltage: 0.85 V

Having a stable nominal supply voltage ensures consistent performance of the IC under normal operating conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU17EG-2FFVC1760E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Length:

42.5 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.71 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

42.5 mm

Peripheral IC Type:

Trade Compliance

XCZU17EG-2FFVC1760E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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