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ADSP-SC589BBCZ-4B

Analog Devices

ADSP-SC589BBCZ-4B by Analog Devices

ADSP-SC589BBCZ-4B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications requiring SPI and UART bus compatibility.

Median Price

$83.515

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 1,079 parts In-Stock

1+ parts

$79.360

100+ parts

$60.267

1k+ parts

$50.580

10k+ parts

-

1,079

$79.360

$60.267

$50.580

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Mouser Electronics

USA . 287 parts In-Stock

1+ parts

$80.070

100+ parts

$65.030

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-

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287

$80.070

$65.030

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Farnell

UK . 10 parts In-Stock

1+ parts

$80.960

100+ parts

$60.740

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-

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10

$80.960

$60.740

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DigiKey

USA . 117 parts In-Stock

1+ parts

$86.070

100+ parts

$65.621

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-

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117

$86.070

$65.621

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Newark

USA . 10 parts In-Stock

1+ parts

$86.770

100+ parts

$67.590

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-

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10

$86.770

$67.590

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Element14

Singapore . 10 parts In-Stock

1+ parts

$119.890

100+ parts

$91.040

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-

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10

$119.890

$91.040

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Verical

USA . 1,314 parts In-Stock

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1,314

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Distributors (In-Stock)

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Digiode

USA . 74 parts In-Stock

1+ parts

$55.546

100+ parts

-

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74

$55.546

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Vyrian

USA . 4,209 parts In-Stock

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4,209

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Chip Stock

USA . 354 parts In-Stock

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354

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Distributors (Availability)

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Native Components

USA . 322 parts In-Stock

1+ parts

$0.440

100+ parts

-

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$0.422

322

$0.440

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-

$0.422

Northwest PG Solutions

USA . 1,313 parts In-Stock

1+ parts

$0.484

100+ parts

-

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$0.427

1,313

$0.484

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-

$0.427

Parana Technologies

USA . 1,562 parts In-Stock

1+ parts

$37.771

100+ parts

-

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$35.127

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1,562

$37.771

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$35.127

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IDEA Electronic Components Group

UK . 862 parts In-Stock

1+ parts

$40.614

100+ parts

$38.583

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862

$40.614

$38.583

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Corohmni

South Africa . 422 parts In-Stock

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$45.404

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422

$45.404

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Vigor

Singapore . 2,583 parts In-Stock

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$46.700

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$46.700

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Corphita

USA . 17 parts In-Stock

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$52.623

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17

$52.623

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DigiPath Technology Company

USA . 2,541 parts In-Stock

1+ parts

$63.358

100+ parts

$60.824

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-

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$60.824

2,541

$63.358

$60.824

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$60.824

Ampacity Inc.

Singapore . 179 parts In-Stock

1+ parts

$108.170

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179

$108.170

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Semicontronic

India . 162 parts In-Stock

1+ parts

$108.170

100+ parts

$105.466

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$104.925

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162

$108.170

$105.466

$104.925

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Microchip USA

USA . 2,076 parts In-Stock

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$133.078

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2,076

$133.078

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Overview

Experience the cutting-edge technology of Analog Devices with the ADSP-SC589BBCZ-4B, a high-quality microprocessor circuit designed for a wide range of applications. With a maximum clock frequency of 500 MHz and compatibility with SPI and UART buses, this product offers unmatched performance and versatility. Whether you're working on industrial automation, communication systems, or consumer electronics, this low-profile, fine-pitch package delivers exceptional value and reliability. Trust Analog Devices to provide innovative solutions that push boundaries and exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 1.15 V

Can handle higher power input, providing flexibility in power source options.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, maximizing component density.

No. of Terminals: 349

High number of terminals allow for multiple connections and functionality, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style ensures efficient signal transmission and heat dissipation.

Minimum Supply Voltage: 1.05 V

Low minimum supply voltage allows for efficient power consumption and operation in low power environments.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Able to operate in extreme cold environments, providing reliability in various conditions.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access and connection to other components on the circuit board.

Maximum Seated Height: 1.5 mm

Low seated height saves space and allows for compact design of the product.

Width: 19 mm

Compact width makes it suitable for applications with limited space constraints.

Maximum Clock Frequency: 500 MHz

High clock frequency allows for fast processing and data transfer speeds, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time ensures efficient and quick soldering process during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures strong and reliable solder joints for durability.

Length: 19 mm

Compact length makes it suitable for applications with limited space constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit provides advanced processing capabilities for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient operation.

Terminal Form: BALL

Ball terminal form ensures strong and reliable connections on the circuit board.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage ensures consistent and reliable operation of the product.

Bus Compatibility: SPI; UART

Compatibility with SPI and UART buses allows for versatile communication options with other devices.

Terminal Pitch: 0.8 mm

The small terminal pitch provides high density and compact layout on the circuit board.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product can withstand exposure to moderate humidity levels during storage and operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ADSP-SC589BBCZ-4B attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Analog Devices

Specs

Bus Compatibility:

SPI; UART

Maximum Clock Frequency:

500 MHz

JESD-30 Code:

S-PBGA-B349

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

349

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-SC589BBCZ-4B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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