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ADSP-SC589-ENG

Analog Devices

ADSP-SC589-ENG by Analog Devices

ADSP-SC589-ENG by Analog Devices is a MICROPROCESSOR CIRCUIT with 529 terminals in a GRID ARRAY package. It operates at a voltage range of 1.05V to 1.15V, making it suitable for low power applications. The CMOS technology and fine pitch design make it ideal for compact electronic devices requiring high processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,051 parts In-Stock

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VNN

France . 4,389 parts In-Stock

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Digiode

USA . 361 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Semicontronic

India . 1,230 parts In-Stock

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$10.000

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$9.750

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$9.700

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AZTECH Wire

Italy . 645 parts In-Stock

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$12.719

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One Stop Electronics

USA . 1,376 parts In-Stock

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Ampacity Inc.

Singapore . 1,227 parts In-Stock

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$35.000

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Aztec Data Supply Inc.

USA . 115 parts In-Stock

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$58.070

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Parana Technologies

USA . 3 parts In-Stock

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$63.685

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$59.227

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IDEA Electronic Components Group

UK . 1,642 parts In-Stock

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$68.478

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$65.054

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Corohmni

South Africa . 450 parts In-Stock

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DigiPath Technology Company

USA . 805 parts In-Stock

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$106.826

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$102.553

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Continental Prestige Electronics

USA . 5,040 parts In-Stock

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Argo Parts USA

USA . 1,989 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience the cutting-edge technology of Analog Devices with the ADSP-SC589-ENG, a top-of-the-line microprocessor circuit designed for optimal performance. With a total of 529 terminals and a low profile grid array package style, this product offers unparalleled quality and reliability. Whether you're in need of high-speed data processing or complex computations, this versatile device is perfect for a wide range of applications. Take advantage of the benefits that Analog Devices brings to the table and elevate your projects to new heights with the ADSP-SC589-ENG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the integrated circuits, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability makes it easy to integrate the product onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.15 V

Higher maximum supply voltage allows for flexibility in power input, accommodating variations in power sources.

Package Shape: SQUARE

Square package shape is efficient in terms of space utilization and alignment on circuit boards.

No. of Terminals: 529

Higher number of terminals provide more connectivity options and functionality for the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array style with low profile and fine pitch design enhances the product's performance and reliability in densely populated circuit layouts.

Minimum Supply Voltage: 1.05 V

Lower minimum supply voltage ensures efficient power consumption and operation, saving energy.

Terminal Position: BOTTOM

Bottom terminal position simplifies the installation and connection process for the product.

Maximum Seated Height: 1.5 mm

Low maximum seated height allows for compact and space-efficient placement on circuit boards.

Width: 19 mm

Optimal width dimension enables easy integration into various circuit board layouts without consuming excessive space.

Length: 19 mm

Ideal length measurement ensures compatibility with standard board sizes and effective placement within electronic devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type offers advanced processing capabilities and functionality for diverse applications, enhancing the product's performance.

Technology: CMOS

CMOS technology ensures low power consumption, high speed operation, and reliable performance for the product.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections for effective data transmission and power delivery.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage ensures consistent and reliable operation of the product under various operating conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for precise connections and compact layout designs on circuit boards, enhancing overall performance and reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ADSP-SC589-ENG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B529

Length:

19 mm

No. of Terminals:

529

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-SC589-ENG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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