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ADSP-SC583BBCZ-3A

Analog Devices

ADSP-SC583BBCZ-3A by Analog Devices

ADSP-SC583BBCZ-3A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC features SPI and UART bus compatibility in a square package with 349 terminals.

Median Price

$43.160

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 319 parts In-Stock

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$38.670

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$34.520

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$34.520

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Chip1Stop

Japan . 19 parts In-Stock

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$39.500

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$39.500

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Arrow

USA . 19 parts In-Stock

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$44.530

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Verical

USA . 19 parts In-Stock

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$44.530

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Rochester

USA . 470 parts In-Stock

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$43.160

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$38.620

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$36.340

470

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$38.620

$36.340

Distributors (In-Stock)

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Digiode

USA . 631 parts In-Stock

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$14.830

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Vyrian

USA . 4,034 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 228 parts In-Stock

1+ parts

$13.270

100+ parts

$12.938

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$12.872

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228

$13.270

$12.938

$12.872

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AZTECH Wire

Italy . 709 parts In-Stock

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$13.950

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$13.950

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Corphita

USA . 24 parts In-Stock

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$14.049

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Vigor

Singapore . 1,287 parts In-Stock

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$31.890

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Corohmni

South Africa . 178 parts In-Stock

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$34.920

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Parana Technologies

USA . 1,472 parts In-Stock

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$48.485

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$45.091

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$48.485

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IDEA Electronic Components Group

UK . 1,074 parts In-Stock

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$52.134

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$49.527

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$52.134

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DigiPath Technology Company

USA . 666 parts In-Stock

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$81.329

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$78.076

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$78.076

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$78.076

QUARKTWIN TECHNOLOGY LTD

USA . 28,230 parts In-Stock

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Native Components

USA . 917 parts In-Stock

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Northwest PG Solutions

USA . 271 parts In-Stock

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Overview

Enhance your electronic designs with the ADSP-SC583BBCZ-3A by Analog Devices, a top-tier manufacturer known for its superior quality and reliability. This cutting-edge product falls under the category of Other Function uPs, uCs & Peripheral ICs, offering endless possibilities for various applications. With advanced technology and a maximum clock frequency of 500 MHz, this product delivers exceptional performance and efficiency. Experience seamless integration, enhanced functionality, and unmatched precision with the ADSP-SC583BBCZ-3A - Your ultimate solution for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the internal components of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 1.15 V

The high maximum supply voltage tolerance ensures stable and reliable operation of the product even in fluctuating voltage conditions.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, enabling compact and streamlined designs.

No. of Terminals: 349

High number of terminals provide connectivity options and flexibility for integration with other components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density mounting, improved signal integrity, and enhanced thermal performance.

Minimum Supply Voltage: 1.05 V

The low minimum supply voltage requirement makes the product energy efficient and suitable for battery-operated applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance even in extreme temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure soldering on the circuit board.

Maximum Seated Height: 1.5 mm

The low maximum seated height allows for slim and compact designs, optimizing space on the circuit board.

Width: 19 mm

The 19mm width provides a standard size for easy integration and compatibility with other components and devices.

Maximum Clock Frequency: 500 MHz

High maximum clock frequency allows for fast data processing and high-speed performance in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures efficient soldering and assembly process during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C enables secure and reliable solder joints during the assembly process.

Length: 19 mm

The 19mm length provides a standard size for easy integration and compatibility with other components and devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of microprocessor circuit as a peripheral IC type allows for advanced processing capabilities and versatile functionality in the product.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital devices, making the product energy efficient and versatile.

Terminal Form: BALL

The ball terminal form offers reliable and secure connections for efficient data transmission and signal integrity.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V provides a stable operating voltage for consistent and reliable performance of the product.

Bus Compatibility: SPI; UART

SPI and UART bus compatibility allows for easy communication and integration with various devices and peripherals, enhancing the product's versatility.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch offers high density mounting and efficient use of space on the circuit board, enabling compact designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture during storage and handling, requiring proper precautions to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ADSP-SC583BBCZ-3A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Analog Devices

Specs

Bus Compatibility:

SPI; UART

Maximum Clock Frequency:

500 MHz

JESD-30 Code:

S-PBGA-B349

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

349

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-SC583BBCZ-3A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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