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ADSP-21583KBCZ-4A

Analog Devices

ADSP-21583KBCZ-4A by Analog Devices

ADSP-21583KBCZ-4A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals in a GRID ARRAY package. It operates at up to 500 MHz, with supply voltage range of 1.05V to 1.15V. Ideal for SPI and UART bus applications in commercial-grade environments.

Median Price

$33.052

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 790 parts In-Stock

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$32.870

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$29.350

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790

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$29.350

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Verical

USA . 782 parts In-Stock

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$33.234

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782

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$33.234

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Distributors (In-Stock)

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Digiode

USA . 240 parts In-Stock

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$27.151

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240

$27.151

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Vyrian

USA . 6,429 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 424 parts In-Stock

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$0.633

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424

$0.633

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Northwest PG Solutions

USA . 610 parts In-Stock

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$0.697

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610

$0.697

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Semicontronic

India . 439 parts In-Stock

1+ parts

$24.290

100+ parts

$23.683

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$23.561

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439

$24.290

$23.683

$23.561

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Corphita

USA . 308 parts In-Stock

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$25.722

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308

$25.722

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Vigor

Singapore . 1,983 parts In-Stock

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$39.830

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$39.830

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Parana Technologies

USA . 4,244 parts In-Stock

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$66.463

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$61.811

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4,244

$66.463

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$61.811

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IDEA Electronic Components Group

UK . 2,293 parts In-Stock

1+ parts

$71.466

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$67.893

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Corohmni

South Africa . 436 parts In-Stock

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$72.503

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436

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DigiPath Technology Company

USA . 4,244 parts In-Stock

1+ parts

$111.487

100+ parts

$107.027

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$107.027

4,244

$111.487

$107.027

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$107.027

QUARKTWIN TECHNOLOGY LTD

USA . 16,104 parts In-Stock

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Overview

Discover the unparalleled performance and reliability of the ADSP-21583KBCZ-4A by Analog Devices, a leading manufacturer in the industry. This cutting-edge microprocessor circuit offers a wide range of applications with its advanced technology and high clock frequency of 500 MHz. With a low profile package style and fine pitch grid array, this product is designed for seamless integration into your projects. Experience the benefits of a top-quality product that delivers exceptional value and efficiency to meet your needs. Elevate your designs with the ADSP-21583KBCZ-4A and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product durable and lightweight, ideal for portable applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 1.15 V

The high maximum supply voltage allows for flexibility in power input options, accommodating a wide range of operating conditions.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the circuit board, making it suitable for compact designs.

No. of Terminals: 349

With a high number of terminals, this product can support complex connectivity requirements, enabling versatile functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high reliability, thermal performance, and signal integrity, essential for high-speed operations.

Minimum Supply Voltage: 1.05 V

The low minimum supply voltage ensures energy efficiency and reliable operation even in low-power environments.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature assures proper functionality even in cold conditions, expanding the product's application range.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

With terminals positioned at the bottom, this product facilitates easy and secure mounting on the circuit board.

Maximum Seated Height: 1.5 mm

The low maximum seated height allows for a compact overall design, crucial for space-constrained applications.

Width: 19 mm

The moderate width of 19 mm strikes a balance between compactness and ease of handling during installation.

Maximum Clock Frequency: 500 MHz

Supporting a high maximum clock frequency of 500 MHz, this product enables fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the product ensures reliable soldering and manufacturing efficiency.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C guarantees proper soldering and solder joint reliability.

Length: 19 mm

Having a length of 19 mm contributes to the product's overall compactness and compatibility with standard board sizes.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, the product is suitable for a wide range of applications in typical operating environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Featuring a microprocessor circuit as a peripheral IC type, this product offers advanced processing capabilities and versatile functionality.

Technology: CMOS

Utilizing CMOS technology, the product delivers high performance with low power consumption, ideal for energy-efficient applications.

Terminal Form: BALL

The ball terminal form ensures secure connections and facilitates reliable soldering for robust circuit integration.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V provides a stable power input for consistent performance and reliable operation.

Bus Compatibility: SPI; UART

Supporting SPI and UART bus compatibility, this product offers versatile communication options for interfacing with other devices.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8 mm, the product allows for high terminal density and compact PCB layout design.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the product can withstand standard humidity levels during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ADSP-21583KBCZ-4A attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Analog Devices

Specs

Bus Compatibility:

SPI; UART

Maximum Clock Frequency:

500 MHz

JESD-30 Code:

S-PBGA-B349

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

349

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-21583KBCZ-4A Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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