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ADSP-21583-ENG

Analog Devices

ADSP-21583-ENG by Analog Devices

ADSP-21583-ENG by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals in a GRID ARRAY package. It operates at 1.05-1.15 V, featuring CMOS technology and 0.8 mm terminal pitch. Ideal for applications requiring low profile, fine pitch ICs in electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,568 parts In-Stock

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6,568

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Digiode

USA . 785 parts In-Stock

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785

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Distributors (Availability)

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Semicontronic

India . 928 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

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928

$3.000

$2.925

$2.910

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AZTECH Wire

Italy . 765 parts In-Stock

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$15.905

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765

$15.905

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One Stop Electronics

USA . 250 parts In-Stock

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$33.000

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250

$33.000

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Corohmni

South Africa . 949 parts In-Stock

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$40.344

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949

$40.344

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Parana Technologies

USA . 4,564 parts In-Stock

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$54.293

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$50.493

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4,564

$54.293

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$50.493

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IDEA Electronic Components Group

UK . 158 parts In-Stock

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$58.380

100+ parts

$55.461

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158

$58.380

$55.461

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DigiPath Technology Company

USA . 4,564 parts In-Stock

1+ parts

$91.073

100+ parts

$87.430

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$87.430

4,564

$91.073

$87.430

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$87.430

Northwest PG Solutions

USA . 1,204 parts In-Stock

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Native Components

USA . 355 parts In-Stock

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355

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Corphita

USA . 236 parts In-Stock

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Overview

Elevate your electronic designs with the ADSP-21583-ENG from Analog Devices. Known for their high-quality products, Analog Devices delivers top-of-the-line microprocessor circuits that are ideal for a wide range of applications. Whether you're working on IoT devices, audio systems, or industrial automation, this product offers unmatched value, benefits, and advantages. Say goodbye to compromise and hello to superior performance with the ADSP-21583-ENG. Experience innovation at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are commonly used in electronic components for their durability, heat resistance, and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for smaller and lighter components, making the product suitable for compact and space-constrained designs.

Maximum Supply Voltage: 1.15 V

The higher maximum supply voltage provides flexibility in powering the product while staying within safe operating limits.

Package Shape: SQUARE

Square package shape helps in efficient PCB layout and space utilization.

No. of Terminals: 349

Higher number of terminals enable more connectivity options and functionality in the product.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high-density mounting, low profile design, and precise pitch for enhanced performance and reliability.

Minimum Supply Voltage: 1.05 V

The lower minimum supply voltage allows for power efficiency and operation in low power scenarios.

Terminal Position: BOTTOM

Bottom terminal positioning helps in simplified PCB routing and assembly.

Maximum Seated Height: 1.5 mm

Low seated height enables slim and compact product design.

Width: 19 mm

Standard width dimension for easy integration into various electronic systems.

Length: 19 mm

Standard length dimension for convenient PCB layout and mounting.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product offers advanced computational capabilities suitable for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form offers reliable connections and facilitates easy soldering during assembly.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage provides a stable operating point for the product's performance and reliability.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and precise connections in the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ADSP-21583-ENG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B349

Length:

19 mm

No. of Terminals:

349

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.5 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

19 mm

Peripheral IC Type:

Trade Compliance

ADSP-21583-ENG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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