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ADSP-SC571-SWZENG

Analog Devices

ADSP-SC571-SWZENG by Analog Devices

ADSP-SC571-SWZENG by Analog Devices is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0 to 70 °C and has a supply voltage range of 3.13V to 3.47V, making it ideal for commercial applications requiring high performance in a compact FLATPACK package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,174 parts In-Stock

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Digiode

USA . 732 parts In-Stock

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732

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Native Components

USA . 551 parts In-Stock

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$0.727

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$0.727

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Northwest PG Solutions

USA . 2,200 parts In-Stock

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$0.800

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$0.800

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Semicontronic

India . 234 parts In-Stock

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$6.000

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$5.850

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$5.820

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$6.000

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AZTECH Wire

Italy . 660 parts In-Stock

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$14.962

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One Stop Electronics

USA . 353 parts In-Stock

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$25.000

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Corohmni

South Africa . 618 parts In-Stock

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$62.791

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Parana Technologies

USA . 1,266 parts In-Stock

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$63.307

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$58.875

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IDEA Electronic Components Group

UK . 1,542 parts In-Stock

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$68.072

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$64.668

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DigiPath Technology Company

USA . 639 parts In-Stock

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$106.192

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$101.945

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$101.945

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Corphita

USA . 529 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the ADSP-SC571-SWZENG by Analog Devices. Known for their top-quality products, Analog Devices is a trusted name in the industry. This product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering versatility and reliability for a wide range of applications. With a focus on innovation and performance, this product delivers exceptional value to customers, providing benefits such as high efficiency, precision, and seamless integration. Upgrade your projects with the ADSP-SC571-SWZENG and experience the advantages that only Analog Devices can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.47 V

Provides a higher voltage limit for better performance and versatility in various applications.

Package Shape: SQUARE

The square shape makes it easy to handle and ensures a uniform footprint on the circuit board.

No. of Terminals: 176

The high number of terminals allows for more connections and functionality in the device.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Offers various styles for different installation needs and thermal management options.

Minimum Supply Voltage: 3.13 V

The low minimum supply voltage ensures efficient power consumption and compatibility with various systems.

Maximum Operating Temperature: 70 °C

Can operate at high temperatures without performance degradation, suitable for challenging environments.

Minimum Operating Temperature: 0 °C

Can function in low-temperature conditions, ensuring reliability in a wide range of operating environments.

Terminal Position: QUAD

The quad terminal position allows for easier connections and reduces the risk of errors during installation.

Maximum Seated Height: 1.6 mm

Low seated height saves space and enables compact designs in electronic devices.

Width: 24 mm

Standard width size for easy integration into different electronic systems.

Length: 24 mm

The square shape with a matching length ensures a balanced layout on the circuit board.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications with predictable performance under typical operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates a powerful microprocessor circuit for advanced processing capabilities and increased functionality.

Technology: CMOS

CMOS technology provides low power consumption and faster operation, enhancing efficiency in various applications.

Terminal Form: GULL WING

The gull-wing terminal form ensures a reliable connection and easy soldering on the circuit board.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage for compatibility with most electronic systems and components.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging and precise connections, essential for compact electronic devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs ADSP-SC571-SWZENG attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of Terminals:

176

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

ADSP-SC571-SWZENG Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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