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XCZU11EG-2FFVB1517E

Xilinx

XCZU11EG-2FFVB1517E by Xilinx

XCZU11EG-2FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance uPs/uCs & Peripheral ICs in compact designs.

Median Price

$6,213.260

Lifecycle Status

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4

In-Stock Inventory

1k+

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Nova Conductors

Japan . 10 parts In-Stock

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$6,213.260

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Vyrian

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VNN

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Digiode

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One Stop Electronics

USA . 1,400 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 216 parts In-Stock

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$10.452

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Ampacity Inc.

Singapore . 374 parts In-Stock

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$19.000

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Corohmni

South Africa . 3,079 parts In-Stock

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Modulus Dynamics

Lithuania . 516 parts In-Stock

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$28.209

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$28.209

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Aztec Data Supply Inc.

USA . 268 parts In-Stock

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$28.900

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Semicontronic

India . 680 parts In-Stock

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$30.070

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MARBEL Systems

Belgium . 1,573 parts In-Stock

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$49.509

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$47.529

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Texas Native Microelectronics

USA . 10 parts In-Stock

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$56.907

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$54.631

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$52.924

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Kenton Components

USA . 2,419 parts In-Stock

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$68.288

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Microchip USA

USA . 1,360 parts In-Stock

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Argo Parts USA

USA . 3,879 parts In-Stock

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$6,099.940

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$6,038.941

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$5,977.941

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$5,916.942

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$5,916.942

Continental Prestige Electronics

USA . 222 parts In-Stock

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$6,099.940

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Supply Digital

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Netroflash

USA . 1,000 parts In-Stock

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$5,902.597

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Qasali Group International

UK . 246 parts In-Stock

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Corphita

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Vigor

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Overview

Unlock the power of cutting-edge technology with the XCZU11EG-2FFVB1517E by Xilinx. As a renowned manufacturer in the industry, Xilinx delivers top-notch quality and reliability in their products. The XCZU11EG-2FFVB1517E falls under the category of Other Function uPs,uCs & Peripheral ICs, making it versatile for various applications. Experience seamless performance and efficiency with this product, offering customers unmatched value and benefits. Elevate your projects to new heights with the XCZU11EG-2FFVB1517E and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and reliability to the product, making it a good choice for long-term use.

Surface Mount: YES

Being surface mount enables easy and efficient installation on PCBs, making the product suitable for compact electronic devices.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage of 0.876 V allows for various power requirements, making the product versatile for different applications.

Package Shape: RECTANGULAR

The rectangular package shape offers easy integration into electronic systems, ensuring space efficiency and streamlined design.

No. of Terminals: 1517

With a high number of terminals, this product offers extensive connectivity options, making it suitable for complex electronic projects.

Package Style (Meter): GRID ARRAY

The grid array package style provides a secure and stable connection, enhancing the overall performance and reliability of the product.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C ensures reliable operation even in demanding environments, making the product suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows for usage in a wide range of environments, making the product versatile and adaptable.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper terminal finish provides superior conductivity and corrosion resistance, ensuring long-term reliability of the product.

Terminal Position: BOTTOM

The bottom terminal position enables easy and secure connection to the PCB, enhancing the overall performance and stability of the product.

Maximum Seated Height: 3.51 mm

The low maximum seated height of 3.51 mm allows for compact design and space-saving installation, making the product ideal for small electronic devices.

Width: 40 mm

With a width of 40 mm, this product offers a balance between compact size and functionality, making it suitable for various electronic applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures quick and efficient soldering during manufacturing, enhancing production efficiency.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C allows for reliable soldering and robust connections, ensuring quality and durability of the product.

Length: 40 mm

With a length of 40 mm, this product offers a compact form factor without compromising on performance, making it suitable for space-constrained applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC type ensures efficient processing and control capabilities, making the product suitable for advanced electronic systems.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high-speed operation, making it energy-efficient and performance-oriented.

Terminal Form: BALL

The ball terminal form provides reliable connections and easy soldering, ensuring stable performance and durability of the product.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage of 0.85 V provides stable and consistent power delivery, ensuring reliable operation of the product in various applications.

Terminal Pitch: 1 mm

With a terminal pitch of 1 mm, this product offers easy and secure connection to the PCB, enhancing the overall reliability and performance.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates the level of protection against moisture, ensuring the longevity and reliability of the product in various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU11EG-2FFVB1517E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.51 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

XCZU11EG-2FFVB1517E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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