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MCIMX6Y7DVK05AA

NXP Semiconductors

MCIMX6Y7DVK05AA by NXP Semiconductors

MCIMX6Y7DVK05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.

Median Price

$9.842

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 159 parts In-Stock

1+ parts

$14.690

100+ parts

$9.961

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159

$14.690

$9.961

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Flip Electronics (Authorized)

USA . 5,980 parts In-Stock

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5,980

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Verical

USA . 5,980 parts In-Stock

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$9.842

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5,980

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$9.842

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Rochester

USA . 807 parts In-Stock

1+ parts

-

100+ parts

$7.980

1k+ parts

$7.140

10k+ parts

$6.720

807

-

$7.980

$7.140

$6.720

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,458 parts In-Stock

1+ parts

$8.417

100+ parts

-

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4,458

$8.417

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$10.920

100+ parts

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100

$10.920

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Flip Electronics

USA . 5,980 parts In-Stock

1+ parts

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5,980

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Vyrian

USA . 4,975 parts In-Stock

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4,975

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Anansix

USA . 1,580 parts In-Stock

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1,580

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,845 parts In-Stock

1+ parts

$7.974

100+ parts

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3,845

$7.974

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$10.920

100+ parts

-

1k+ parts

$10.374

10k+ parts

$10.156

1,000

$10.920

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$10.374

$10.156

Corohmni

South Africa . 1,107 parts In-Stock

1+ parts

$11.441

100+ parts

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1,107

$11.441

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Ampacity Inc.

Singapore . 2,308 parts In-Stock

1+ parts

$16.390

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2,308

$16.390

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Microchip USA

USA . 1,630 parts In-Stock

1+ parts

$45.304

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1,630

$45.304

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UNI Independent Distributors

Spain . 5,109 parts In-Stock

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5,109

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Overview

Unleash the power of innovation with the MCIMX6Y7DVK05AA by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality products that guarantee reliability and performance. This versatile System on Chip is perfect for a wide range of applications, offering unparalleled value and benefits to customers. From its low profile package design to its advanced technology, this product provides the competitive edge you need to stay ahead in today's fast-paced market. Choose NXP Semiconductors for cutting-edge solutions that drive success.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is durable and reliable, making it a good choice for long-term use.

Surface Mount:

YES - This feature allows for easy installation and integration into existing systems.

Maximum Supply Voltage:

1.5 V - The high supply voltage capability ensures compatibility with a wide range of applications.

Package Shape:

SQUARE - The square shape provides a compact design, saving space in circuit boards.

No. of Terminals:

272 - The large number of terminals allows for multiple connections and functions to be supported.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH - This package style offers efficient heat dissipation and a low profile for space-constrained environments.

Minimum Supply Voltage:

1.275 V - The low minimum supply voltage makes this product energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature:

95 °C - With a high operating temperature range, this product can perform reliably in hot environments.

Minimum Operating Temperature:

0 °C - The low minimum operating temperature ensures functionality in cold conditions.

Terminal Position:

BOTTOM - The terminals on the bottom provide a secure connection and easy access for assembling.

Maximum Seated Height:

1.23 mm - The low seated height allows for a compact design and easy integration into tight spaces.

Width:

9 mm - The narrow width makes this product ideal for applications where space is limited.

Maximum Time At Peak Reflow Temperature (s):

40 - This product can withstand high temperatures for a short duration, ensuring durability during reflow processes.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature capability makes this product suitable for soldering processes.

Length:

9 mm - The compact length of this product allows for easy installation in various applications.

Peripheral IC Type:

SYSTEM ON CHIP - This type of peripheral IC offers integrated functionality, reducing the need for additional components.

Technology:

CMOS - The CMOS technology used in this product ensures low power consumption and efficient performance.

Terminal Form:

BALL - The ball terminal form provides a reliable connection and is suitable for automated assembly processes.

Terminal Pitch:

0.5 mm - The small terminal pitch allows for high-density mounting and space-saving on circuit boards.

Moisture Sensitivity Level (MSL):

3 - The MSL level indicates the level of protection against moisture, making this product suitable for various environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Y7DVK05AA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B272

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

272

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA272,17X17,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.23 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Peripheral IC Type:

Trade Compliance

MCIMX6Y7DVK05AA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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