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BALL Other Function uPs,uCs & Peripheral ICs 1,582

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
TCI6636K2HDSAAW2 by Texas Instruments

TCI6636K2HDSAAW2

Texas Instruments

TCI6636K2HDSAAW2 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1517 terminals in a GRID ARRAY package. It operates b/w 0-100 °C with supply voltage range of 0.95-1.05 V, making it ideal for high-performance computing applications. The package measures 40x40 mm and has a max seated height of 3.75 mm, suitable for compact designs requiring advanced CMOS technology.

S-PBGA-B1517

e1

40 mm

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR CIRCUIT

MCIMX6Q4AVT08AE by NXP Semiconductors

MCIMX6Q4AVT08AE

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6D5EYM12AE by NXP Semiconductors

MCIMX6D5EYM12AE

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6Q5EYM12AE by NXP Semiconductors

MCIMX6Q5EYM12AE

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

AM5716AABCXEQ1 by Texas Instruments

AM5716AABCXEQ1

Texas Instruments

AM5716AABCXEQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. With 760 terminals in a GRID ARRAY package style, it has a supply voltage range of 1.11V to 1.2V for versatile usage.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5716AABCXQ1 by Texas Instruments

AM5716AABCXQ1

Texas Instruments

AM5716AABCXQ1 by Texas Instruments is a 760-terminal SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.11V to 1.2V, it features a fine pitch grid array package style for surface mount assembly.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCXEQ1 by Texas Instruments

AM5718AABCXEQ1

Texas Instruments

The Texas Instruments AM5718AABCXEQ1 is a SYSTEM ON CHIP with CMOS technology, operating at -40 to 125 °C. It features 760 terminals in a GRID ARRAY package style, suitable for automotive applications due to AEC-Q100 screening and low supply voltage of 1.11 V.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

AM5718AABCXQ1 by Texas Instruments

AM5718AABCXQ1

Texas Instruments

AM5718AABCXQ1 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates at 1.11-1.2V, suitable for automotive applications. With 760 terminals in a GRID ARRAY package style, it offers high performance at temperatures ranging from -40 to 125°C.

S-PBGA-B760

e1

23 mm

3

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

MCIMX6Y2CVM05AA by NXP Semiconductors

MCIMX6Y2CVM05AA

NXP Semiconductors

MCIMX6Y2CVM05AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates in industrial temperature range (-40 to 105°C) and supports CMOS technology. With a supply voltage range of 1.275V to 1.5V, it is suitable for various applications requiring high-performance microcontrollers.

S-PBGA-B289

14 mm

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6Y2CVM08AA by NXP Semiconductors

MCIMX6Y2CVM08AA

NXP Semiconductors

MCIMX6Y2CVM08AA by NXP Semiconductors is an industrial-grade SoC with CMOS technology. It operates b/w -40 to 105 °C and has a max supply voltage of 1.5 V. With 289 terminals in a square package, it's ideal for applications requiring low-profile, fine-pitch grid arrays.

S-PBGA-B289

14 mm

289

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.325 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

40

14 mm

SoC

MCIMX6DP4AVT8AB by NXP Semiconductors

MCIMX6DP4AVT8AB

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX6DP6AVT8AB by NXP Semiconductors

MCIMX6DP6AVT8AB

NXP Semiconductors

SoC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA624,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SoC

MCIMX7D2DVK12SD by NXP Semiconductors

MCIMX7D2DVK12SD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

85 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D2DVM12SD by NXP Semiconductors

MCIMX7D2DVM12SD

NXP Semiconductors

MCIMX7D2DVM12SD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 1.2-1.25 V. Ideal for applications requiring low profile and fine pitch package style in a grid array format.

S-PBGA-B541

19 mm

3

541

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA541,25X25,29

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.42 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

MCIMX7D3DVK10SD by NXP Semiconductors

MCIMX7D3DVK10SD

NXP Semiconductors

MCIMX7D3DVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating at 0-95°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring thin profile, fine pitch grid arrays in plastic/epoxy packages.

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D3EVK10SD by NXP Semiconductors

MCIMX7D3EVK10SD

NXP Semiconductors

MCIMX7D3EVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating b/w -20 to 105°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B488

12 mm

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D5EVM10SD by NXP Semiconductors

MCIMX7D5EVM10SD

NXP Semiconductors

MCIMX7D5EVM10SD by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 105 °C and has a supply voltage range of 1.2V to 1.25V. With 541 terminals in a GRID ARRAY package, it's ideal for applications requiring low profile and fine pitch components.

S-PBGA-B541

19 mm

3

541

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA541,25X25,29

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.42 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

MCIMX7D7DVK10SD by NXP Semiconductors

MCIMX7D7DVK10SD

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B488

12 mm

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA488,28X28,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

SYSTEM ON CHIP

MCIMX7D7DVM10SD by NXP Semiconductors

MCIMX7D7DVM10SD

NXP Semiconductors

MCIMX7D7DVM10SD by NXP Semiconductors is a SYSTEM ON CHIP with 541 terminals, operating at 0-95°C. It features a low profile GRID ARRAY package style, 0.75mm terminal pitch, and 1.2-1.25V supply voltage range. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B541

19 mm

3

541

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA541,25X25,29

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.42 mm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

SYSTEM ON CHIP

MCIMX6S7CVM08AD by NXP Semiconductors

MCIMX6S7CVM08AD

NXP Semiconductors

MCIMX6S7CVM08AD by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating temperature range of -40 to 105 °C. It is used in industrial applications and has a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6U7CVM08AD by NXP Semiconductors

MCIMX6U7CVM08AD

NXP Semiconductors

MCIMX6U7CVM08AD by NXP Semiconductors is a System on Chip with 624 terminals, operating temperature range of -40 to 105°C. It features a low profile grid array package style and CMOS technology, suitable for industrial applications requiring high performance and reliability.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MCIMX6Y2CVK08AB by NXP Semiconductors

MCIMX6Y2CVK08AB

NXP Semiconductors

MCIMX6Y2CVK08AB by NXP Semiconductors is a 272-terminal SoC with CMOS technology, operating b/w -40 to 105 °C. It has a low profile, fine pitch grid array package and supports surface mount installation. Ideal for applications requiring uPs/uCs & Peripheral ICs in compact designs.

S-PBGA-B272

9 mm

3

272

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.325 V

YES

CMOS

BALL

.5 mm

BOTTOM

40

9 mm

SoC

DLPC3437CZEZ by Texas Instruments

DLPC3437CZEZ

Texas Instruments

DLPC3437CZEZ by Texas Instruments is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 201 terminals in a GRID ARRAY package style, suitable for applications requiring a supply voltage range of 1.045V to 1.155V and operating temperatures from -30°C to 85°C.

S-PBGA-B201

e1

13 mm

3

201

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

13 mm

MICROPROCESSOR CIRCUIT

EFR32FG12P431F1024GL125-C by Silicon Labs

EFR32FG12P431F1024GL125-C

Silicon Labs

EFR32FG12P431F1024GL125-C by Silicon Labs is a 125-terminal uC with CMOS tech. Operates b/w -40 to 85 °C, with supply voltage range of 1.62-3.8 V. Ideal for System on Chip applications due to its very thin profile and fine pitch grid array package style.

S-PBGA-B125

7 mm

125

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA125,13X13,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.94 mm

3.8 V

1.62 V

1.8 V

YES

CMOS

BALL

.5 mm

BOTTOM

7 mm

SYSTEM ON CHIP

MCIMX6Q6AVT08AE by NXP Semiconductors

MCIMX6Q6AVT08AE

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B624

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

10AS066H2F34I1HG by Intel

10AS066H2F34I1HG

Intel

Intel 10AS066H2F34I1HG is a SoC with 1152 terminals in a grid array package. It operates b/w -40°C to 100°C, utilizing TSMC technology. Ideal for applications requiring high performance and compact design due to its small form factor of 35x35mm and ball terminal pitch of 1mm.

S-PBGA-B1152

35 mm

1152

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA1152,34X34,40

SQUARE

GRID ARRAY

3.35 mm

YES

TSMC

BALL

1 mm

BOTTOM

35 mm

SoC

LS1043AXN7PQB by NXP Semiconductors

LS1043AXN7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1023AXE8PQB by NXP Semiconductors

LS1023AXE8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043AXE8PQB by NXP Semiconductors

LS1043AXE8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1023AXE7PQB by NXP Semiconductors

LS1023AXE7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXN8PQB by NXP Semiconductors

LS1043AXN8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1023AXN8PQB by NXP Semiconductors

LS1023AXN8PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1023AXN7PQB by NXP Semiconductors

LS1023AXN7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXE7PQB by NXP Semiconductors

LS1043AXE7PQB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B621

e1

21 mm

3

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043AXE8QQB by NXP Semiconductors

LS1043AXE8QQB

NXP Semiconductors

LS1043AXE8QQB by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 105 °C, with supply voltage range of 0.87V to 0.93V. This IC has 780 terminals in a GRID ARRAY package style and is suitable for industrial applications.

ALSO OPERATES AT 1V SUPPLY NOM

S-PBGA-B780

e1

23 mm

3

780

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

XC7Z030-1FB484I by Xilinx

XC7Z030-1FB484I

Xilinx

PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z030-1SB485I by Xilinx

XC7Z030-1SB485I

Xilinx

The Xilinx XC7Z030-1SB485I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 485 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B485

19 mm

485

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA485,22X22,32

SQUARE

GRID ARRAY

2.44 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

19 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z030-2FB484I by Xilinx

XC7Z030-2FB484I

Xilinx

PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

S-PBGA-B484

23 mm

484

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

23 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z030-2FF676I by Xilinx

XC7Z030-2FF676I

Xilinx

The Xilinx XC7Z030-2FF676I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B676

27 mm

676

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

PROGRAMMABLE SYSTEM ON CHIP

XC7Z045-2FF900I by Xilinx

XC7Z045-2FF900I

Xilinx

The Xilinx XC7Z045-2FF900I is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

S-PBGA-B900

31 mm

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

3.35 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

PROGRAMMABLE SYSTEM ON CHIP

MCIMX6X4AVM08AC by NXP Semiconductors

MCIMX6X4AVM08AC

NXP Semiconductors

MCIMX6X4AVM08AC by NXP Semiconductors is a SoC with 529 terminals, operating b/w -40 to 125 °C. It has a low profile grid array package style and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

S-PBGA-B529

e1

19 mm

3

529

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.52 mm

1.5 V

1.275 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

SoC

XCZU17EG-2FFVB1517E by Xilinx

XCZU17EG-2FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVB1517E by Xilinx

XCZU19EG-2FFVB1517E

Xilinx

XCZU19EG-2FFVB1517E by Xilinx is a CMOS microprocessor circuit with 1517 terminals. It operates b/w 0-100°C, with supply voltage ranging from 0.825-0.876 V. This grid array package is ideal for various applications requiring high-performance processing capabilities in electronic systems.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

MCIMX6Y1DVK05AB by NXP Semiconductors

MCIMX6Y1DVK05AB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 272; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS;

S-PBGA-B272

9 mm

3

272

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA272,17X17,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.23 mm

1.5 V

1.275 V

YES

CMOS

BALL

.5 mm

BOTTOM

40

9 mm

SoC

MCIMX6Y1DVM05AB by NXP Semiconductors

MCIMX6Y1DVM05AB

NXP Semiconductors

SoC; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;

S-PBGA-B289

e1

14 mm

3

289

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1.5 V

1.275 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SoC

AWR1642ABIGABLQ1 by Texas Instruments

AWR1642ABIGABLQ1

Texas Instruments

AWR1642ABIGABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C, suitable for AUTOMOTIVE applications. The package is GRID ARRAY, THIN PROFILE, FINE PITCH with 161 terminals and TIN SILVER COPPER finish.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1572864

AEC-Q100

1.17 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

AWR1642ABISABLQ1 by Texas Instruments

AWR1642ABISABLQ1

Texas Instruments

AWR1642ABISABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14-1.32 V, making it ideal for AUTOMOTIVE applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1572864

AEC-Q100

1.17 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

10.4 mm

MICROPROCESSOR CIRCUIT

AWR1642ABISABLRQ1 by Texas Instruments

AWR1642ABISABLRQ1

Texas Instruments

AWR1642ABISABLRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C, suitable for AUTOMOTIVE applications. The package style is GRID ARRAY, THIN PROFILE, FINE PITCH with 161 terminals and 0.65 mm pitch.

S-PBGA-B161

e1

10.4 mm

3

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1572864

AEC-Q100

1.17 mm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.65 mm

BOTTOM

NOT SPECIFIED

10.4 mm

MICROPROCESSOR CIRCUIT