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MCIMX6Y2CVK08AB

NXP Semiconductors

MCIMX6Y2CVK08AB by NXP Semiconductors

MCIMX6Y2CVK08AB by NXP Semiconductors is a 272-terminal SoC with CMOS technology, operating b/w -40 to 105 °C. It has a low profile, fine pitch grid array package and supports surface mount installation. Ideal for applications requiring uPs/uCs & Peripheral ICs in compact designs.

Median Price

$9.613

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4,337 parts In-Stock

1+ parts

$7.757

100+ parts

-

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10k+ parts

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4,337

$7.757

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Chip1Stop

Japan . 260 parts In-Stock

1+ parts

$9.170

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260

$9.170

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Newark

USA . 360 parts In-Stock

1+ parts

$10.190

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-

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360

$10.190

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-

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Mouser Electronics

USA . 210 parts In-Stock

1+ parts

$15.200

100+ parts

$11.060

1k+ parts

$10.700

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-

210

$15.200

$11.060

$10.700

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Verical

USA . 9,360 parts In-Stock

1+ parts

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100+ parts

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$9.613

10k+ parts

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9,360

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-

$9.613

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,484 parts In-Stock

1+ parts

$10.024

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2,484

$10.024

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$13.835

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10

$13.835

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Chip Stock

USA . 14,460 parts In-Stock

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14,460

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Vyrian

USA . 8,098 parts In-Stock

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8,098

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Anansix

USA . 2,825 parts In-Stock

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2,825

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NexGen Digital

USA . 536 parts In-Stock

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536

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Distributors (Availability)

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Ampacity Inc.

Singapore . 918 parts In-Stock

1+ parts

$8.970

100+ parts

-

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918

$8.970

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Corphita

USA . 2,615 parts In-Stock

1+ parts

$9.497

100+ parts

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2,615

$9.497

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$13.558

100+ parts

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1k+ parts

$13.016

10k+ parts

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1,000

$13.558

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$13.016

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Continental Prestige Electronics

USA . 3,050 parts In-Stock

1+ parts

$13.835

100+ parts

-

1k+ parts

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10k+ parts

$13.558

3,050

$13.835

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-

$13.558

Advanced Electronics

New Zealand . 42 parts In-Stock

1+ parts

$14.112

100+ parts

$14.112

1k+ parts

$14.112

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42

$14.112

$14.112

$14.112

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Corohmni

South Africa . 325 parts In-Stock

1+ parts

$15.878

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325

$15.878

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Microchip USA

USA . 2,987 parts In-Stock

1+ parts

$37.173

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2,987

$37.173

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Aztec Data Supply Inc.

USA . 854 parts In-Stock

1+ parts

$79.480

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854

$79.480

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Lixinc

USA . 10,541 parts In-Stock

1+ parts

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10,541

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A-Z Elektronik GmbH

Germany . 5,200 parts In-Stock

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5,200

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UNI Independent Distributors

Spain . 5,126 parts In-Stock

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5,126

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Argo Parts USA

USA . 4,511 parts In-Stock

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4,511

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GreenTree Electronics

Israel . 2,600 parts In-Stock

1+ parts

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2,600

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ChipstoGo Electronic ltd

UK . 260 parts In-Stock

1+ parts

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260

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Overview

Unlock endless possibilities with the MCIMX6Y2CVK08AB by NXP Semiconductors. This innovative product boasts superior quality and reliability, setting it apart in the market of Other Function uPs,uCs & Peripheral ICs. Designed to meet the diverse needs of customers, this device offers unmatched value and benefits across various applications. From its cutting-edge technology to its high-performance features, the MCIMX6Y2CVK08AB delivers a seamless user experience that exceeds expectations. Experience the difference with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.5 V

Operates at a low voltage, making it efficient and reducing power consumption.

Package Shape: SQUARE

Square packages are space-saving and provide a neat appearance on the PCB.

Maximum Operating Temperature: 105 °C

Can operate reliably at high temperatures, increasing versatility in various applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments without performance issues.

Peripheral IC Type: SoC

System on Chip design integrates multiple functionalities into a single IC, reducing PCB footprint and simplifying design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6Y2CVK08AB attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B272

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

272

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA272,17X17,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.23 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6Y2CVK08AB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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