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MCIMX7D3DVK10SD

NXP Semiconductors

MCIMX7D3DVK10SD by NXP Semiconductors

MCIMX7D3DVK10SD by NXP Semiconductors is a System on Chip with 488 terminals, operating at 0-95°C. It has a supply voltage range of 1.2-1.25V and uses CMOS technology. Ideal for applications requiring thin profile, fine pitch grid arrays in plastic/epoxy packages.

Median Price

$27.539

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 39 parts In-Stock

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$35.240

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$24.220

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$23.610

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Flip Electronics (Authorized)

USA . 42 parts In-Stock

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Verical

USA . 42 parts In-Stock

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$19.838

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Nova Conductors

Japan . 98 parts In-Stock

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$20.902

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Digiode

USA . 4,131 parts In-Stock

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Vyrian

USA . 3,432 parts In-Stock

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Anansix

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AZTECH Wire

Italy . 898 parts In-Stock

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$18.748

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Aranea Global

USA . 100 parts In-Stock

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$20.484

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$19.665

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Continental Prestige Electronics

USA . 2,720 parts In-Stock

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Ampacity Inc.

Singapore . 70 parts In-Stock

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$24.530

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Corphita

USA . 4,423 parts In-Stock

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$25.974

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Microchip USA

USA . 2,880 parts In-Stock

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UNI Independent Distributors

Spain . 7,384 parts In-Stock

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GreenTree Electronics

Israel . 807 parts In-Stock

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Argo Parts USA

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Overview

Discover the cutting-edge MCIMX7D3DVK10SD by NXP Semiconductors, setting new standards in Other Function uPs,uCs & Peripheral ICs. With NXP's reputation for top-tier quality and innovation, this product offers unparalleled performance and reliability. Ideal for a wide range of applications, this System on Chip boasts advanced technology and a compact design, making it a versatile solution for your project needs. Experience the value and benefits of NXP's MCIMX7D3DVK10SD and unlock endless possibilities for your next endeavor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and cost-effective, making the product easier to handle and less expensive to produce.

Surface Mount: YES

Surface mount technology allows for a higher component density and better electrical performance, making the product ideal for compact and high-performance applications.

Maximum Supply Voltage: 1.25 V

The maximum supply voltage of 1.25 V ensures safe operation and prevents damage to the product under high voltage conditions.

Package Shape: SQUARE

Square package shape offers uniform thermal characteristics and easy integration into circuit layouts, enhancing overall system reliability.

No. of Terminals: 488

High number of terminals allow for greater connectivity options, enabling the product to interface with a wide range of external devices.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in cold environments.

Maximum Operating Temperature: 95 °C

The maximum operating temperature of 95°C allows the product to function efficiently in a variety of operating conditions.

Maximum Seated Height: 1.1 mm

Low seated height enables the product to be used in slim and compact electronic designs, saving valuable space.

Peripheral IC Type: SYSTEM ON CHIP

System on Chip integration simplifies design complexity, reduces component count, and improves overall system performance and efficiency.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX7D3DVK10SD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B488

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

488

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA488,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.225 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MCIMX7D3DVK10SD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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