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MCIMX7D7DVK10SD

NXP Semiconductors

MCIMX7D7DVK10SD by NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

Median Price

$23.254

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 131 parts In-Stock

1+ parts

$37.710

100+ parts

$25.920

1k+ parts

$25.270

10k+ parts

-

131

$37.710

$25.920

$25.270

-

Rochester

USA . 21,367 parts In-Stock

1+ parts

-

100+ parts

$20.670

1k+ parts

$18.500

10k+ parts

$17.410

21,367

-

$20.670

$18.500

$17.410

Verical

USA . 21,361 parts In-Stock

1+ parts

-

100+ parts

$25.837

1k+ parts

$23.125

10k+ parts

$21.762

21,361

-

$25.837

$23.125

$21.762

Flip Electronics (Authorized)

USA . 19,195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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19,195

-

-

-

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DigiKey

USA . 195 parts In-Stock

1+ parts

-

100+ parts

$18.390

1k+ parts

-

10k+ parts

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195

-

$18.390

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,384 parts In-Stock

1+ parts

$18.183

100+ parts

-

1k+ parts

-

10k+ parts

-

1,384

$18.183

-

-

-

Flip Electronics

USA . 27,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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27,700

-

-

-

-

Chip Stock

USA . 7,788 parts In-Stock

1+ parts

-

100+ parts

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7,788

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-

-

-

Vyrian

USA . 7,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,155

-

-

-

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Anansix

USA . 689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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689

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,390 parts In-Stock

1+ parts

$17.226

100+ parts

-

1k+ parts

-

10k+ parts

-

1,390

$17.226

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$24.906

100+ parts

$22.664

1k+ parts

$20.423

10k+ parts

-

500

$24.906

$22.664

$20.423

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Microchip USA

USA . 2,925 parts In-Stock

1+ parts

$50.587

100+ parts

-

1k+ parts

-

10k+ parts

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2,925

$50.587

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Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,600

-

-

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GreenTree Electronics

Israel . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,000

-

-

-

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A-Z Elektronik GmbH

Germany . 4,967 parts In-Stock

1+ parts

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100+ parts

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4,967

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UNI Independent Distributors

Spain . 1,615 parts In-Stock

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1,615

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX7D7DVK10SD attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B488

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

488

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA488,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.225 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MCIMX7D7DVK10SD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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