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AWR1642ABISABLRQ1

Texas Instruments

AWR1642ABISABLRQ1 by Texas Instruments

AWR1642ABISABLRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C, suitable for AUTOMOTIVE applications. The package style is GRID ARRAY, THIN PROFILE, FINE PITCH with 161 terminals and 0.65 mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,407 parts In-Stock

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3,407

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Digiode

USA . 1,204 parts In-Stock

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1,204

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Distributors (Availability)

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Native Components

USA . 108 parts In-Stock

1+ parts

$1.449

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-

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108

$1.449

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Northwest PG Solutions

USA . 654 parts In-Stock

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$1.594

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654

$1.594

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AZTECH Wire

Italy . 456 parts In-Stock

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$15.879

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456

$15.879

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Parana Technologies

USA . 1,417 parts In-Stock

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$26.848

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$29.256

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1,417

$26.848

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$29.256

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ChromeModa Solutions

Germany . 6,272 parts In-Stock

1+ parts

$30.166

100+ parts

$24.736

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6,272

$30.166

$24.736

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IDEA Electronic Components Group

UK . 2,004 parts In-Stock

1+ parts

$30.166

100+ parts

$28.658

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$27.149

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2,004

$30.166

$28.658

$27.149

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One Stop Electronics

USA . 1,050 parts In-Stock

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$34.000

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1,050

$34.000

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Corohmni

South Africa . 85 parts In-Stock

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$43.031

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85

$43.031

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Corphita

USA . 4,755 parts In-Stock

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4,755

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Epart123

USA . 2,000 parts In-Stock

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$228.000

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$225.000

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$225.000

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$228.000

$225.000

$225.000

DigiPath Technology Company

USA . 922 parts In-Stock

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$27.198

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922

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$27.198

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Overview

Unleash the power of cutting-edge technology with the AWR1642ABISABLRQ1 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-of-the-line quality and reliability, making this product a standout choice for various applications. With its advanced features and innovative design, this microprocessor circuit offers unparalleled performance, efficiency, and precision. Elevate your projects to new heights with the AWR1642ABISABLRQ1 and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the IC, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and simplifying the manufacturing process.

Maximum Supply Voltage: 1.32 V

Can handle high supply voltages, making it suitable for a wide range of applications without risk of damage.

Screening Level: AEC-Q100

Compliance with automotive electronic component standards ensures high quality and reliability for automotive applications.

No. of Terminals: 161

Provides a wide range of connectivity options, allowing for versatile integration into various electronic systems.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, making it ideal for automotive and industrial applications in harsh environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Offers advanced processing capabilities and integration options, making it suitable for complex applications requiring high computational power.

RAM Bytes: 1572864

Large RAM capacity enables efficient data processing and storage, enhancing the performance of the IC in handling complex tasks.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high speed operation, improving overall efficiency.

Nominal Supply Voltage: 1.2 V

Operates at a standard voltage level, ensuring compatibility with a wide range of electronic systems and power sources.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AWR1642ABISABLRQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B161

JESD-609 Code:

e1

Length:

10.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

161

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1572864

Screening Level:

AEC-Q100

Maximum Seated Height:

1.17 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10.4 mm

Peripheral IC Type:

Trade Compliance

AWR1642ABISABLRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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