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AWR1443FQIGABLRQ1

Texas Instruments

AWR1443FQIGABLRQ1 by Texas Instruments

AWR1443FQIGABLRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 589824 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14V to 1.32V, making it ideal for AUTOMOTIVE applications. The package style is GRID ARRAY with 161 terminals in a SQUARE shape, suitable for surface mount assembly.

Median Price

$27.795

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,840 parts In-Stock

1+ parts

$23.960

100+ parts

$21.298

1k+ parts

$15.660

10k+ parts

-

2,840

$23.960

$21.298

$15.660

-

DigiKey

USA . 13 parts In-Stock

1+ parts

$31.630

100+ parts

$25.351

1k+ parts

$23.328

10k+ parts

-

13

$31.630

$25.351

$23.328

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 714 parts In-Stock

1+ parts

$22.762

100+ parts

-

1k+ parts

-

10k+ parts

-

714

$22.762

-

-

-

Vyrian

USA . 3,573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,573

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 320 parts In-Stock

1+ parts

$0.932

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$0.932

-

-

-

Northwest PG Solutions

USA . 1,790 parts In-Stock

1+ parts

$1.026

100+ parts

-

1k+ parts

-

10k+ parts

-

1,790

$1.026

-

-

-

Corphita

USA . 563 parts In-Stock

1+ parts

$21.564

100+ parts

-

1k+ parts

-

10k+ parts

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563

$21.564

-

-

-

Parana Technologies

USA . 2,191 parts In-Stock

1+ parts

$45.185

100+ parts

-

1k+ parts

-

10k+ parts

-

2,191

$45.185

-

-

-

Corohmni

South Africa . 4,928 parts In-Stock

1+ parts

$46.473

100+ parts

-

1k+ parts

-

10k+ parts

-

4,928

$46.473

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-

-

DigiPath Technology Company

USA . 1,381 parts In-Stock

1+ parts

$49.755

100+ parts

-

1k+ parts

-

10k+ parts

-

1,381

$49.755

-

-

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ChromeModa Solutions

Germany . 5,198 parts In-Stock

1+ parts

$50.770

100+ parts

$41.631

1k+ parts

-

10k+ parts

-

5,198

$50.770

$41.631

-

-

IDEA Electronic Components Group

UK . 1,173 parts In-Stock

1+ parts

$50.770

100+ parts

$48.232

1k+ parts

$45.693

10k+ parts

-

1,173

$50.770

$48.232

$45.693

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

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Overview

Unlock the power of cutting-edge technology with the AWR1443FQIGABLRQ1 by Texas Instruments. Designed for automotive applications, this MICROPROCESSOR CIRCUIT offers unparalleled quality and reliability, thanks to Texas Instruments' reputation for excellence. With a compact package style and wide temperature range, this product ensures optimal performance in any environment. Experience seamless integration and superior functionality with the AWR1443FQIGABLRQ1, setting new standards in the industry. Elevate your projects with Texas Instruments' innovative solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for automotive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and cost during production.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage ensures stable performance and reliability under varying operating conditions.

Screening Level: AEC-Q100

AEC-Q100 screening level indicates that the product meets automotive industry standards for quality and reliability, suitable for automotive applications.

No. of Terminals: 161

The high number of terminals provides extensive connectivity options for various input and output connections, enhancing the versatility of the product.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array packaging with thin profile and fine pitch design allows for compact integration and efficient use of space on the circuit board.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, critical for automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold temperature environments, making it suitable for automotive use.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability of connections.

Width: 10.4 mm

The compact width of 10.4 mm allows for space-efficient integration into electronic systems or devices.

Peak Reflow Temperature: 260 C

The high peak reflow temperature tolerance ensures that the product can withstand the heat stress of soldering processes during assembly.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification signifies that the product is designed to meet the stringent performance requirements of automotive industry standards.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit as a peripheral IC enhances the processing capabilities of the product, making it suitable for complex computing tasks.

RAM Bytes: 589824

The large RAM capacity of 589824 bytes allows for efficient data processing and storage, ideal for handling complex computing operations.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, enhancing the energy efficiency and reliability of the product.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V ensures optimal power usage and efficient performance, suitable for a wide range of applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AWR1443FQIGABLRQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B161

JESD-609 Code:

e1

Length:

10.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

161

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

589824

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.4 mm

Peripheral IC Type:

Trade Compliance

AWR1443FQIGABLRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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