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AWR1642ABIGABLQ1

Texas Instruments

AWR1642ABIGABLQ1 by Texas Instruments

AWR1642ABIGABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 1572864 RAM Bytes. It operates at -40 to 125 °C, suitable for AUTOMOTIVE applications. The package is GRID ARRAY, THIN PROFILE, FINE PITCH with 161 terminals and TIN SILVER COPPER finish.

Median Price

$39.850

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,111 parts In-Stock

1+ parts

$29.682

100+ parts

$26.384

1k+ parts

$19.400

10k+ parts

-

2,111

$29.682

$26.384

$19.400

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DigiKey

USA . 175 parts In-Stock

1+ parts

$39.850

100+ parts

$33.015

1k+ parts

$31.436

10k+ parts

-

175

$39.850

$33.015

$31.436

-

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$43.400

100+ parts

$32.230

1k+ parts

$31.110

10k+ parts

-

3

$43.400

$32.230

$31.110

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 50 parts In-Stock

1+ parts

$27.484

100+ parts

-

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-

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50

$27.484

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-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$29.100

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-

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100

$29.100

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-

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Vyrian

USA . 7,974 parts In-Stock

1+ parts

-

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7,974

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Chip Stock

USA . 2,675 parts In-Stock

1+ parts

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2,675

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VNN

France . 82 parts In-Stock

1+ parts

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82

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 740 parts In-Stock

1+ parts

$20.610

100+ parts

-

1k+ parts

-

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740

$20.610

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-

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Corphita

USA . 4,824 parts In-Stock

1+ parts

$26.037

100+ parts

-

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4,824

$26.037

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Netroflash

USA . 100 parts In-Stock

1+ parts

$29.100

100+ parts

$28.518

1k+ parts

-

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100

$29.100

$28.518

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Parana Technologies

USA . 727 parts In-Stock

1+ parts

$41.844

100+ parts

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727

$41.844

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DigiPath Technology Company

USA . 1,201 parts In-Stock

1+ parts

$46.076

100+ parts

$42.390

1k+ parts

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10k+ parts

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1,201

$46.076

$42.390

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ChromeModa Solutions

Germany . 4,261 parts In-Stock

1+ parts

$47.016

100+ parts

$38.553

1k+ parts

-

10k+ parts

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4,261

$47.016

$38.553

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IDEA Electronic Components Group

UK . 1,584 parts In-Stock

1+ parts

$47.016

100+ parts

$44.665

1k+ parts

$42.314

10k+ parts

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1,584

$47.016

$44.665

$42.314

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Corohmni

South Africa . 111 parts In-Stock

1+ parts

$81.865

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-

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111

$81.865

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Lixinc

USA . 4,984 parts In-Stock

1+ parts

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4,984

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Overview

Unleash the power of cutting-edge technology with the AWR1642ABIGABLQ1 by Texas Instruments. Crafted with precision and expertise, this peripheral IC offers unparalleled performance and reliability for a wide range of automotive applications. With its advanced features and high-quality construction, this microprocessor circuit is designed to optimize efficiency and enhance functionality. Experience seamless integration and superior functionality with the AWR1642ABIGABLQ1, setting new standards in the industry. Elevate your projects and transform your designs with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards.

Maximum Supply Voltage: 1.32 V

Ensures safe operation within specified voltage limits.

Screening Level: AEC-Q100

Compliance with automotive quality standards ensures reliability in harsh environments.

Package Shape: SQUARE

Square shape allows for efficient use of board space.

No. of Terminals: 161

Provides a high level of connectivity for various functions.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Compact package style allows for high-density mounting and efficient heat dissipation.

Minimum Supply Voltage: 1.14 V

Ensures reliable operation even at low voltages.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Capable of operating in cold environments without issues.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for the terminals.

Terminal Position: BOTTOM

Allows for easy and convenient connection in circuit designs.

Maximum Seated Height: 1.17 mm

Low profile design minimizes space requirements on the PCB.

Width: 10.4 mm

Compact width for efficient board layout.

Maximum Time At Peak Reflow Temperature (s): 30

Suitable reflow time for proper soldering during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature capability for reliable solder joints.

Length: 10.4 mm

Compact length for space-saving board designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability in automotive applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integrated microprocessor circuit for advanced processing capabilities.

RAM Bytes: 1572864

Large RAM capacity for storing and processing data efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable connections and easy soldering.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 0.65 mm

Fine terminal pitch for high-density packaging.

Moisture Sensitivity Level (MSL): 3

Moderate MSL level suitable for standard handling and storage practices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AWR1642ABIGABLQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B161

JESD-609 Code:

e1

Length:

10.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

161

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1572864

Screening Level:

AEC-Q100

Maximum Seated Height:

1.17 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.4 mm

Peripheral IC Type:

Trade Compliance

AWR1642ABIGABLQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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