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AWR1443FQIGABLQ1

Texas Instruments

AWR1443FQIGABLQ1 by Texas Instruments

AWR1443FQIGABLQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 589824 RAM Bytes. It operates at -40 to 125 °C and has a supply voltage range of 1.14V to 1.32V, making it ideal for AUTOMOTIVE applications. The package style is GRID ARRAY with 161 terminals in a SQUARE shape, suitable for surface mount assembly.

Median Price

$27.020

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

1+ parts

$7.302

100+ parts

-

1k+ parts

$7.007

10k+ parts

-

2

$7.302

-

$7.007

-

Chip1Stop

Japan . 2 parts In-Stock

1+ parts

$14.900

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$14.900

-

-

-

Texas Instruments

USA . 145,802 parts In-Stock

1+ parts

$27.020

100+ parts

$24.018

1k+ parts

$17.660

10k+ parts

-

145,802

$27.020

$24.018

$17.660

-

Mouser Electronics

USA . 158 parts In-Stock

1+ parts

$31.960

100+ parts

$28.760

1k+ parts

$28.280

10k+ parts

-

158

$31.960

$28.760

$28.280

-

DigiKey

USA . 153 parts In-Stock

1+ parts

$34.800

100+ parts

$28.769

1k+ parts

-

10k+ parts

-

153

$34.800

$28.769

-

-

Rochester

USA . 319 parts In-Stock

1+ parts

-

100+ parts

$25.010

1k+ parts

$22.380

10k+ parts

$21.060

319

-

$25.010

$22.380

$21.060

Verical

USA . 319 parts In-Stock

1+ parts

-

100+ parts

$31.262

1k+ parts

$27.975

10k+ parts

$26.325

319

-

$31.262

$27.975

$26.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,236 parts In-Stock

1+ parts

$6.937

100+ parts

-

1k+ parts

-

10k+ parts

-

2,236

$6.937

-

-

-

Vyrian

USA . 7,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,366

-

-

-

-

DigiKey Marketplace

USA . 319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

319

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 861 parts In-Stock

1+ parts

$0.522

100+ parts

-

1k+ parts

-

10k+ parts

-

861

$0.522

-

-

-

Northwest PG Solutions

USA . 229 parts In-Stock

1+ parts

$0.574

100+ parts

-

1k+ parts

-

10k+ parts

-

229

$0.574

-

-

-

Corphita

USA . 1,105 parts In-Stock

1+ parts

$6.572

100+ parts

-

1k+ parts

-

10k+ parts

-

1,105

$6.572

-

-

-

Ampacity Inc.

Singapore . 20,643 parts In-Stock

1+ parts

$13.510

100+ parts

-

1k+ parts

-

10k+ parts

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20,643

$13.510

-

-

-

Component Stockers USA

USA . 36,766 parts In-Stock

1+ parts

$24.900

100+ parts

$23.400

1k+ parts

$18.780

10k+ parts

$18.780

36,766

$24.900

$23.400

$18.780

$18.780

Parana Technologies

USA . 1,966 parts In-Stock

1+ parts

$25.395

100+ parts

-

1k+ parts

$26.020

10k+ parts

-

1,966

$25.395

-

$26.020

-

DigiPath Technology Company

USA . 145 parts In-Stock

1+ parts

$27.963

100+ parts

-

1k+ parts

-

10k+ parts

-

145

$27.963

-

-

-

ChromeModa Solutions

Germany . 6,755 parts In-Stock

1+ parts

$28.534

100+ parts

$23.398

1k+ parts

-

10k+ parts

-

6,755

$28.534

$23.398

-

-

IDEA Electronic Components Group

UK . 379 parts In-Stock

1+ parts

$28.534

100+ parts

$27.107

1k+ parts

$25.681

10k+ parts

-

379

$28.534

$27.107

$25.681

-

Corohmni

South Africa . 3,200 parts In-Stock

1+ parts

$29.795

100+ parts

-

1k+ parts

-

10k+ parts

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3,200

$29.795

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Lixinc

USA . 14,743 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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14,743

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Overview

Experience unparalleled performance and reliability with the AWR1443FQIGABLQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge solutions for automotive applications with this innovative MICROPROCESSOR CIRCUIT. The AEC-Q100 screening level ensures quality and durability, making it the perfect choice for automotive electronics. With its compact size and advanced CMOS technology, this product offers exceptional value and benefits to customers looking for high-quality performance in their designs. Trust Texas Instruments to provide you with the best-in-class solutions for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material provides durability and protection for the internal components of the product.

Surface Mount: YES

Being surface mountable makes installation of this product easier and more efficient.

Maximum Supply Voltage: 1.32 V

Allows for higher power supply which can support more complex functions and operations.

Screening Level: AEC-Q100

This screening level ensures that the product meets automotive industry standards for quality and reliability.

Package Shape: SQUARE

The square package shape provides a compact design for space-saving installation.

No. of Terminals: 161

A higher number of terminals allows for greater connectivity options and functionality.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style contributes to better performance and reliability in a compact form factor.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and operating costs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable operation in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides good conductivity and corrosion resistance for long-term use.

Terminal Position: BOTTOM

Bottom terminal position allows for easier and more secure soldering during installation.

Maximum Seated Height: 1.17 mm

The low maximum seated height contributes to a thinner and more compact overall product design.

Width: 10.4 mm

The width measurement provides information on the physical dimensions of the product for compatibility with various applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, the product can withstand reflow soldering processes efficiently.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability during manufacturing processes.

Length: 10.4 mm

The length measurement provides information on the physical dimensions of the product for compatibility with various applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the product can withstand the harsh conditions of automotive environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC type enables advanced computing capabilities for the product.

RAM Bytes: 589824

Having a large RAM capacity of 589824 bytes allows for efficient and high-speed data processing.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high performance.

Terminal Form: BALL

The ball terminal form provides secure connections and is suitable for high-density applications.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V is suitable for a wide range of operating conditions and power efficiency.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting and compact design.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs AWR1443FQIGABLQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B161

JESD-609 Code:

e1

Length:

10.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

161

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

589824

Screening Level:

AEC-Q100

Maximum Seated Height:

1.17 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.4 mm

Peripheral IC Type:

Trade Compliance

AWR1443FQIGABLQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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