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MCIMX6X4AVM08AC

NXP Semiconductors

MCIMX6X4AVM08AC by NXP Semiconductors

MCIMX6X4AVM08AC by NXP Semiconductors is a SoC with 529 terminals, operating b/w -40 to 125 °C. It has a low profile grid array package style and uses CMOS technology. Ideal for applications requiring high performance in compact spaces.

Median Price

$47.555

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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Arrow

USA . 320 parts In-Stock

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$45.080

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$32.060

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$30.190

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Verical

USA . 320 parts In-Stock

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$45.080

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$32.060

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$30.190

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$45.080

$32.060

$30.190

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Element14

Singapore . 84 parts In-Stock

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$50.030

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$39.410

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$37.590

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DigiKey

USA . 653 parts In-Stock

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$51.530

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$37.697

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$36.210

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Mouser Electronics

USA . 57 parts In-Stock

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$54.700

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$39.400

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EBV Elektronik

Germany . 168 parts In-Stock

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Rochester

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$31.330

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$28.030

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$26.380

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$26.380

Distributors (In-Stock)

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Digiode

USA . 4,097 parts In-Stock

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$27.560

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Nova Conductors

Japan . 91 parts In-Stock

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$35.080

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RLX Solution Inc.

Canada . 25,000 parts In-Stock

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Vyrian

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Anansix

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Chip Stock

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Flip Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 181 parts In-Stock

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$24.660

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Corphita

USA . 4,152 parts In-Stock

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$26.109

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Continental Prestige Electronics

USA . 1,062 parts In-Stock

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$34.378

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Netroflash

USA . 50 parts In-Stock

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Corohmni

South Africa . 144 parts In-Stock

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Aztec Data Supply Inc.

USA . 136 parts In-Stock

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Microchip USA

USA . 2,338 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Argo Parts USA

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Perfect Parts

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UNI Independent Distributors

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Overview

Elevate your electronic designs with the MCIMX6X4AVM08AC from NXP Semiconductors. This cutting-edge peripheral IC offers unmatched quality and reliability, backed by a trusted manufacturer with a proven track record in the industry. Ideal for a wide range of applications, this product boasts a myriad of benefits including high performance, low power consumption, and seamless integration. Unlock new possibilities and streamline your projects with the MCIMX6X4AVM08AC - the ultimate solution for your next innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 1.5 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product more energy-efficient.

Package Shape: SQUARE

Square packages are space-efficient and allow for easier placement on PCBs, optimizing board layout.

No. of Terminals: 529

Having a high number of terminals allows for more connectivity options and functionality in the product.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style is ideal for compact designs and high-density integration, making the product suitable for applications with limited space.

Minimum Supply Voltage: 1.275 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, increasing flexibility in product design.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to operate reliably in harsh environments without the risk of overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in extreme cold conditions, expanding its range of applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies the PCB layout and allows for easier heat dissipation, improving overall product performance.

Maximum Seated Height: 1.52 mm

The low seated height enables a compact design and reduces the overall size of the product, making it suitable for space-constrained applications.

Width: 19 mm

The compact width of the product allows for efficient use of PCB space and supports a streamlined design.

Maximum Time At Peak Reflow Temperature (s): 40

The short peak reflow time minimizes the risk of thermal damage during assembly, ensuring product reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature supports lead-free assembly processes, making the product environmentally friendly.

Length: 19 mm

The compact length of the product contributes to a space-saving design and easier integration into various applications.

Peripheral IC Type: SoC

The System-on-Chip (SoC) integration offers multiple functionalities in a single chip, reducing component count and enhancing product efficiency.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form allows for reliable and secure connections, enhancing the product's overall durability and performance.

Terminal Pitch: 0.8 mm

The narrow terminal pitch enables high-density integration and fine-pitch assembly, optimizing PCB layout and minimizing footprint.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates that the product can withstand moderate exposure to moisture during assembly and operation, ensuring long-term reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX6X4AVM08AC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

529

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.52 mm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.275 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

19 mm

Peripheral IC Type:

SoC

Trade Compliance

MCIMX6X4AVM08AC Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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