Loading...

BALL Other Function uPs,uCs & Peripheral ICs 1,582

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Information Access Method Integrated Cache Interrupt Capability JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Volatile Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
ATMXT224T-CCU027 by Microchip Technology

ATMXT224T-CCU027

Microchip Technology

CAPACITIVE TOUCH SCREEN CONTROLLERS; Terminal Form: BALL; No. of Terminals: 64; Package Code: VFBGA; Package Shape: SQUARE; Surface Mount: YES;

S-PBGA-B64

5 mm

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

BGA64,8X8,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.6 mm

3.47 V

3 V

3.3 V

YES

CMOS

BALL

.5 mm

BOTTOM

5 mm

CAPACITIVE TOUCH SCREEN CONTROLLERS

MEC1705Q-C2-I/SZ by Microchip Technology

MEC1705Q-C2-I/SZ

Microchip Technology

MEC1705Q-C2-I/SZ by Microchip Technology is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.71-1.89 V. This IC is ideal for industrial applications requiring very thin profile and fine pitch grid array package style.

ALSO OPERATES AT 3.3V NOMINAL SUPPLY VOLTAGE

S-PBGA-B144

9 mm

144

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

1.89 V

1.71 V

1.8 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

9 mm

MICROPROCESSOR CIRCUIT

MIMX8MN6DVTJZAA by NXP Semiconductors

MIMX8MN6DVTJZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MN6DVTJZAA is a low-profile, fine-pitch grid array SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MCIMX6S6AVM08ACR by NXP Semiconductors

MCIMX6S6AVM08ACR

NXP Semiconductors

MCIMX6S6AVM08ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with a supply voltage range of 1.275V to 1.5V. Ideal for automotive applications due to its low profile and fine pitch package style.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE;EACH GPIO MODULE SUPPORTS 32 BITS OF I/O

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

XC7Z045-1FBG676CES by Xilinx

XC7Z045-1FBG676CES

Xilinx

PROGRAMMABLE SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.05 V;

S-PBGA-B676

27 mm

676

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA676,26X26,40

SQUARE

GRID ARRAY

2.54 mm

1.05 V

.95 V

1 V

YES

CMOS

BALL

1 mm

BOTTOM

27 mm

PROGRAMMABLE SYSTEM ON CHIP

66AK2G12ABYT100 by Texas Instruments

66AK2G12ABYT100

Texas Instruments

66AK2G12ABYT100 by Texas Instruments is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 0.95V to 1.05V, making it ideal for automotive applications. This package features a grid array with 625 terminals in a low profile, fine pitch design for surface mount assembly.

S-PBGA-B625

e1

21 mm

3

625

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.56 mm

1.05 V

.95 V

1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

DLPC900AZPC by Texas Instruments

DLPC900AZPC

Texas Instruments

DLPC900AZPC by Texas Instruments is a MICROPROCESSOR CIRCUIT with 516 terminals, operating at a max clock frequency of 20 MHz. It is used in applications requiring I2C, SPI, UART, and USB bus compatibility.

I2C; SPI; UART; USB

20 MHz

16

S-PBGA-B516

27 mm

9

516

55 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

2.42 mm

1.2 V

1.1 V

1.15 V

YES

CMOS

COMMERCIAL

BALL

1 mm

BOTTOM

27 mm

MICROPROCESSOR CIRCUIT

MCIMX286DVM4BR by NXP Semiconductors

MCIMX286DVM4BR

NXP Semiconductors

MCIMX286DVM4BR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35-1.55 V, making it ideal for low-power applications in various electronic devices.

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

S-PBGA-B289

e1

14 mm

3

289

70 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.37 mm

1.55 V

1.35 V

1.45 V

YES

CMOS

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

14 mm

SYSTEM ON CHIP

DRA784BSGABFQ1 by Texas Instruments

DRA784BSGABFQ1

Texas Instruments

DRA784BSGABFQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width, operating at 32 MHz clock frequency. Ideal for automotive applications, it features a max supply voltage of 1.11 V and can withstand temperatures from -40 to 125 °C.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA784BSGABFRQ1 by Texas Instruments

DRA784BSGABFRQ1

Texas Instruments

DRA784BSGABFRQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA785BSGABFQ1 by Texas Instruments

DRA785BSGABFQ1

Texas Instruments

The Texas Instruments DRA785BSGABFQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Designed for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02V to 1.11V.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA785BSGABFRQ1 by Texas Instruments

DRA785BSGABFRQ1

Texas Instruments

The Texas Instruments DRA785BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage range of 1.02-1.11 V.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA788BSGABFQ1 by Texas Instruments

DRA788BSGABFQ1

Texas Instruments

The Texas Instruments DRA788BSGABFQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level. The package style is GRID ARRAY, FINE PITCH with 367 terminals in PLASTIC/EPOXY material.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

DRA788BSGABFRQ1 by Texas Instruments

DRA788BSGABFRQ1

Texas Instruments

The Texas Instruments DRA788BSGABFRQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 screening level.

I2C(2), SPI(4), UART(3),

32 MHz

32

S-PBGA-B367

e1

15 mm

3

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA167,22X22,26

SQUARE

GRID ARRAY, FINE PITCH

250

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MICROPROCESSOR CIRCUIT

ADSP-21584KBCZ-5A by Analog Devices

ADSP-21584KBCZ-5A

Analog Devices

ADSP-21584KBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz. It has a low profile GRID ARRAY package suitable for SPI and UART bus compatibility applications. With a supply voltage range of 1.05V to 1.15V, it can operate in temperatures from 0 °C to 70°C.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584BBCZ-5A by Analog Devices

ADSP-21584BBCZ-5A

Analog Devices

ADSP-21584BBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-21584CBCZ-5A by Analog Devices

ADSP-21584CBCZ-5A

Analog Devices

ADSP-21584CBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 95 °C) with low profile GRID ARRAY package style. Ideal for applications requiring high-speed processing and communication capabilities.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584KBCZ-5A by Analog Devices

ADSP-SC584KBCZ-5A

Analog Devices

ADSP-SC584KBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC has a grid array package style with 349 terminals for various applications.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587KBCZ-5B by Analog Devices

ADSP-SC587KBCZ-5B

Analog Devices

ADSP-SC587KBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, with a supply voltage range of 1.05V to 1.15V. This low profile, fine pitch IC has a grid array package style and is ideal for commercial applications requiring high-speed processing capabilities.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC587BBCZ-5B by Analog Devices

ADSP-SC587BBCZ-5B

Analog Devices

ADSP-SC587BBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz clock frequency. It has a low profile GRID ARRAY package suitable for industrial applications like SPI and UART bus compatibility. With a temperature range of -40 to 85 °C, it's ideal for various embedded system designs.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589KBCZ-5B by Analog Devices

ADSP-SC589KBCZ-5B

Analog Devices

ADSP-SC589KBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, suitable for SPI and UART bus compatibility. It operates b/w 0 to 70 °C, has a low profile GRID ARRAY package style, and features a CMOS technology. Ideal for applications requiring high-speed processing in commercial-grade environments.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC589BBCZ-5B by Analog Devices

ADSP-SC589BBCZ-5B

Analog Devices

ADSP-SC589BBCZ-5B by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) and has 349 terminals in a low profile grid array package for various applications.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584BBCZ-5A by Analog Devices

ADSP-SC584BBCZ-5A

Analog Devices

ADSP-SC584BBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 500 MHz clock frequency, SPI and UART bus compatibility. It operates in industrial temperature range (-40 to 85 °C) with low profile package style (1.5 mm height) for various applications requiring high-speed processing.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

ADSP-SC584CBCZ-5A by Analog Devices

ADSP-SC584CBCZ-5A

Analog Devices

ADSP-SC584CBCZ-5A by Analog Devices is a MICROPROCESSOR CIRCUIT with 349 terminals, operating at up to 500 MHz. It has SPI and UART bus compatibility, suitable for INDUSTRIAL applications requiring low profile, fine pitch GRID ARRAY package style.

SPI; UART

500 MHz

S-PBGA-B349

19 mm

3

349

95 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.5 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

19 mm

MICROPROCESSOR CIRCUIT

10AS057K2F40E1HG by Intel

10AS057K2F40E1HG

Intel

10AS057K2F40E1HG by Intel is a Square GRID ARRAY package with 1517 terminals, operating b/w 0-100°C. It features SoC technology from TSMC, with a terminal pitch of 1mm. Ideal for applications requiring high-performance computing in compact spaces.

S-PBGA-B1517

40 mm

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA1517,39X39,40

SQUARE

GRID ARRAY

3.5 mm

YES

TSMC

BALL

1 mm

BOTTOM

40 mm

SoC

MIMX8DX2AVLFZAC by NXP Semiconductors

MIMX8DX2AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8DX2AVOFZAC by NXP Semiconductors

MIMX8DX2AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8DX5AVLFZAC by NXP Semiconductors

MIMX8DX5AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX2AVLFZAC by NXP Semiconductors

MIMX8QX2AVLFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8QX2AVLFZAC is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C and has a supply voltage range of 1.05-1.15 V, making it ideal for automotive applications requiring high performance in a compact GRID ARRAY package.

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX2AVOFZAC by NXP Semiconductors

MIMX8QX2AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8QX1AVLFZAC by NXP Semiconductors

MIMX8QX1AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8QX5AVLFZAC by NXP Semiconductors

MIMX8QX5AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

e2

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

MIMX8DX1AVOFZAC by NXP Semiconductors

MIMX8DX1AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8QX1AVOFZAC by NXP Semiconductors

MIMX8QX1AVOFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B417

17 mm

3

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.73 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

SYSTEM ON CHIP

MIMX8DX1AVLFZAC by NXP Semiconductors

MIMX8DX1AVLFZAC

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 609; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B609

21 mm

3

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.52 mm

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

21 mm

SYSTEM ON CHIP

XAZU7EV-1FBVB900I by Xilinx

XAZU7EV-1FBVB900I

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;

CAN, I2C, SPI, UART

0

S-PBGA-B900

e1

31 mm

4

900

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

245

2.97 mm

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

XAZU7EV-1FBVB900Q by Xilinx

XAZU7EV-1FBVB900Q

Xilinx

Xilinx XAZU7EV-1FBVB900Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in automotive grade temperature range (-40 to 125 °C) and supports CAN, I2C, SPI, UART bus compatibility. The package has 900 terminals in a GRID ARRAY style suitable for surface mount applications.

CAN, I2C, SPI, UART

0

S-PBGA-B900

e1

31 mm

4

900

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

GRID ARRAY

245

2.97 mm

.85 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

31 mm

MICROPROCESSOR CIRCUIT

AGFA006R16A3E3V by Intel

AGFA006R16A3E3V

Intel

AGFA006R16A3E3V by Intel is a rectangular-shaped SoC FPGA with 1546 terminals. It operates b/w 0°C to 100°C and is surface mountable. This IC is commonly used in various applications requiring other function uPs, uCs, and peripheral integration.

R-PBGA-B1546

1546

100 Cel

0 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA

AGFA006R16A2E3V by Intel

AGFA006R16A2E3V

Intel

Intel AGFA006R16A2E3V is a SoC FPGA with 1546 terminals, operating from 0 to 100°C. It features plastic/epoxy body material, rectangular shape, and ball terminal form. Ideal for applications requiring high-performance computing in compact designs.

R-PBGA-B1546

1546

100 Cel

0 Cel

PLASTIC/EPOXY

RECTANGULAR

YES

BALL

BOTTOM

SoC FPGA

MIMXRT106ACVL5B by NXP Semiconductors

MIMXRT106ACVL5B

NXP Semiconductors

The NXP Semiconductors MIMXRT106ACVL5B is a low-profile, fine-pitch SoC with 196 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.15V to 1.26V. Ideal for applications requiring high-performance uPs and uCs in compact designs.

S-PBGA-B196

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

BALL

.65 mm

BOTTOM

40

10 mm

SoC

MIMXRT1062CVL5B by NXP Semiconductors

MIMXRT1062CVL5B

NXP Semiconductors

The NXP Semiconductors MIMXRT1062CVL5B is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.15-1.26V. Ideal for applications requiring high-performance microcontrollers in compact designs.

S-PBGA-B196

e1

10 mm

3

196

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.43 mm

1.26 V

1.15 V

YES

CMOS

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

40

10 mm

SoC

MIMX8MM5DVTLZCA by NXP Semiconductors

MIMX8MM5DVTLZCA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

Tin/Silver (Sn/Ag)

BALL

.5 mm

BOTTOM

40

14 mm

SoC

MIMX8MM5DVTLZDA by NXP Semiconductors

MIMX8MM5DVTLZDA

NXP Semiconductors

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B486

e2

14 mm

3

486

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA486,27X27,20

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.25 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

Tin/Silver (Sn/Ag)

BALL

.5 mm

BOTTOM

40

14 mm

SoC

LS1043ASE7MNLB by NXP Semiconductors

LS1043ASE7MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN7MNLB by NXP Semiconductors

LS1043ASN7MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B621

e1

21 mm

3

621

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA621,25X25,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

21 mm

SYSTEM ON CHIP

LS1043ASN8KNLB by NXP Semiconductors

LS1043ASN8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8KNLB by NXP Semiconductors

LS1043ASE8KNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP

LS1043ASE8MNLB by NXP Semiconductors

LS1043ASE8MNLB

NXP Semiconductors

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

S-PBGA-B780

e1

23 mm

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

SYSTEM ON CHIP