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MCIMX286DVM4BR

NXP Semiconductors

MCIMX286DVM4BR by NXP Semiconductors

MCIMX286DVM4BR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -20 to 70 °C and has a supply voltage range of 1.35-1.55 V, making it ideal for low-power applications in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,095 parts In-Stock

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Digiode

USA . 1,110 parts In-Stock

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Flip Electronics

USA . 1,000 parts In-Stock

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Anansix

USA . 146 parts In-Stock

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Nova Conductors

Japan . 16 parts In-Stock

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One Stop Electronics

USA . 1,435 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 866 parts In-Stock

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$9.305

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$14.391

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$13.240

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$12.406

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Ampacity Inc.

Singapore . 670 parts In-Stock

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$28.000

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Corohmni

South Africa . 102 parts In-Stock

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$46.184

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Aztec Data Supply Inc.

USA . 4,890 parts In-Stock

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UNI Independent Distributors

Spain . 2,436 parts In-Stock

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Microchip USA

USA . 2,059 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 800 parts In-Stock

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Continental Prestige Electronics

USA . 321 parts In-Stock

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Argo Parts USA

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Overview

Discover the innovative MCIMX286DVM4BR by NXP Semiconductors, a cutting-edge product in the category of Other Function uPs,uCs & Peripheral ICs. With a focus on quality and reliability, NXP Semiconductors delivers unmatched value to customers looking for top-tier technology solutions. Ideal for a wide range of applications, this product offers superior performance and efficiency, making it a must-have for those seeking to stay ahead in today's fast-paced technological landscape. Choose NXP Semiconductors for excellence you can trust.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is durable and lightweight, making the product suitable for a wide range of applications.

Surface Mount:

YES - The surface mount feature allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage:

1.55 V - With a high maximum supply voltage, this product can handle a wide range of power inputs.

Package Shape:

SQUARE - The square shape of the package makes it easier to design and integrate into circuit layouts.

No. of Terminals:

289 - The high number of terminals allows for a greater level of connectivity and functionality.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH - This package style offers a compact and efficient design for space-constrained applications.

Minimum Supply Voltage:

1.35 V - The low minimum supply voltage enables efficient power usage and operation.

Maximum Operating Temperature:

70 °C - The high operating temperature range ensures reliable performance in various environments.

Minimum Operating Temperature:

20 °C - The wide temperature range allows for usage in both hot and cold conditions.

Terminal Finish:

TIN SILVER COPPER - The terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position:

BOTTOM - The bottom terminal position facilitates easy installation and connectivity.

Maximum Seated Height:

1.37 mm - The low seated height minimizes space requirements and allows for compact designs.

Width:

14 mm - The compact width makes the product suitable for applications with limited space.

Maximum Time At Peak Reflow Temperature (s):

40 - This spec indicates the optimal reflow process timing for consistent performance.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures secure solder connections for reliability.

Length:

14 mm - The short length of the product makes it suitable for compact electronic devices.

Temperature Grade:

COMMERCIAL - This temperature grade indicates the product's suitability for standard commercial applications.

Peripheral IC Type:

SYSTEM ON CHIP - The system-on-chip design integrates multiple functions on a single chip for enhanced efficiency.

Technology:

CMOS - The CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form:

BALL - The ball terminal form provides secure connections and facilitates reliable data transmission.

Nominal Supply Voltage:

1.45 V - The nominal supply voltage ensures stable and efficient power usage for the product.

Terminal Pitch:

0.8 mm - The small terminal pitch allows for high-density and compact PCB designs.

Moisture Sensitivity Level (MSL):

3 - This MSL level indicates the product's resistance to moisture and humidity, ensuring durability in harsh conditions.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MCIMX286DVM4BR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

Additional Features:

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

289

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.37 mm

Maximum Supply Voltage:

1.55 V

Minimum Supply Voltage:

1.35 V

Nominal Supply Voltage:

1.45 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MCIMX286DVM4BR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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