Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Texas Instruments DRA788BSGABFQ1 is a MICROPROCESSOR CIRCUIT with 32-bit External Data Bus Width and 32 MHz Max Clock Frequency. Ideal for automotive applications, it operates b/w -40 to 125 °C with AEC-Q100 Screening Level. The package style is GRID ARRAY, FINE PITCH with 367 terminals in PLASTIC/EPOXY material.
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Corphita
Microchip USA
PLASTIC/EPOXY material provides durability and protection for the internal components of the product, making it suitable for various applications.
Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs during production.
The high maximum supply voltage ensures stable and reliable operation of the product under varying voltage conditions.
AEC-Q100 screening level guarantees the product's reliability and performance in automotive applications where stringent quality standards are required.
The square package shape optimizes space utilization on the PCB, allowing for compact and efficient design implementations.
High number of terminals enable versatile connectivity options and support complex circuit configurations, enhancing the product's functionality.
Grid array fine pitch package style facilitates precise component placement and soldering, ensuring high performance and reliability in operation.
Low minimum supply voltage requirement allows for energy-efficient operation and supports battery-powered applications with extended battery life.
High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions or applications with elevated temperatures.
Wide range of minimum operating temperature support enables the product to function effectively in extreme cold environments or industrial settings with low temperatures.
TIN SILVER COPPER terminal finish provides excellent conductivity and corrosion resistance, ensuring long-lasting performance and reliability of the product.
Bottom terminal position facilitates easy and secure soldering onto the PCB, enhancing the product's manufacturability and durability.
Low maximum seated height allows for compact PCB design configurations with reduced overall product size and footprint.
15 mm width dimension enables easy integration and placement of the product in various electronic devices or systems with space constraints.
32-bit external data bus width supports high-speed data processing and communication, enhancing the product's performance and efficiency.
High maximum clock frequency capability allows for fast data processing and execution of instructions, contributing to overall system speed and performance.
30 seconds maximum time at peak reflow temperature ensures proper soldering and reliability during the manufacturing process.
Peak reflow temperature of 250°C supports reliable and durable solder joints, ensuring long-term performance and stability of the product.
15 mm length dimension allows for versatile placement and integration of the product in different electronic systems or devices.
Automotive temperature grade rating signifies the product's suitability for automotive applications with stringent temperature requirements and reliability standards.
Microprocessor circuit peripheral IC type offers advanced computational capabilities and processing power, making the product ideal for complex applications.
CMOS technology provides low power consumption and high speed performance, enhancing the product's energy efficiency and processing capabilities.
Ball terminal form ensures secure and reliable connections for efficient data transmission and communication, contributing to the product's overall reliability and performance.
Stable nominal supply voltage of 1.06 V supports consistent and reliable operation of the product across various operating conditions and power inputs.
Support for I2C, SPI, and UART bus interfaces expands the product's connectivity options and compatibility with a wide range of external devices and peripherals.
0.65 mm terminal pitch allows for precise and efficient soldering onto the PCB, ensuring secure connections and stable performance of the product.
MSL 3 rating indicates the product's resistance to moisture and humidity, making it suitable for use in various environmental conditions without compromising performance.
Other Function uPs,uCs & Peripheral ICs DRA788BSGABFQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments
Bus Compatibility:
Maximum Clock Frequency:
External Data Bus Width:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Screening Level:
Maximum Seated Height:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
DRA788BSGABFQ1 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
1N4148WS
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Vishay Semiconductors
BSS138
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
Silicon Standard
BAV99LT1G
Onsemi
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
1N4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
KYOCERA AVX
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
Yangzhou Yangjie Electronics
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS2J03C
Idec
ROTARY SWITCH;
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
EFR32BG24B210F1024IM48-B
Silicon Labs
EFR32BG24B210F1024IM48-B by Silicon Labs is a SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. With 48 terminals in a square package, it's ideal for IoT and wireless applications.
SCANSTA111MTX/NOPB
National Semiconductor
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR;
STSPIN32F0
STMicroelectronics
STSPIN32F0 by STMicroelectronics is a 48-terminal IC with a supply voltage range of 8-45V. This MICROPROCESSOR CIRCUIT operates in automotive-grade temperatures (-40 to 125°C) and features CMOS technology. Ideal for applications requiring high-performance motor control in compact spaces.
ST33HTPH2E28AHD0
ST33HTPH2E28AHD0 by STMicroelectronics is a 28-terminal IC with CMOS technology, operating b/w -40 to 105°C. It's a cryptographic authenticator with 1.8V supply voltage, suitable for secure applications requiring compact design and surface mount compatibility.
SLB9670XQ20FW762XUMA1
Infineon Technologies
SLB9670XQ20FW762XUMA1 by Infineon Technologies is a cryptographic authenticator with CMOS technology. It has a package style of chip carrier, heat sink/slug, and very thin profile. With a max supply voltage of 1.95V, it is suitable for industrial applications requiring secure authentication.
HS103
Nel Frequency Controls
Other uPs/uCs/Peripheral ICs;
ESP32-S3-WROOM-1U-N8R2
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1U-N8R2 by Espressif Systems is a SoC with 41 terminals, operating at 3.3V, suitable for applications requiring a max supply voltage of 3.6V. With dimensions of 18mm x 19.2mm and CMOS technology, it can operate in temperatures ranging from -40°C to 85°C, making it ideal for compact IoT devices.
XCZU4CG-1FBVB900E
Xilinx
XCZU4CG-1FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 900 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. With a supply voltage range of 0.825-0.876 V, it's ideal for applications requiring high-performance processing capabilities in various electronic devices.
AR1100-I/SS
Microchip Technology
Microchip AR1100-I/SS is a CMOS microprocessor circuit with 20 terminals, operating at -40 to 85°C. It has a supply voltage range of 3.135V to 3.465V and is suitable for industrial applications requiring small outline, shrink pitch packages.
MGM210PA32JIA2R
SYSTEM ON CHIP;
A2F200M3F-CSG288I
Actel
SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.425 V;
ATWINC1500-MR210PB1140
ATWINC1500-MR210PB1140 by Microchip operates at 3-4.2V, with temp range -40 to 85°C. It's a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in compact spaces.
XCZU7EV-3FFVC1156I
XCZU7EV-3FFVC1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage of 0.9 V. This GRID ARRAY package is ideal for industrial applications requiring high performance in a compact form factor.
FT245RQ
FTDI
FT245RQ by FTDI is a 32-terminal peripheral IC with USB bus compatibility. It operates at 3.3-5.25V, -40 to 85°C, and supports an 8-bit external data bus width with a clock frequency of up to 12.02MHz. Ideal for industrial applications requiring microprocessor circuits in compact square chip carrier packages.
STSPIN32F0A
STSPIN32F0A by STMicroelectronics is a 48-terminal, CMOS technology microprocessor circuit with a supply voltage range of 6.7V to 45V. Ideal for automotive applications, it operates b/w -40°C to 125°C and comes in a square chip carrier package style with no lead terminals.
ESP32-S3-WROOM-1U-N4R8
ESP32-S3-WROOM-1U-N4R8 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40°C to 65°C, with supply voltage ranging from 3V to 3.6V. Ideal for IoT devices due to its compact size (18mm x 19.2mm) and surface-mount capability.
ESP32-WROOM-32UE-N4
ESP32-WROOM-32UE-N4 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage range of 3-3.6V. Ideal for IoT applications due to its compact size and surface mount capability.
XC7Z020-2CLG484E
The Xilinx XC7Z020-2CLG484E is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage range of 0.95-1.05V. With 484 terminals in a low profile grid array package, it's ideal for various embedded applications requiring high-performance processing capabilities.
XC7Z045-2FFG900I
The Xilinx XC7Z045-2FFG900I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it's ideal for applications requiring high-performance processing in compact spaces.
DS28CM00R-A00+T
Maxim Integrated
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
DRV8316RRGFR
Texas Instruments
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRA756BPGABCQ1
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;
DRA751BLGABCRQ1
DRA746APGABCQ1
MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: UNSPECIFIED;
DRA755BLGABCRQ1
DRA752BPGABCRQ1
DRA750BJGABCRQ1
DRA756BPGABCRQ1
MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Screening Level: AEC-Q100; Terminal Finish: TIN SILVER COPPER; Technology: CMOS; Moisture Sensitivity Level (MSL): 3;
DRA744BJGABCRQ1
DRA752BPGABCQ1
DRA746BPGABCQ1
DRA755BLGABCQ1
DRA754BJGABCQ1
DRA750BJGABCQ1
DRA756
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
DRA745BLGABCRQ1
DRA751BLGABCQ
DRA744BJGABCQ1
DRA745BLGABCQ1
DRA746BPGABCRQ1
DRA754BJGABCRQ1
Supply Digital Components
$106.00
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12,000 In-Stock
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