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DRA746APGABCQ1

Texas Instruments

DRA746APGABCQ1 by Texas Instruments

DRA746APGABCQ1 by Texas Instruments is an AEC-Q100 compliant microprocessor circuit with 760 terminals in a grid array package. It operates at a speed of 1500 rpm, suitable for automotive applications due to its CMOS technology and tin silver copper terminal finish. The device can withstand peak reflow temperatures up to 250°C for 30 seconds, making it ideal for automotive electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,626 parts In-Stock

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Vyrian

USA . 2,172 parts In-Stock

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2,172

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Distributors (Availability)

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Native Components

USA . 951 parts In-Stock

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$0.196

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$0.188

951

$0.196

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$0.188

Northwest PG Solutions

USA . 968 parts In-Stock

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$0.215

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$0.190

968

$0.215

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$0.190

AZTECH Wire

Italy . 278 parts In-Stock

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$14.903

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278

$14.903

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One Stop Electronics

USA . 314 parts In-Stock

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$20.000

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314

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Parana Technologies

USA . 1,277 parts In-Stock

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$35.062

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$35.062

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ChromeModa Solutions

Germany . 6,567 parts In-Stock

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$39.396

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$32.305

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$39.396

$32.305

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IDEA Electronic Components Group

UK . 1,597 parts In-Stock

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$39.396

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$37.426

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$35.456

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Corohmni

South Africa . 66 parts In-Stock

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$64.460

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66

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Component Stockers USA

USA . 587 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 5,855 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,903 parts In-Stock

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Corphita

USA . 3,254 parts In-Stock

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Microchip USA

USA . 1,931 parts In-Stock

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1,931

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DigiPath Technology Company

USA . 1,747 parts In-Stock

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$35.519

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1,747

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$35.519

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Overview

Experience the superior quality and reliability of Texas Instruments with the DRA746APGABCQ1. This high-performance peripheral IC is designed for automotive applications, offering unmatched value and benefits to customers. With a robust package body material and advanced technology, this product ensures optimal performance in demanding environments. Trust Texas Instruments to deliver cutting-edge solutions for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for automotive applications where weight and reliability are crucial.

Surface Mount: YES

Easy to integrate into PCBs, saving space and reducing assembly time.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, ensuring quality and longevity.

No. of Terminals: 760

Provides a large number of connection points for complex circuitry and functionality.

Package Style (Meter): GRID ARRAY

Grid array packaging offers high interconnect density, enabling efficient signal routing and reducing signal interference.

Terminal Finish: TIN SILVER COPPER

Combination of finishes provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access and maintenance during PCB assembly and testing.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time helps prevent overheating and ensures component reliability during PCB assembly.

Peak Reflow Temperature °C: 250

High peak reflow temperature ensures proper soldering and component bonding for robust performance in automotive environments.

Temperature Grade: AUTOMOTIVE

Designed to operate reliably in automotive temperature ranges, providing stable performance in harsh conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit integrates multiple functions, enhancing processing capabilities and efficiency in automotive applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds for efficient operation.

Terminal Form: BALL

Ball terminals provide reliable connections and facilitate fine pitch mounting, contributing to overall product reliability.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate sensitivity to moisture, requiring proper handling and storage to maintain component integrity.

Speed: 1500 rpm

High speed capability enables fast data processing and response times, essential for advanced automotive functionality.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DRA746APGABCQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

X-PBGA-B760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Speed:

1500 rpm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

DRA746APGABCQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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