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DRA756

Texas Instruments

DRA756 by Texas Instruments

The Texas Instruments DRA756 is a CMOS microprocessor circuit with 760 terminals in a grid array package. It features surface mount technology and plastic/epoxy body material. Ideal for high-performance computing applications requiring advanced processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,130 parts In-Stock

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6,130

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Digiode

USA . 3,544 parts In-Stock

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3,544

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 51 parts In-Stock

1+ parts

$10.468

100+ parts

-

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51

$10.468

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Northwest PG Solutions

USA . 850 parts In-Stock

1+ parts

$11.515

100+ parts

$10.363

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-

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850

$11.515

$10.363

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One Stop Electronics

USA . 243 parts In-Stock

1+ parts

$12.000

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-

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243

$12.000

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Corohmni

South Africa . 255 parts In-Stock

1+ parts

$15.024

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255

$15.024

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AZTECH Wire

Italy . 409 parts In-Stock

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$19.541

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409

$19.541

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Parana Technologies

USA . 1,531 parts In-Stock

1+ parts

$30.946

100+ parts

-

1k+ parts

$69.841

10k+ parts

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1,531

$30.946

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$69.841

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DigiPath Technology Company

USA . 966 parts In-Stock

1+ parts

$34.076

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966

$34.076

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ChromeModa Solutions

Germany . 2,394 parts In-Stock

1+ parts

$34.771

100+ parts

$28.512

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2,394

$34.771

$28.512

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IDEA Electronic Components Group

UK . 1,438 parts In-Stock

1+ parts

$34.771

100+ parts

$33.032

1k+ parts

$31.294

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1,438

$34.771

$33.032

$31.294

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Corphita

USA . 1,501 parts In-Stock

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1,501

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Overview

Unleash the power of innovation with the DRA756 by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. The DRA756 is a versatile microprocessor circuit that opens up endless possibilities for your projects. With its cutting-edge technology and 760 terminals, this device is perfect for a wide range of applications. Experience seamless performance and reliability with the DRA756, providing unmatched value and benefits to customers looking to take their designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good mechanical strength and low cost, making the product durable and affordable.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and effort during production.

Package Shape: SQUARE

The square package shape provides a compact footprint on the PCB, saving space and allowing for denser circuit designs.

No. of Terminals: 760

With a large number of terminals, this product can support complex circuit connections and functionalities.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance and electrical connectivity, improving overall product reliability.

Terminal Position: BOTTOM

Bottom terminal position allows for better heat dissipation and easier soldering during assembly.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

A microprocessor circuit offers advanced processing capabilities, making the product suitable for a wide range of applications requiring complex computing tasks.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, resulting in energy-efficient and reliable performance.

Terminal Form: BALL

The ball terminal form enables better electrical connections and signal transmission, ensuring stable and efficient operation of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DRA756 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

No. of Terminals:

760

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

DRA756 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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