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DRA746BPGABCQ1

Texas Instruments

DRA746BPGABCQ1 by Texas Instruments

The Texas Instruments DRA746BPGABCQ1 is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus Width, operating at up to 32 MHz clock frequency. Designed for AUTOMOTIVE applications, it features a package style of GRID ARRAY and supports CAN, I2C, SPI, UART, and USB bus compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,081 parts In-Stock

1+ parts

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5,081

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Digiode

USA . 2,771 parts In-Stock

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2,771

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 411 parts In-Stock

1+ parts

$1.510

100+ parts

-

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411

$1.510

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Northwest PG Solutions

USA . 1,425 parts In-Stock

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$1.661

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$1.661

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One Stop Electronics

USA . 338 parts In-Stock

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$7.000

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338

$7.000

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AZTECH Wire

Italy . 565 parts In-Stock

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$16.609

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565

$16.609

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Parana Technologies

USA . 1,399 parts In-Stock

1+ parts

$36.773

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1,399

$36.773

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Corohmni

South Africa . 3,146 parts In-Stock

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$40.221

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3,146

$40.221

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DigiPath Technology Company

USA . 1,712 parts In-Stock

1+ parts

$40.492

100+ parts

$37.252

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1,712

$40.492

$37.252

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ChromeModa Solutions

Germany . 1,477 parts In-Stock

1+ parts

$41.318

100+ parts

$33.881

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1,477

$41.318

$33.881

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IDEA Electronic Components Group

UK . 449 parts In-Stock

1+ parts

$41.318

100+ parts

$39.252

1k+ parts

$37.186

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449

$41.318

$39.252

$37.186

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Microchip USA

USA . 1,492 parts In-Stock

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1,492

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Corphita

USA . 1,464 parts In-Stock

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Overview

Experience the cutting-edge technology of the DRA746BPGABCQ1 by Texas Instruments, a top-of-the-line microprocessor circuit that offers unparalleled performance and reliability. Designed with automotive applications in mind, this grid array IC boasts a wide range of bus compatibility options including CAN, I2C, SPI, UART, and USB. With a maximum clock frequency of 32 MHz and a temperature grade suited for automotive environments, this versatile component is a game-changer in the industry. Trust in Texas Instruments' reputation for quality and innovation, and elevate your projects to new heights with the DRA746BPGABCQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and can withstand harsh conditions, making this product suitable for automotive applications.

Surface Mount: YES

Surface mount packaging allows for easier and more efficient assembly, saving time and cost during production.

Maximum Supply Voltage: 1.2 V

The maximum supply voltage of 1.2V ensures safe operation and protects the components from damage.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows for reliable performance even in hot environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DRA746BPGABCQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

CAN; I2C; SPI; UART; USB

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

DRA746BPGABCQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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