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DRA752BPGABCQ1

Texas Instruments

DRA752BPGABCQ1 by Texas Instruments

DRA752BPGABCQ1 by Texas Instruments is a MICROPROCESSOR CIRCUIT with 760 terminals in a GRID ARRAY, FINE PITCH package. It operates b/w -40 to 125 °C and has a supply voltage range of 1.11V to 1.2V, making it ideal for AUTOMOTIVE applications requiring high performance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,219 parts In-Stock

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5,219

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Digiode

USA . 579 parts In-Stock

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579

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Distributors (Availability)

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One Stop Electronics

USA . 723 parts In-Stock

1+ parts

$1.000

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723

$1.000

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AZTECH Wire

Italy . 474 parts In-Stock

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$16.568

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474

$16.568

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Native Components

USA . 183 parts In-Stock

1+ parts

$39.674

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$38.087

183

$39.674

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$38.087

Parana Technologies

USA . 1,458 parts In-Stock

1+ parts

$42.131

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1,458

$42.131

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Northwest PG Solutions

USA . 406 parts In-Stock

1+ parts

$43.641

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406

$43.641

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DigiPath Technology Company

USA . 1,939 parts In-Stock

1+ parts

$46.391

100+ parts

$42.680

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1,939

$46.391

$42.680

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IDEA Electronic Components Group

UK . 2,106 parts In-Stock

1+ parts

$47.338

100+ parts

$44.971

1k+ parts

$42.604

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2,106

$47.338

$44.971

$42.604

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ChromeModa Solutions

Germany . 1,488 parts In-Stock

1+ parts

$47.338

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$38.817

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1,488

$47.338

$38.817

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Corohmni

South Africa . 488 parts In-Stock

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$69.584

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488

$69.584

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Corphita

USA . 4,212 parts In-Stock

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Overview

Experience the power of innovation with the DRA752BPGABCQ1 by Texas Instruments. As a leader in the industry, Texas Instruments offers top-notch quality and reliability in their products. This microprocessor circuit is versatile and ideal for automotive applications, providing customers with exceptional performance and efficiency. With a focus on cutting-edge technology and precision engineering, this product delivers value, benefits, and advantages that exceed expectations. Trust Texas Instruments to deliver excellence in every aspect of your project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to heat and chemicals, making this product suitable for various harsh environments.

Surface Mount: YES

Surface mount technology allows for easy installation and reduces the overall size of the product, making it ideal for compact electronic devices.

Maximum Supply Voltage: 1.2 V

With a maximum supply voltage of 1.2V, this product can operate efficiently within low voltage power systems, reducing power consumption.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this product suitable for automotive applications where reliability is crucial.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, making it ideal for compact electronic designs.

No. of Terminals: 760

Having a large number of terminals allows for more connectivity options and functionality, making this product versatile for a wide range of applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables high-density mounting on circuit boards, making this product suitable for complex electronic systems.

Minimum Supply Voltage: 1.11 V

The low minimum supply voltage of 1.11V allows for efficient operation even at low power levels, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in extreme temperature conditions, making this product suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for operation in cold environments without compromising performance, increasing the product's versatility.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly, enhancing the overall efficiency and ease of installation.

Maximum Seated Height: 2.96 mm

The low maximum seated height of 2.96mm saves space on the PCB and allows for compact designs, making this product suitable for applications with space constraints.

Width: 23 mm

The compact width of 23mm enables efficient placement on PCBs and allows for high-density integration, enhancing the product's versatility.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during the manufacturing process, reducing the risk of defects.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250°C ensures effective soldering and joint quality, resulting in reliable connections and long-term performance.

Length: 23 mm

The compact length of 23mm allows for space-saving designs and efficient placement on PCBs, making this product suitable for compact electronic devices.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that the product can withstand the temperature fluctuations and harsh conditions typically found in automotive environments, making it a reliable choice for automotive applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced computing capabilities and processing power, making it suitable for sophisticated electronic applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in various operating conditions.

Terminal Form: BALL

The ball terminal form provides reliable connections and allows for easy installation and replacement, making this product user-friendly and versatile.

Nominal Supply Voltage: 1.15 V

The nominal supply voltage of 1.15V provides a stable power source for the product, ensuring consistent and reliable operation under varying load conditions.

Terminal Pitch: 0.8 mm

The narrow terminal pitch of 0.8mm enables high-density mounting on PCBs and efficient use of space, making this product suitable for compact electronic designs.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this product is moderately sensitive to moisture during storage and handling, requiring standard precautions to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DRA752BPGABCQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

DRA752BPGABCQ1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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