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DRA746BPGABCRQ1

Texas Instruments

DRA746BPGABCRQ1 by Texas Instruments

The Texas Instruments DRA746BPGABCRQ1 is a MICROPROCESSOR CIRCUIT with 64-bit External Data Bus, operating at up to 32 MHz. Designed for AUTOMOTIVE applications, it features a max supply voltage of 1.2 V and can withstand temperatures from -40 to 125 °C. This IC supports CAN, I2C, SPI, UART, and USB bus compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,198 parts In-Stock

1+ parts

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6,198

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Digiode

USA . 2,048 parts In-Stock

1+ parts

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2,048

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 995 parts In-Stock

1+ parts

$0.240

100+ parts

-

1k+ parts

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10k+ parts

$0.230

995

$0.240

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-

$0.230

Northwest PG Solutions

USA . 340 parts In-Stock

1+ parts

$0.264

100+ parts

-

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-

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$0.233

340

$0.264

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$0.233

One Stop Electronics

USA . 263 parts In-Stock

1+ parts

$12.000

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-

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263

$12.000

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AZTECH Wire

Italy . 313 parts In-Stock

1+ parts

$13.963

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313

$13.963

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Parana Technologies

USA . 2,279 parts In-Stock

1+ parts

$24.630

100+ parts

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$25.296

10k+ parts

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2,279

$24.630

-

$25.296

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ChromeModa Solutions

Germany . 2,468 parts In-Stock

1+ parts

$27.674

100+ parts

$22.693

1k+ parts

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2,468

$27.674

$22.693

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IDEA Electronic Components Group

UK . 2,169 parts In-Stock

1+ parts

$27.674

100+ parts

$26.290

1k+ parts

$24.907

10k+ parts

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2,169

$27.674

$26.290

$24.907

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Corohmni

South Africa . 412 parts In-Stock

1+ parts

$42.000

100+ parts

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412

$42.000

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Microchip USA

USA . 4,716 parts In-Stock

1+ parts

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4,716

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DigiPath Technology Company

USA . 1,219 parts In-Stock

1+ parts

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100+ parts

$24.951

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1,219

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$24.951

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Corphita

USA . 92 parts In-Stock

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92

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Overview

Discover the cutting-edge DRA746BPGABCRQ1 by Texas Instruments, a top-tier manufacturer known for quality and innovation. This versatile product falls under the category of Other Function uPs, uCs & Peripheral ICs, making it a crucial component for various applications. With its advanced features and high performance, this product offers unbeatable value and benefits to customers. Experience seamless operation and enhanced efficiency with the DRA746BPGABCRQ1, designed to meet your needs with precision and reliability. Trust Texas Instruments to deliver excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the integrated circuits inside, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost during manufacturing processes.

Maximum Supply Voltage: 1.2 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product energy-efficient.

Screening Level: AEC-Q100

AEC-Q100 screening ensures automotive-grade quality, reliability, and performance, making the product suitable for automotive applications.

Package Shape: SQUARE

Square package shape offers efficient use of PCB space and enables easy alignment during assembly, optimizing overall design layout.

No. of Terminals: 760

High number of terminals allow for connectivity with numerous external components, expanding the product's functionality and versatility.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch package style provides excellent connectivity and signal transmission capabilities, enhancing overall performance.

Minimum Supply Voltage: 1.11 V

Low minimum supply voltage ensures stable operation even under low power conditions, improving reliability in critical applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range allows the product to withstand harsh environmental conditions, ensuring consistent performance in demanding situations.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range enables the product to function efficiently in extreme cold environments, expanding its usability.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance of the product.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and facilitates efficient heat dissipation, improving overall system reliability and performance.

Maximum Seated Height: 2.96 mm

Low maximum seated height enables compact design integration, saving space and allowing for sleek and slim product designs.

Width: 23 mm

Optimal width size offers compatibility with standard PCB dimensions, making the product easy to integrate into existing electronic systems.

External Data Bus Width: 64

Wide external data bus width allows for high-speed data transfer and processing, enhancing the product's performance in data-intensive applications.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency enables fast data processing and execution speed, improving overall system responsiveness and efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and reliable connections during manufacturing, enhancing product quality and durability.

Peak Reflow Temperature °C: 250

High peak reflow temperature capability allows for efficient soldering and robust mechanical connections, ensuring long-term stability and performance.

Length: 23 mm

Optimal length size offers compatibility with standard PCB dimensions, making the product easy to integrate into existing electronic systems.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures operational reliability and performance in automotive applications, meeting industry standards and requirements.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of a microprocessor circuit enhances the product's computing power and processing capabilities, enabling complex tasks and functions to be performed efficiently.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable for various applications.

Terminal Form: BALL

Ball terminal form offers secure and reliable connections, minimizing the risk of signal loss or interference, ensuring stable performance in demanding environments.

Nominal Supply Voltage: 1.15 V

Stable nominal supply voltage ensures consistent operation and performance under varying load conditions, improving system reliability and longevity.

Bus Compatibility: CAN; I2C; SPI; UART; USB

Compatibility with multiple bus protocols enables seamless integration with various communication interfaces, expanding the product's connectivity and usability.

Terminal Pitch: 0.8 mm

Compact terminal pitch facilitates high-density PCB designs, allowing for more components to be packed in a limited space, enhancing overall system functionality.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates the product's resistance to moisture and humidity, ensuring reliability and performance in damp or humid environments.

Speed: 1500 rpm

Operating at a speed of 1500 rpm provides efficient data processing and system performance, enabling quick response times and seamless operation.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs DRA746BPGABCRQ1 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bus Compatibility:

CAN; I2C; SPI; UART; USB

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Maximum Seated Height:

2.96 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

DRA746BPGABCRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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